JP2019186430A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2019186430A JP2019186430A JP2018077017A JP2018077017A JP2019186430A JP 2019186430 A JP2019186430 A JP 2019186430A JP 2018077017 A JP2018077017 A JP 2018077017A JP 2018077017 A JP2018077017 A JP 2018077017A JP 2019186430 A JP2019186430 A JP 2019186430A
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- Prior art keywords
- coolers
- cooler
- bolt
- semiconductor device
- bolts
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
3、3a、3b、3c:冷却器
4a、4b:連結管
5a、5b:冷媒給排口
6a、6b、56a、56b:ボルト
7、57:ボルト係止部
7a:貫通孔
8、58:雌ネジ部
8a:雌ネジ孔
12:第1流路
13:第2流路
30:半導体モジュール
31:トランジスタ
61:ヘッド
62:圧縮バネ
Claims (3)
- 内部に第1流路が設けられており、一列に配置されている複数の冷却器と、
隣り合う前記冷却器の間に挟まれている半導体モジュールと、
隣り合う前記冷却器を連通しており、複数の前記冷却器と前記半導体モジュールの積層方向に交差する方向で前記半導体モジュールの両側に配置されている一対の連結管と、
を備えており、
前記積層方向の一端に位置する前記冷却器には、前記積層方向に沿ってみたときに一対の前記連結管の夫々と重なるように一対の冷媒給排口が設けられており、
夫々の前記冷媒給排口から前記積層方向の他端に位置する前記冷却器まで延びている第2流路内に、ボルトのヘッドが係止されるボルト係止部が設けられているとともに、前記ボルトが固定される雌ネジ部が設けられており、
前記ボルト係止部と前記雌ネジ部の間の前記冷却器が前記ボルトで固定されている、半導体装置。 - 全ての前記冷却器が前記ボルトで固定されている、請求項1に記載の半導体装置。
- 前記ボルト係止部と前記ヘッドの間に圧縮バネが配置されている、請求項1または2に記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018077017A JP6973256B2 (ja) | 2018-04-12 | 2018-04-12 | 半導体装置 |
US16/375,976 US10777485B2 (en) | 2018-04-12 | 2019-04-05 | Semiconductor device |
CN201910289340.3A CN110379788B (zh) | 2018-04-12 | 2019-04-11 | 半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018077017A JP6973256B2 (ja) | 2018-04-12 | 2018-04-12 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019186430A true JP2019186430A (ja) | 2019-10-24 |
JP6973256B2 JP6973256B2 (ja) | 2021-11-24 |
Family
ID=68162135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018077017A Active JP6973256B2 (ja) | 2018-04-12 | 2018-04-12 | 半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10777485B2 (ja) |
JP (1) | JP6973256B2 (ja) |
CN (1) | CN110379788B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102325110B1 (ko) * | 2017-05-31 | 2021-11-11 | 한온시스템 주식회사 | 전기소자 냉각용 열교환기 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55123154A (en) * | 1979-03-16 | 1980-09-22 | Hitachi Ltd | Liquid cooling type semiconductor device |
JP2009212137A (ja) * | 2008-02-29 | 2009-09-17 | Nissan Motor Co Ltd | 発熱素子の冷却装置 |
JP2014112583A (ja) * | 2012-12-05 | 2014-06-19 | Toyota Motor Corp | 冷却器付き半導体モジュール |
JP2016051724A (ja) * | 2014-08-28 | 2016-04-11 | トヨタ自動車株式会社 | 半導体装置及びその製造方法 |
JP2016127774A (ja) * | 2015-01-08 | 2016-07-11 | トヨタ自動車株式会社 | 電力変換器 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1148547B8 (en) * | 2000-04-19 | 2016-01-06 | Denso Corporation | Coolant cooled type semiconductor device |
JP4038455B2 (ja) * | 2003-08-21 | 2008-01-23 | 三菱電機株式会社 | 半導体装置 |
CN100336212C (zh) * | 2003-09-04 | 2007-09-05 | 珍通科技股份有限公司 | 散热模组 |
JP4525582B2 (ja) | 2005-12-15 | 2010-08-18 | 株式会社デンソー | 電力変換装置 |
JP5115632B2 (ja) * | 2010-06-30 | 2013-01-09 | 株式会社デンソー | 半導体装置 |
JP5609762B2 (ja) | 2011-05-11 | 2014-10-22 | 株式会社デンソー | 電力変換装置 |
EP2929562B1 (en) * | 2012-12-07 | 2021-04-28 | ABB Power Grids Switzerland AG | Semiconductor assembly |
JP6323557B2 (ja) * | 2014-07-17 | 2018-05-16 | 富士電機株式会社 | 半導体装置 |
JP6135623B2 (ja) | 2014-09-02 | 2017-05-31 | トヨタ自動車株式会社 | 半導体装置及びその製造方法 |
JP6197769B2 (ja) * | 2014-09-12 | 2017-09-20 | 株式会社デンソー | 電力変換装置及びその製造方法 |
JP6544221B2 (ja) * | 2015-12-09 | 2019-07-17 | 株式会社デンソー | 電力変換装置 |
JP6635901B2 (ja) * | 2016-09-21 | 2020-01-29 | 本田技研工業株式会社 | 電力変換装置 |
-
2018
- 2018-04-12 JP JP2018077017A patent/JP6973256B2/ja active Active
-
2019
- 2019-04-05 US US16/375,976 patent/US10777485B2/en active Active
- 2019-04-11 CN CN201910289340.3A patent/CN110379788B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55123154A (en) * | 1979-03-16 | 1980-09-22 | Hitachi Ltd | Liquid cooling type semiconductor device |
JP2009212137A (ja) * | 2008-02-29 | 2009-09-17 | Nissan Motor Co Ltd | 発熱素子の冷却装置 |
JP2014112583A (ja) * | 2012-12-05 | 2014-06-19 | Toyota Motor Corp | 冷却器付き半導体モジュール |
JP2016051724A (ja) * | 2014-08-28 | 2016-04-11 | トヨタ自動車株式会社 | 半導体装置及びその製造方法 |
JP2016127774A (ja) * | 2015-01-08 | 2016-07-11 | トヨタ自動車株式会社 | 電力変換器 |
Also Published As
Publication number | Publication date |
---|---|
CN110379788B (zh) | 2022-11-15 |
US10777485B2 (en) | 2020-09-15 |
CN110379788A (zh) | 2019-10-25 |
JP6973256B2 (ja) | 2021-11-24 |
US20190318981A1 (en) | 2019-10-17 |
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