JP2016051874A - 半導体装置及びその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000003475 lamination Methods 0.000 claims abstract 9
- 239000003507 refrigerant Substances 0.000 claims description 28
- 238000004804 winding Methods 0.000 claims description 21
- 238000003466 welding Methods 0.000 claims description 14
- 230000004308 accommodation Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 abstract description 24
- 238000010030 laminating Methods 0.000 abstract description 5
- 239000002826 coolant Substances 0.000 abstract description 3
- 230000008878 coupling Effects 0.000 abstract description 3
- 238000010168 coupling process Methods 0.000 abstract description 3
- 238000005859 coupling reaction Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1076—Shape of the containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1094—Thermal management, e.g. cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
好ましくは、前記積層ユニットには、前記巻付部材の長手方向に沿って延び、前記巻付部材を収容可能な収容溝が形成されている。以上の構成によれば、前記巻付部材の長手方向に対して直交する方向における前記巻付部材の移動を抑制することができる。
好ましくは、前記巻付部材は、前記複数の冷却器に対して溶接されている。以上の構成によれば、前記複数の冷却器間の相対的な位置関係が安定する。
好ましくは、前記巻付部材は金属製の帯であり、前記帯には、前記複数の冷却器と対向する位置に複数の溶接孔が形成されており、前記複数の溶接孔の周縁において、前記帯は前記複数の冷却器に対して溶接されている。以上の構成によれば、前記巻付部材を前記複数の冷却器に対して効率よく固定することができる。
本願発明の第2の観点によれば、複数の半導体モジュールと、冷媒の流路を有する複数の冷却器と、を交互に積層して積層ユニットを形成し、積層方向で隣り合う2つの前記冷却器の間に、前記積層方向で隣り合う2つの前記冷却器の前記流路同士を連結するシール部材を配置した状態で、前記積層ユニットを前記積層方向で加圧し、前記積層ユニットを加圧した状態で前記積層ユニットに巻付部材を巻き付けることで、前記積層ユニットの前記積層方向に加圧された状態を維持する、半導体装置の製造方法が提供される。以上の方法によれば、前記積層ユニットの前記積層方向に加圧された状態を維持する機能を損なうことなく、上記特許文献1のスタッドボルトを省略できるので、前記半導体装置を小型化することができる。
以下、図1〜図6を参照して、半導体スタック1を説明する。半導体スタック1は、インバータやコンバータなどの電力変換装置として機能する半導体装置である。
次に、図7及び図8を参照して、第2実施形態を説明する。以下、本実施形態が上記第1実施形態と異なる点を中心に説明し、重複する説明は適宜省略する。
次に、図9及び図10を参照して、第3実施形態を説明する。以下、本実施形態が上記第2実施形態と異なる点を中心に説明し、重複する説明は適宜省略する。
2 積層ユニット
3 連結シール部材
4 固定用ワイヤー
5 カードシール部材
6 半導体カード
7 冷却器
8 トッププレート
9 ボトムプレート
10 冷媒給排管
12 カード冷却孔
15 溶接片
17 ワイヤー収容溝
P カード冷却流路
Q 冷媒給排流路
Claims (5)
- 複数の半導体モジュールと、冷媒の流路を有する複数の冷却器と、を含み、前記複数の半導体モジュールと前記複数の冷却器を交互に積層して成る積層ユニットと、
積層方向で隣り合う2つの前記冷却器の間に配置され、前記積層方向で隣り合う2つの前記冷却器の前記流路同士を連結するシール部材と、
前記積層ユニットに巻き付けられることにより前記積層ユニットの前記積層方向に加圧された状態を維持する巻付部材と、
備えた半導体装置。 - 前記積層ユニットには、前記巻付部材の長手方向に沿って延び、前記巻付部材を収容可能な収容溝が形成されている、
請求項1に記載の半導体装置。 - 前記巻付部材は、前記複数の冷却器に対して溶接されている、
請求項1又は2に記載の半導体装置。 - 前記巻付部材は金属製の帯であり、
前記帯には、前記複数の冷却器と対向する位置に複数の溶接孔が形成されており、
前記複数の溶接孔の周縁において、前記帯は前記複数の冷却器に対して溶接されている、
請求項3に記載の半導体装置。 - 複数の半導体モジュールと、冷媒の流路を有する複数の冷却器と、を交互に積層して積層ユニットを形成し、
積層方向で隣り合う2つの前記冷却器の間に、前記積層方向で隣り合う2つの前記冷却器の前記流路同士を連結するシール部材を配置した状態で、前記積層ユニットを前記積層方向で加圧し、
前記積層ユニットを加圧した状態で前記積層ユニットに巻付部材を巻き付けることで、前記積層ユニットの前記積層方向に加圧された状態を維持する、
半導体装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2014177932A JP6135623B2 (ja) | 2014-09-02 | 2014-09-02 | 半導体装置及びその製造方法 |
US14/834,858 US9633926B2 (en) | 2014-09-02 | 2015-08-25 | Semiconductor device and manufacturing method of semiconductor device |
CN201510542780.7A CN105390462B (zh) | 2014-09-02 | 2015-08-28 | 半导体装置及半导体装置的制造方法 |
DE102015114341.0A DE102015114341B4 (de) | 2014-09-02 | 2015-08-28 | Halbleitervorrichtung und herstellungsverfahren der halbleitervorrichtung |
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JP2014177932A JP6135623B2 (ja) | 2014-09-02 | 2014-09-02 | 半導体装置及びその製造方法 |
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JP (1) | JP6135623B2 (ja) |
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DE (1) | DE102015114341B4 (ja) |
Cited By (2)
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KR20180025670A (ko) * | 2016-09-01 | 2018-03-09 | 현대모비스 주식회사 | 직접냉각유로를 갖는 적층형 전력반도체 양면 냉각 장치 |
US10777485B2 (en) | 2018-04-12 | 2020-09-15 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
Families Citing this family (7)
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EP3206468B1 (de) * | 2016-02-15 | 2018-12-26 | Siemens Aktiengesellschaft | Umrichter mit gleichspannungszwischenkreis |
JP6950326B2 (ja) * | 2017-07-25 | 2021-10-13 | 株式会社デンソー | 電力変換装置 |
WO2019037904A1 (de) * | 2017-08-21 | 2019-02-28 | Zf Friedrichshafen Ag | Leistungsmodul mit kühlplatten |
IT201800000950A1 (it) | 2018-01-15 | 2019-07-15 | St Microelectronics Srl | Dispositivo incapsulato di potenza con migliorate capacita' di dissipazione del calore e migliori prestazioni termiche |
KR102512004B1 (ko) * | 2018-02-01 | 2023-03-21 | 한온시스템 주식회사 | 전장부품 냉각기 및 그 제조 방법 |
DE102018207033B3 (de) | 2018-05-07 | 2019-07-04 | Siemens Aktiengesellschaft | Anordnung elektrischer Module, Stromrichter und Luftfahrzeug mit einer derartigen Anordnung sowie Verfahren zur Herstellung der Anordnung |
JP7318591B2 (ja) * | 2020-06-15 | 2023-08-01 | 株式会社デンソー | 電力変換装置 |
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- 2015-08-28 DE DE102015114341.0A patent/DE102015114341B4/de active Active
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Also Published As
Publication number | Publication date |
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CN105390462A (zh) | 2016-03-09 |
JP6135623B2 (ja) | 2017-05-31 |
DE102015114341A1 (de) | 2016-03-03 |
US20160064304A1 (en) | 2016-03-03 |
DE102015114341B4 (de) | 2020-06-18 |
US9633926B2 (en) | 2017-04-25 |
CN105390462B (zh) | 2018-05-29 |
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