US10638643B2 - Electronic device - Google Patents

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US10638643B2
US10638643B2 US16/183,127 US201816183127A US10638643B2 US 10638643 B2 US10638643 B2 US 10638643B2 US 201816183127 A US201816183127 A US 201816183127A US 10638643 B2 US10638643 B2 US 10638643B2
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Prior art keywords
casing
electronic device
fins
substrates
hollow
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US16/183,127
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US20190150318A1 (en
Inventor
Takahiro Furuya
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Canon Inc
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Canon Inc
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Filing date
Publication date
Priority claimed from JP2018186379A external-priority patent/JP7280678B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Assigned to CANON MEDICAL SYSTEMS CORPORATION reassignment CANON MEDICAL SYSTEMS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FURUYA, TAKAHIRO
Publication of US20190150318A1 publication Critical patent/US20190150318A1/en
Assigned to CANON KABUSHIKI KAISHA reassignment CANON KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CANON MEDICAL SYSTEMS CORPORATION
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Publication of US10638643B2 publication Critical patent/US10638643B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20181—Filters; Louvers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H04N5/2252—
    • H04N5/22521—

Definitions

  • Embodiments described herein relate generally to an electronic device.
  • a performance guarantee temperature corresponding to the upper limit temperature inside the casings may be determined.
  • the upper limit temperature of surfaces of casings may be determined from the viewpoint of preventing low temperature burn or the like.
  • FIG. 1 is an external perspective view illustrating a configuration example of an electronic device according to a first embodiment
  • FIG. 2 is a perspective view illustrating a state in which a top cover of the electronic device is removed
  • FIG. 3A is an end view taken along A-A in FIG. 1 ;
  • FIG. 3B is a diagram illustrating a first configuration example for preventing an increase in the temperature of an outer surface of a casing
  • FIG. 3C is a diagram illustrating a second configuration example for preventing an increase in the temperature of the outer surface of the casing
  • FIG. 4 is an external perspective view illustrating configuration example of an electronic device according to a second embodiment
  • FIG. 5 is an external perspective view of a state in which a burn prevention cover is attached to the electronic device
  • FIG. 6 is an external perspective view illustrating a configuration example of an electronic device according to a third embodiment
  • FIG. 7 is an external perspective view illustrating arrangement that is adopted when the electronic device is used.
  • FIG. 8 is an external perspective view illustrating a configuration example of an electronic device according to a fourth embodiment
  • FIG. 9 is an end view taken along A-A in FIG. 8 ;
  • FIG. 10 is an external perspective view illustrating a configuration example of an electronic device according to a fifth embodiment
  • FIG. 11 is an end view taken along A-A in FIG. 10 ;
  • FIG. 12 is an external perspective view of a state in which a burn prevention cover is attached to the electronic device
  • FIG. 13 is an end view illustrating a first configuration example of an electronic device according to a sixth embodiment
  • FIG. 14 is an end view illustrating a second configuration example of the electronic device according to the sixth embodiment.
  • FIG. 15 is an end view illustrating a third configuration example of the electronic device according to the sixth embodiment.
  • An electronic device includes a casing and substrates.
  • the casing includes a plurality of fins including hollow fins.
  • the substrates are inserted into the hollow fins and include electronic circuits.
  • FIG. 1 is an external perspective view illustrating configuration example of an electronic device 1 according to a first embodiment.
  • the electronic device 1 is assumed to be a camera to which a lens unit (not illustrated) is attached.
  • the electronic device 1 has a casing that is formed in an approximately rectangular box shape with a bottom cover 2 that constitutes a bottom surface and a part of side surfaces, a front cover 3 that constitutes a front surface, a back cover 4 that constitutes a back surface, and a top cover 5 that constitutes an upper surface and most of the side surfaces.
  • the bottom cover 2 , the front cover 3 , the back cover 4 , and the top cover 5 are manufactured by thin-wall die casting or the like.
  • FIG. 2 is a perspective view illustrating a state in which the top cover 5 of the electronic device 1 is removed.
  • FIG. 3A is an end view taken along A-A in FIG. 1 .
  • the front surface may be referred to as a first surface.
  • the back surface that faces the front surface may be referred to as a second surface.
  • the upper surface (top surface) that is perpendicular to the back surface may be referred to as a third surface.
  • the bottom surface that faces the upper surface may be referred to as a fourth surface.
  • a right side surface that is perpendicular to the front surface and the upper surface may be referred to as a fifth surface.
  • a left side surface that faces the right side surface may be referred to as a sixth surface.
  • the bottom cover 2 has a flat plate shape with upward bending portions on the right side surface and the left side surface.
  • Lower ends of the front cover 3 are fixed to front ends (end portions on the front surface side) of the bottom cover 2 with screws or the like, and lower ends of the back cover 4 are fixed to rear ends of the bottom cover 2 with screws or the like.
  • the top cover 5 is fixed to a fixing piece 3 b, which is provided on the back side of an upper end of the front cover 3 , with a screw 6 A, fixed to a fixing piece 4 a, which is provided on the back side of an upper end of the back cover 4 , with a screw 6 B, and fixed to fixing pieces 2 a and 2 b, which are provided on side surfaces of the bottom cover 2 , with screws 6 C and 6 D.
  • a substrate 7 A including an electronic circuit is fixed on the inner side of a bottom surface of the bottom cover 2 via a spacer 8 such that a substrate surface with the electronic circuit is oriented horizontally.
  • a substrate 7 B is fixed in a vertical direction on a front surface side of the substrate surface of the substrate 7 A such that a substrate surface of the substrate 7 B faces the front surface.
  • a plurality of substrates 7 C, 7 D, and 7 E are fixed in a vertical direction on the substrate surface of the substrate 7 A such that substrate surfaces of the substrates 7 C, 7 D, and 7 E face the side surfaces. While the case is illustrated in which the substrate 7 A is indirectly fixed on the inner side of the bottom surface of the bottom cover 2 via the spacer 8 , it may be possible to directly fix the substrate 7 A to the bottom cover 2 .
  • An opening 3 a to which the lens unit is attached is provided in the center of a front surface of the front cover 3 , and a heatsink including a plurality of fins is provided around the opening 3 a.
  • An image sensor (not illustrated) that is provided on the substrate 7 B is arranged on the inner side of the opening 3 a of the front cover 3 , and the lens unit attached to the opening 3 a forms an image of an imaging object on a light receiving surface of the image sensor.
  • the heatsink provided on the front cover 3 is mainly used to dissipate heat from the substrate 7 B on which the image sensor is mounted; however, if heat from the substrate 7 B can be adequately dissipated using a different heat discharging mechanism, the heatsink of the front cover 3 may be omitted. Meanwhile, an image captured by the image sensor is processed into an image signal by electronic circuits (electronic components) 9 that are arranged on the substrates 7 A to 7 E, and a final image signal is output to the outside of the device via a connector or the like.
  • the top cover 5 in itself, is formed into a plurality of fins, and the fins include hollow fins.
  • the fins include hollow fins.
  • Fins 5 a, 5 d, and 5 e among hollow fins 5 a to 5 e are configured such that most parts from ends of the substrates 7 C, 7 D, and 7 E are accommodated (inserted) in inner hollow portions thereof.
  • a state in which the most parts of the substrates are accommodated indicates a state in which, for example, more than halves of the electronic circuits 9 provided on the substrates are accommodated.
  • each of the substrates 7 C, 7 D, and 7 E is sandwiched between inner walls of each of the hollow fins 5 a, 5 d, and 5 e in a contact or non-contact manner. Furthermore, each of the substrates 7 C, 7 D, and 7 E is arranged approximately parallel to the inner walls of each of the hollow fins 5 a, 5 d, and 5 e.
  • the substrates 7 C, 7 D, and 7 E are accommodated in the fins 5 a, 5 d, and 5 e and substrates are not accommodated in the fins 5 b and 5 c, it may be possible to accommodate substrates in all of the fins 5 a to 5 e, or it may be possible not to accommodate a fin different from the fins indicated in the drawings, depending on circuit configurations. It may be possible to accommodate, in the hollow fin in which the substrate is not accommodated, a signal line to which an electronic circuit included in the image sensor or the substrate is connected.
  • outer fins 5 a and 5 e are likely to be exposed to the air and increase a heat dissipate effect, it is preferable to preferentially accommodate, in the outer fins 5 a and 5 e , substrates mounted with electronic circuits that generate large amounts of heat.
  • the electronic circuits 9 provided on the substrates 7 C, 7 D, and 7 E that are accommodated in the inner hollow portions of the fins 5 a, 5 d, and 5 e are thermally connected to the inner walls of the fins 5 a , 5 d, and 5 e via heat-transfer members 10 that are made with silicone-type or acrylic-type heat-transfer sheet.
  • the electronic circuits 9 are thermally connected to the inner walls of the fins 5 a , 5 d, and 5 e via the heat-transfer members 10 on both surfaces of each of the substrates 7 C, 7 D, and 7 E, but may be thermally connected to only one surfaces. If the heat dissipate effect can be adequately achieved only by accommodating the substrates in the hollow portions of the fin 5 a and the other fines, it may be possible to omit thermal connections using the heat-trans members 10 .
  • the number of the hollow fins is not limited to five, but may be changed arbitrarily if needed. Further, widths of the inner hollow portions of the hollow fins in a side-surface direction and widths between the adjacent hollow fins need not be uniform, but may be changed arbitrarily. However, the width of the inner hollow portion of each of the fins in the side-surface direction needs to be set such that a substrate can be accommodated and such that when the heat-transfer member 10 is used, thicknesses of the substrate, components, and the heat-transfer member 10 are taken into account.
  • the width between the adjacent hollow fins in the side-surface direction is one example of a first member that corresponds to at least the third surface, the fifth surface, and the sixth surface and that includes the plurality of fins.
  • the bottom cover 2 is one example of a second member that corresponds to the fourth surface.
  • Heat flow rate surface area ⁇ heat transfer coefficient ⁇ (surface temperature ⁇ outside air temperature)
  • the heat flow rate is an amount of heat dissipated from the casing to the outside air per unit time.
  • the surface area is an area in which the casing is exposed to the outside air.
  • the heat transfer coefficient is amount of heat transfer due to natural convection of air per unit time and per unit difference of temperature.
  • the surface temperature is the temperature of the surface of the casing.
  • the outside air temperature is the temperature of the outside air.
  • the surface area of the casing of the electronic device 1 according to the present embodiment is increased due to the plurality of hollow fins 5 a to 5 e provided on the top cover 5 , as compared to a casing with the same external dimension (about 2.3 times larger in the example illustrated in the drawings), and thus contributes to an increase in the heat flow rate.
  • the hollow fins 5 a to 5 e are provided by utilizing, for example, a space that is not used in a simple box-like (rectangular solid) casing, so that the size of the casing is not increased as compared to the box-like casing. It is even possible to reduce the external dimension of the casing.
  • heat is dissipated from the electronic circuits 9 that are provided on the both surfaces of the substrates 7 C, 7 D, and 7 E to the casing that is constituted of the top cover 5 and the like via the heat-transfer members 10 , so that it is possible to bring the temperature of the top cover 5 close to the temperature of the electronic circuits 9 .
  • the heat flow rate as described above, a difference between the surface temperature and the outside air temperature is increased, so that the heat dissipate amount is increased.
  • the present embodiment when the present embodiment is adopted, it is expected to further increase the heat flow rate, as compared to a case in which the present embodiment is not adopted, such as a case in which a casing is configured as a simple box-like shape without hollow fins and a heat-transfer member dissipates heat to the casing only from an electronic circuit that faces an inner wall of a substrate that faces an inner wall of the casing.
  • the temperature of the outer surface of the casing that is likely to be touched by the hand of the user.
  • FIG. 3B is a diagram illustrating a configuration example for preventing an increase in the temperature of the outer surface of the casing.
  • the electronic circuits 9 facing the outer sides are not provided with the heat-transfer members 10 and not made contact with the inner walls of the top cover 5 , but only the electronic circuits 9 facing the inner sides are provided with the heat-transfer members 10 .
  • the fin other than the fins 5 a and 5 e that are located on the outer sides of the casing e.g., with respect to the substrate 7 D accommodated in the fin 5 d, it may be possible to provide the heat-transfer members 10 on the electronic circuits 9 on both sides. With this configuration, it is possible to prevent heat from directly flowing to the outer surface of the top cover 5 , and reduce the temperature of the outer surface of the casing that is likely to be touched by the hand of the user.
  • FIG. 3C is a diagram illustrating another configuration example for preventing an increase in the temperature of the outer surface of the casing.
  • FIG. 3C illustrates a case in which the substrates 7 C, 7 E, and 7 D are accommodated preferentially in the fins 5 b , 5 c, and 5 d that are located on the inner side in the casing, and the fins 5 a and 5 e that are located on the outer sides in the casing are maintained vacant when substrates to be accommodated are not present.
  • heat that flows to the outer surface of the top cover 5 is reduced, so that it is possible to further reduce the temperature of the outer surface of the casing that is likely to be touched by the hand of the user.
  • FIG. 4 is an external perspective view illustrating a configuration example of an electronic device 1 according to a second embodiment.
  • a burn prevention cover 11 is attachable to the casing of the electronic device 1 .
  • FIG. 5 is an external perspective view of a state in which the burn prevention cover 11 is attached to the electronic device 1 .
  • a configuration of the casing of the electronic device 1 is the same as illustrated in FIG. 1 to FIG. 3A .
  • the example has been described in which heat is dissipated from the electronic circuits that are provided on the both surfaces of the substrates to the casing via the heat-transfer members, so that it is possible to increase the surface temperature of the casing and it is expected to further increase the heat flow rate.
  • the upper limit temperature of the surface of the casing is determined from the view point of preventing low temperature burn or the like, and therefore, it is not preferable to merely increase the surface temperature of the casing.
  • the second embodiment is configured to allow the burn prevention cover 11 to be attached to maintain the safety even when the surface temperature of the casing is increased.
  • the burn prevention cover 11 is made with, for example, resin or the like, and configured such that vertical and horizontal ribs are connected in a mesh-like manner (grid-like manner) to ensure the breathability so as not to impede thermal convection for heat discharging and so as to prevent the top cover 5 from being directly touched with a finger of the hand of a user.
  • the reason why only the top cover 5 is covered by the burn prevention cover 11 is that it is assumed that the temperature of the center of the casing is most increased and the user holds a portion of the op cover 5 by his/her hand. Therefore, if it is assumed that the temperature of a different portion of the casing is considerably increased and the portion may be touched by the hand of the user, the shape of the burn prevention cover 11 is changed so as to cover the portion.
  • Intervals and thicknesses of the ribs of the burn prevention cover 11 are set to certain sizes such that when the user touches the electronic device 1 (when the user holds the burn prevention cover 11 by his/her hand, for example) the top cover 5 is not directly touched with a finger of the user, e.g, the finger does not slit in a gap between the meshes and the tip of the finger or the like does not touch the top cover 5 .
  • the burn prevention cover 11 may be engaged with the casing by a claw or the like (not illustrated) that is provided in a part of the burn prevention cover 11 , or may be fixed to the casing with a screw or the like.
  • the upper limit temperature of the surface of the casing which is determined from the viewpoint of preventing low temperature burn or the like, is set to 60° C. when the surface of the casing is made with metal and set to 75° C. when the surface of the casing is made with resin, for example. Therefore, in this example, when the burn prevention cover 11 is made with resin, it is sufficient to reduce the surface temperature of the burn prevention cover 11 to be equal to or lower than 75° C. Resin has a low heat transfer coefficient, and the burn prevention cover 11 is formed in a mesh-like shape with fine ribs with small contact surfaces with the top cover 5 ; therefore, it is possible to increase the temperature of the top cover 5 up to a temperature higher than the surface temperature of 5° C.
  • the temperature of the top cover 5 is restricted by the upper limit temperature that is determined from the viewpoint of preventing degradation or breakdown of electronic circuits and the like in the casing.
  • FIG. 6 is an external perspective view illustrating a configuration example of an electronic device 1 according to a third embodiment.
  • the shape of the top cover 5 is modified.
  • the back cover 4 is integrated with the top cover 5 illustrated in FIG. 1 etc., and inter-fin concave portions on end portions of the hollow fins 5 a to 5 e of the top cover 5 penetrate to the back surface.
  • the end view around the center e top cover 5 is the same as FIG. 3A .
  • FIG. 7 is an external perspective view illustrating arrangement that is adopted when the electronic device 1 illustrated in FIG. 6 is used, in particular, when the electronic device 1 is used as a microscope camera or the like with the front cover 3 facing downward.
  • the hollow fins 5 a to 5 e of the top cover 5 are arranged in the vertical direction, and air flows in from lower concave portions 5 f and 5 g and flows out from upper ends through the concave portions of the fins 5 a to 5 e ; therefore, the heat dissipate effect is improved.
  • FIG. 8 is an external perspective view illustrating a configuration example of an electronic device 1 according to a fourth embodiment.
  • hollow fins are not provided on the top cover 5 of the electronic device 1 , but a plurality of air outlets 5 h and air inlets 5 j are provided instead.
  • FIG. 9 is an end view taken along A-A in FIG. 8 .
  • the electronic device 1 has a casing that is formed in an approximately rectangular box shape with the bottom cover 2 that constitutes a bottom surface and a part of side surfaces, the front cover 3 that constitutes a front surface, the back cover 4 that constitutes a back surface, and the top cover 5 that constitutes an upper surface and most of the side surfaces.
  • the substrate 7 A is fixed with the spacer 8
  • the substrates 7 C, 7 D, and 7 E are fixed in the vertical direction on the substrate 7 A. Configurations of the components other than the top cover 5 are the same as those illustrated in FIG. 1 etc.
  • the top cover 5 includes a flat top portion and left and right side plate portions.
  • the plurality of air outlets 5 h are provided on the top portion, and the plurality of air inlets 5 h are provided on the side plate portions.
  • breathable sheets 5 i with breathability, waterproof property, and dust resistance (which are waterproof, dust resistant, and breathable) are provided on the inner sides of the air outlets 5 h so as to cover the air outlets 5 h.
  • breathable sheets 5 k with breathability, waterproof property, and dust resistance are provided on the inner sides of the air inlets 5 j so as to cover the air inlets 5 j.
  • the breathable sheets 5 i and 5 k are configured with, for example, films with a large number of fine pores, or the like.
  • the breathable sheets 5 i and 5 k realize breathability, waterproof property, and dust resistance by a film provided with a large number of fine pores or the like, but have large flow resistance due to the viscosity of air under a condition in which airflow is stopped, and therefore, thermal convection may be impeded in some cases.
  • the following relationship is preferable: a sum of the opening areas of the air outlets 5 h ⁇ a sum of the opening areas of the air inlets 5 j .
  • FIG. 10 is an external perspective view illustrating a configuration example of an electronic device 1 according to a fifth embodiment.
  • the fifth embodiment is a combination of the first embodiment illustrated in FIG. 1 and the fourth embodiment illustrated in FIG. 8 .
  • FIG. 11 is an end view taken along A-A in FIG. 10 .
  • the electronic device 1 has a casing that is formed in an approximately rectangular box shape with the bottom cover 2 that constitutes a bottom surface and a part of side surfaces, the front cover 3 that constitutes a front surface, the back cover 4 that constitutes a back surface, and the top cover 5 that constitutes an upper surface and most of the side surfaces.
  • the substrate 7 A is fixed with the spacer 8
  • the substrates 7 C, 7 D, and 7 E are fixed in the vertical direction on the substrate 7 A. Configurations of the components other than the top cover 5 are the same as those illustrated in FIG. 1 etc.
  • the hollow fins 5 a to 5 e are provided on the top cover 5 similarly to the configuration illustrated in FIG. 1 , but a concave portion 5 m is further provided across the fins 5 a to 5 e at a predetermined position from the back cover 4 side.
  • the plurality of air outlets 5 h are provided on the upper surfaces of the fins 5 a to 5 e, and the plurality of air inlets 5 j are provided in the lower parts of the side surfaces of the top cover 5 .
  • the breathable sheets 5 i with breathability, waterproof property, and dust resistance are provided on the inner sides of the air outlets 5 h so as to cover the air outlets 5 h.
  • the breathable sheets 5 k with breathability, waterproof property, and dust resistance are provided on the inner sides of the air inlets 5 j so as to cover the air inlets 5 j.
  • the hollow fins 5 a to 5 e have the same configuration as a chimney pipe that increases thermal convection from the lower side to the upper side and improve the heat dissipate effect.
  • the concave portion 5 m that is provided across the fins 5 a to 5 e divides upper portions of the respective fins 5 a to 5 e, so that heated air is likely to be accumulated.
  • FIG. 12 is an external perspective view of a state in which the burn prevention cover 11 is attached to the electronic device 1 .
  • the burn prevention cover 11 illustrated in FIG. 5 and the burn prevention cover 11 illustrated in FIG. 12 have slightly different mesh patterns, but it is possible to adopt either one of the patterns or adopt still another pattern. That is, it is possible to adopt any configuration that ensures breathability and that prevents a user from directly touching a heated portion, such as the top cover 5 , with his/her finger when the user touches the electronic device 1 .
  • FIG. 13 to FIG. 15 are end views illustrating configuration examples of an electronic device 1 according to a sixth embodiment.
  • any of the electronic device 1 according to the first and third embodiments as illustrated in FIG. 3A , the electronic device 1 according to the fourth embodiment as illustrated in FIG. 9 , and the electronic device 1 according to the fifth embodiment as illustrated in FIG. 11 is cooled.
  • the present embodiment is applicable to a case in which the electronic device 1 is incorporated into a larger electronic device that includes a cooling unit, or a case in which the electronic device 1 includes a cooling unit.
  • the cooling unit includes, for example, a cooling fan 13 for blowing air into the casing 12 .
  • the electronic device 1 of the first and third embodiments as illustrated in FIG. 3A is arranged inside the casing 12 .
  • Vents 12 a are provided at one end of the casing 12
  • a vent 12 b is provided at the other end of the casing 12
  • the cooling fan 13 is provided at the vent 12 b.
  • the electronic device 1 according to the fourth embodiment as illustrated in FIG. 9 is arranged inside the casing 12 .
  • the vents 12 a are provided at one end of the casing 12
  • the vent 12 b is provided at the other end of the casing 12
  • the cooling fan 13 is provided at the vent 12 b.
  • the electronic device 1 according to the fifth embodiment as illustrated in FIG. 11 is arranged inside the casing 12 .
  • the vents 12 a are provided at one end of the casing 12
  • the vent 12 b is provided at the other end of the casing 12
  • the cooling fan 13 is provided at the vent 12 b.
  • the positional relationship between the cooling fan 13 and the electronic device 1 is determined such that air from the cooling fan 13 reaches the third surface.
  • the positional relationship between the cooling fan 13 and the electronic device 1 is determined such that air from the cooling fan 13 reaches at least one of the second surface and the third surface. The electronic device 1 is forcibly cooled by the airflow generated by the cooling fan 13 , so that it is possible to adequately cool the electronic device 1 .
  • the electronic device or the cooling fan may be broken down due to the influence of dust caught on the cooling fan.
  • the casing 12 may be configured in an openable and closable manner, and it may be possible to request a user to perform operation of removing dust or the like inside the casing 12 . As a result, it is possible to prevent reduction of the cooling effect and prevent breakdown of the electronic circuit and the cooling fan.
  • the electronic device 1 as described above is not limited to a camera.
  • the technology is applicable to any electronic device that needs to dissipate heat.
  • the electronic device 1 may be, for example, a medical device or a part of a medical device.
  • the higher-level device described in the sixth embodiment may be, for example, a general-purpose personal computer device, an industrial server device, a medical device, or a part of a medical device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US16/183,127 2017-11-14 2018-11-07 Electronic device Active US10638643B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-219405 2017-11-14
JP2017219405 2017-11-14
JP2018186379A JP7280678B2 (ja) 2017-11-14 2018-10-01 電子機器
JP2018-186379 2018-10-01

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US20190150318A1 US20190150318A1 (en) 2019-05-16
US10638643B2 true US10638643B2 (en) 2020-04-28

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Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994004013A1 (en) 1992-08-06 1994-02-17 Pfu Limited Cooler for heat generation device
JPH0661387A (ja) 1992-08-12 1994-03-04 Ibiden Co Ltd 半導体装置用放熱基板
WO1994013012A1 (en) 1992-11-24 1994-06-09 Asea Brown Boveri Ab Device for cooling sheet elements for power electronics
EP0717440A2 (en) 1994-12-15 1996-06-19 Hitachi, Ltd. Cooling device of multi-chip module
US6072697A (en) 1998-07-15 2000-06-06 Systems & Electronics, Inc. Modular heat sink stack
CN2718780Y (zh) 2004-05-26 2005-08-17 曜越科技股份有限公司 外挂式的辅助散热装置
US20100046168A1 (en) 2008-08-21 2010-02-25 Green Lighting, Inc. Heat dissipating device
US7706684B2 (en) 2006-10-11 2010-04-27 Sony Corporation Image-capture apparatus
CN201576530U (zh) 2009-11-30 2010-09-08 安徽广润发电气设备有限公司 一种油浸式变压器散热装置
CN201733567U (zh) 2010-06-11 2011-02-02 鸿富锦精密工业（深圳）有限公司 一种具有散热功能的电磁屏蔽装置
US20110235278A1 (en) * 2008-12-12 2011-09-29 Murata Manufacturing Co., Ltd. Circuit module
CN102290388A (zh) 2011-08-11 2011-12-21 深圳市润芯科技有限公司 电控设备、热管散热器及其制作方法
RU2440702C1 (ru) 2010-12-15 2012-01-20 Алексей Петрович Смирнов Система воздушного охлаждения тепловыделяющих электронных модулей
US8233040B2 (en) * 2006-12-01 2012-07-31 Accu-Sort Systems, Inc. Modular camera and camera system
US8388141B2 (en) * 2008-02-07 2013-03-05 Canon Kabushiki Kaisha Electric apparatus
CN103619147A (zh) 2013-11-06 2014-03-05 广东高标电子科技有限公司 一种弹性固定的电动车控制器散热装置
US8675706B2 (en) * 2011-12-24 2014-03-18 Princeton Optronics Inc. Optical illuminator
US20140198457A1 (en) 2013-01-15 2014-07-17 Emerson Network Power - Embedded Computing, Inc. Integrated Thermal Inserts And Cold Plate
US8872121B2 (en) * 2009-08-31 2014-10-28 Canon Kabushiki Kaisha Radiation imaging apparatus
US8876297B2 (en) * 2006-03-31 2014-11-04 Nikon Corporation Camera having projection unit with light source
US20140328021A1 (en) * 2013-05-06 2014-11-06 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus and electronic device using the same
CN204206691U (zh) 2014-06-11 2015-03-11 广东高标电子科技有限公司 功率器件散热结构
US9480189B2 (en) * 2012-09-21 2016-10-25 Hitachi Automotive Systems, Ltd. Electronic control apparatus
JP2017011303A (ja) 2016-10-05 2017-01-12 日立オートモティブシステムズ株式会社 電子制御装置
US20170064868A1 (en) * 2015-01-08 2017-03-02 General Electric Company System and method for thermal management using vapor chamber
US9628731B2 (en) * 2013-04-29 2017-04-18 Vieworks Co., Ltd. Image capture apparatus
CN206117841U (zh) 2016-11-11 2017-04-19 协创数据技术股份有限公司 一种高效散热的vr相机
US20170112018A1 (en) * 2015-10-20 2017-04-20 General Electric Company Heat transfer chassis and method for forming the same
US9838558B2 (en) * 2015-04-10 2017-12-05 Blackmagic Design Pty Ltd Digital video camera

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203086840U (zh) * 2013-01-05 2013-07-24 陈夏新 电路板上的贴片功率元件的导热结构
CN103413794A (zh) * 2013-08-16 2013-11-27 中国科学院深圳先进技术研究院 一种半导体功率器件的散热封装结构
CN206504651U (zh) * 2017-01-23 2017-09-19 中车大连机车研究所有限公司 一种热管散热器

Patent Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994004013A1 (en) 1992-08-06 1994-02-17 Pfu Limited Cooler for heat generation device
US5583316A (en) 1992-08-06 1996-12-10 Pfu Limited Heat-generating element cooling device
JPH0661387A (ja) 1992-08-12 1994-03-04 Ibiden Co Ltd 半導体装置用放熱基板
WO1994013012A1 (en) 1992-11-24 1994-06-09 Asea Brown Boveri Ab Device for cooling sheet elements for power electronics
EP0717440A2 (en) 1994-12-15 1996-06-19 Hitachi, Ltd. Cooling device of multi-chip module
US5751062A (en) 1994-12-15 1998-05-12 Hitachi, Ltd. Cooling device of multi-chip module
US6072697A (en) 1998-07-15 2000-06-06 Systems & Electronics, Inc. Modular heat sink stack
CN2718780Y (zh) 2004-05-26 2005-08-17 曜越科技股份有限公司 外挂式的辅助散热装置
US8876297B2 (en) * 2006-03-31 2014-11-04 Nikon Corporation Camera having projection unit with light source
US7706684B2 (en) 2006-10-11 2010-04-27 Sony Corporation Image-capture apparatus
US8233040B2 (en) * 2006-12-01 2012-07-31 Accu-Sort Systems, Inc. Modular camera and camera system
US8388141B2 (en) * 2008-02-07 2013-03-05 Canon Kabushiki Kaisha Electric apparatus
US20100046168A1 (en) 2008-08-21 2010-02-25 Green Lighting, Inc. Heat dissipating device
US20110235278A1 (en) * 2008-12-12 2011-09-29 Murata Manufacturing Co., Ltd. Circuit module
US8872121B2 (en) * 2009-08-31 2014-10-28 Canon Kabushiki Kaisha Radiation imaging apparatus
CN201576530U (zh) 2009-11-30 2010-09-08 安徽广润发电气设备有限公司 一种油浸式变压器散热装置
CN201733567U (zh) 2010-06-11 2011-02-02 鸿富锦精密工业（深圳）有限公司 一种具有散热功能的电磁屏蔽装置
RU2440702C1 (ru) 2010-12-15 2012-01-20 Алексей Петрович Смирнов Система воздушного охлаждения тепловыделяющих электронных модулей
CN102290388A (zh) 2011-08-11 2011-12-21 深圳市润芯科技有限公司 电控设备、热管散热器及其制作方法
US8675706B2 (en) * 2011-12-24 2014-03-18 Princeton Optronics Inc. Optical illuminator
US9480189B2 (en) * 2012-09-21 2016-10-25 Hitachi Automotive Systems, Ltd. Electronic control apparatus
US20140198457A1 (en) 2013-01-15 2014-07-17 Emerson Network Power - Embedded Computing, Inc. Integrated Thermal Inserts And Cold Plate
US9628731B2 (en) * 2013-04-29 2017-04-18 Vieworks Co., Ltd. Image capture apparatus
US20140328021A1 (en) * 2013-05-06 2014-11-06 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus and electronic device using the same
CN103619147A (zh) 2013-11-06 2014-03-05 广东高标电子科技有限公司 一种弹性固定的电动车控制器散热装置
CN204206691U (zh) 2014-06-11 2015-03-11 广东高标电子科技有限公司 功率器件散热结构
US20170064868A1 (en) * 2015-01-08 2017-03-02 General Electric Company System and method for thermal management using vapor chamber
US9838558B2 (en) * 2015-04-10 2017-12-05 Blackmagic Design Pty Ltd Digital video camera
US20170112018A1 (en) * 2015-10-20 2017-04-20 General Electric Company Heat transfer chassis and method for forming the same
JP2017011303A (ja) 2016-10-05 2017-01-12 日立オートモティブシステムズ株式会社 電子制御装置
CN206117841U (zh) 2016-11-11 2017-04-19 协创数据技术股份有限公司 一种高效散热的vr相机

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Chinese Office Action issued in corresponding Chinese Application No. 201811344994.3 dated Jan. 9, 2020.
Extended European Search Report dated Jul. 22, 2019 in Patent Application No. 18204405.7, citing documents AA-AC and AO therein, 6 pages.

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