US10461167B2 - Semiconductor device and method of manufacturing the same - Google Patents

Semiconductor device and method of manufacturing the same Download PDF

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US10461167B2
US10461167B2 US15/861,949 US201815861949A US10461167B2 US 10461167 B2 US10461167 B2 US 10461167B2 US 201815861949 A US201815861949 A US 201815861949A US 10461167 B2 US10461167 B2 US 10461167B2
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Prior art keywords
work function
metal layer
transistor
function metal
pattern
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US20180374926A1 (en
Inventor
Dongsoo Lee
Wonkeun Chung
Hoonjoo NA
Suyoung BAE
Jaeyeol Song
Jonghan LEE
HyungSuk Jung
Sangjin Hyun
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BAE, SUYOUNG, CHUNG, WONKEUN, HYUN, SANGJIN, JUNG, HYUNGSUK, LEE, DONGSOO, LEE, JONGHAN, NA, HOONJOO, SONG, JAEYEOL
Publication of US20180374926A1 publication Critical patent/US20180374926A1/en
Priority to US16/592,330 priority Critical patent/US11121131B2/en
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Priority to US17/384,920 priority patent/US11742351B2/en
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Definitions

  • Inventive concepts relate to semiconductor, and more particularly, to a semiconductor device including a gate-all-around type transistor and a method of manufacturing the same.
  • a semiconductor device is considered to be an important factor in electronic industry because of small size, multi-functionality, and/or low fabrication cost.
  • a semiconductor device may be categorized as any one of a semiconductor memory device storing data and/or machine readable instructions, a semiconductor logic device processing operations of logic data, and a hybrid semiconductor device having both memory and logic elements.
  • Semiconductor devices have been increasingly desired, or alternatively required, for high integration with the advanced development of the electronic industry. For example, a semiconductor device has been increasingly requested for high reliability, high speed, and/or multi-functionality. Semiconductor devices have gradually complicated and integrated to meet these requested characteristics.
  • Some embodiments of inventive concepts provide a semiconductor device including gate-all-around type transistors with various threshold voltages.
  • Some embodiments of inventive concepts provide a method of manufacturing a semiconductor device including gate-all-around type transistors with various threshold voltages.
  • a semiconductor device may comprise a first transistor on a substrate, and a second transistor on the substrate.
  • Each of the first and second transistors includes a plurality of semiconductor patterns vertically stacked on the substrate and vertically spaced apart from each other, and a gate dielectric pattern and a work function pattern filling a space between the semiconductor patterns.
  • the work function pattern of the first transistor includes a first work function metal layer
  • the work function pattern of the second transistor includes the first work function metal layer and a second work function metal layer
  • the first work function metal layer of each of the first and second transistors has a work function greater than that of the second work function metal layer
  • the first transistor has a threshold voltage less than that of the second transistor.
  • a semiconductor device may comprise a first transistor on a substrate and a second transistor on the substrate.
  • Each of the first and second transistors includes a plurality of semiconductor patterns vertically stacked on the substrate and vertically spaced apart from each other, and a gate dielectric pattern and a work function pattern that fill a space between the semiconductor patterns.
  • the space of the first transistor has the same size as that of the space of the second transistor, the work function pattern of the first transistor comprises a first work function metal layer, the work function pattern of the second transistor comprises a first work function metal layer and a second work function metal layer, and the first transistor has a threshold voltage different from that of the second transistor.
  • a method of manufacturing a semiconductor device may comprise forming sacrificial layers and semiconductor layers alternately and repeatedly stacked on a substrate, forming sacrificial gate patterns crossing over the sacrificial layers and the semiconductor layers and extending in one direction, removing the sacrificial gate patterns to form a first trench and a second trench that expose the semiconductor layers and the sacrificial layers, selectively removing the sacrificial layers exposed to the first and second trenches, forming a first work function pattern that fills a first space between the semiconductor layers in the first trench, and forming a second work function pattern that fills a second space between the semiconductor layers in the second trench.
  • the first work function pattern comprises a first work function metal layer
  • the second work function pattern comprises a first work function metal layer and a second work function metal layer
  • the first space and the second space have the same size as each other
  • the first work function pattern and the second work function pattern have different work functions from each other.
  • FIG. 1 illustrates a plan view showing a semiconductor device according to some example embodiments of inventive concepts.
  • FIG. 2A illustrates a cross-sectional view taken along line A-A′ of FIG. 1 .
  • FIG. 2B illustrates a cross-sectional view taken along line B-B′ of FIG. 1 .
  • FIG. 2C illustrates a cross-sectional view taken along lines C-C′, D-D′, and E-E′ of FIG. 1 .
  • FIG. 2D illustrates a cross-sectional view taken along lines F-F′, G-G′, and H-H′ of FIG. 1 .
  • FIGS. 3, 5, 7, and 9 illustrate plan views showing a method of manufacturing a semiconductor device according to some example embodiments of inventive concepts.
  • FIGS. 4A, 6A, 8A, and 10A illustrate cross-sectional views taken along line A-A′ of FIGS. 3, 5, 7, and 9 , respectively.
  • FIGS. 4B, 6B, 8B, and 10B illustrate cross-sectional views taken along line B-B′ of FIGS. 3, 5, 7, and 9 , respectively.
  • FIG. 10C illustrates a cross-sectional view taken along line C-C′ of FIG. 9 .
  • FIG. 10D illustrates a cross-sectional view taken along line D-D′ of FIG. 9 .
  • FIGS. 11 to 14 illustrate cross-sectional views showing a method of forming first to third gate electrodes according to some example embodiments of inventive concepts.
  • FIG. 15 illustrates an enlarged cross-sectional view of section M of FIG. 2B , partially showing a sixth transistor of a semiconductor device according to some example embodiments of inventive concepts.
  • FIG. 1 illustrates a plan view showing a semiconductor device according to some example embodiments of inventive concepts.
  • FIG. 2A illustrates a cross-sectional view taken along line A-A′ of FIG. 1 .
  • FIG. 2B illustrates a cross-sectional view taken along line B-B′ of FIG. 1 .
  • FIG. 2C illustrates a cross-sectional view taken along lines C-C′, D-D′, and E-E′ of FIG. 1 .
  • FIG. 2D illustrates a cross-sectional view taken along lines F-F′, G-G′, and H-H′ of FIG. 1 .
  • a substrate 100 may be provided to include first to sixth regions RG 1 to RG 6 .
  • the substrate 100 may be or include a semiconductor substrate.
  • the substrate 100 may be a silicon substrate or a germanium substrate.
  • the substrate 100 may be or include a Silicon-On-Insulator (SOI) substrate.
  • First to sixth transistors TR 1 to TR 6 may be respectively provided on the first to sixth regions RG 1 to RG 6 of the substrate 100 .
  • At least some of the first to sixth regions RG 1 to RG 6 of the substrate 100 may be or include a memory cell region where a plurality of memory cells are formed to store data.
  • the memory cell region of the substrate 100 may be provided thereon with memory cell transistors included in a plurality of SRAM cells.
  • the first to sixth transistors TR 1 to TR 6 may be some of the memory cell transistors.
  • first to sixth regions RG 1 to RG 6 of the substrate 100 may be or include a logic cell region where logic transistors are to be included in a logic circuit of a semiconductor device.
  • logic transistors may be on the logic cell region of the substrate 100 .
  • the first to sixth transistors TR 1 to TR 6 may be some of the logic transistors. Inventive concepts, however, are not limited thereto.
  • the first to third transistors TR 1 to TR 3 on the first to third regions RG 1 to RG 3 may have conductive types different from those of the fourth to sixth transistors TR 4 to TR 6 on the fourth to sixth regions RG 4 to RG 6 .
  • the first to third transistors TR 1 to TR 3 on the first to third regions RG 1 to RG 3 may be PMOSFETs
  • the fourth to sixth transistors TR 4 to TR 6 on the fourth to sixth regions RG 4 to RG 6 may be NMOSFETs.
  • a device isolation layer ST may be provided on the substrate 100 .
  • the device isolation layer ST may define first and second upper patterns UP 1 and UP 2 on an upper portion of the substrate 100 .
  • the first upper pattern UP 1 may be on the first to third regions RG 1 to RG 3
  • the second upper pattern UP 2 may be on the fourth to sixth regions RG 4 to RG 6 .
  • the device isolation layer ST may fill trenches on opposite sides of each of the first and second upper patterns UP 1 and UP 2 .
  • the device isolation layer ST may have a top surface lower than those of the first and second upper patterns UP 1 and UP 2 .
  • a first active pattern AP 1 may be provided on the first upper pattern UP 1
  • a second active pattern AP 2 may be provided on the second upper pattern UP 2
  • the first active pattern AP 1 may vertically overlap the first upper pattern UP 1
  • the second active pattern AP 2 may vertically overlap the second upper pattern UP 2
  • the first and second active patterns AP 1 and AP 2 may have a linear shape extending in a second direction D 2 .
  • the first active pattern AP 1 may include first channel patterns CH 1 and first source/drain patterns SD 1 . Each of the first channel patterns CH 1 may be between a pair of the first source/drain patterns SD 1 .
  • the second active pattern AP 2 may include second channel patterns CH 2 and second source/drain patterns SD 2 . Each of the second channel patterns CH 2 may be between a pair of the second source/drain patterns SD 2 .
  • the first channel pattern CH 1 may include a plurality of first semiconductor patterns NS 1 that are vertically stacked.
  • the first semiconductor patterns NS 1 may be spaced apart from each other in a third direction D 3 perpendicular to a top surface of the substrate 100 .
  • the first semiconductor patterns NS 1 may vertically overlap each other.
  • Each of the first source/drain patterns SD 1 may be in contact, e.g. direct contact, with sidewalls of the first semiconductor patterns NS 1 .
  • the first semiconductor patterns NS 1 may connect a pair of neighboring first source/drain patterns SD 1 to each other.
  • the first channel pattern CH 1 may include three first semiconductor patterns NS 1 , but the number of the first semiconductor patterns NS 1 is not especially limited to three, and may be more, or less, than three.
  • the second channel pattern CH 2 may include a plurality of second semiconductor patterns NS 2 that are vertically stacked.
  • the second semiconductor patterns NS 2 may be spaced apart from each other in the third direction D 3 .
  • the second semiconductor patterns NS 2 may vertically overlap each other.
  • Each of the second source/drain patterns SD 2 may be in contact, e.g. direct contact, with sidewalls of the second semiconductor patterns NS 2 .
  • the second channel pattern CH 2 may include three second semiconductor patterns NS 2 , but the number of the second semiconductor patterns NS 2 is not especially limited to three, and may be more, or less, than three.
  • the first semiconductor patterns NS 1 at the same level may be formed from the same semiconductor layer.
  • the first semiconductor patterns NS 1 at the same level may have the same, or substantially the same, thickness as each other.
  • the first semiconductor patterns NS 1 at the same level may have the same, or substantially the same, semiconductor material as each other.
  • the second semiconductor patterns NS 2 at the same level may be formed from the same semiconductor layer.
  • the second semiconductor patterns NS 2 at the same level may have the same, or substantially the same, thickness as each other.
  • the second semiconductor patterns NS 2 at the same level may have the same, or substantially the same, semiconductor material as each other.
  • the first and second semiconductor patterns NS 1 and NS 2 may include one or more of silicon (Si), silicon germanium (SiGe), and germanium (Ge).
  • the first semiconductor patterns NS 1 at different levels may have the same thickness as each other or different thicknesses from each other.
  • the second semiconductor patterns NS 2 at different levels may have the same thickness as each other or different thicknesses from each other.
  • the first source/drain patterns SD 1 may be or include epitaxial patterns formed from the first semiconductor patterns NS 1 and the first upper pattern UP 1 serving as a seed layer.
  • the second source/drain patterns SD 2 may be or include epitaxial patterns formed from the second semiconductor patterns NS 2 and the second upper pattern UP 2 serving as a seed layer.
  • the first source/drain patterns SD 1 and the second source/drain patterns SD 2 may be formed with a chemical vapor deposition (CVD) process; however, inventive concepts are not limited thereto.
  • CVD chemical vapor deposition
  • the first source/drain patterns SD 1 may include a material that provides compressive strain to the first channel pattern CH 1 .
  • the first source/drain patterns SD 1 may include a semiconductor element (e.g., SiGe) whose lattice constant is greater than that of a semiconductor element of the substrate 100 .
  • the first source/drain patterns SD 1 may be doped with P-type conductive impurities, for example, boron (B).
  • the second source/drain patterns SD 2 may include a material that provides tensile strain to the second channel pattern CH 2 .
  • the second source/drain patterns SD 2 may include a semiconductor element whose lattice constant is less than that of the semiconductor element of the substrate 100 . Accordingly a mobility of carriers, e.g. electron mobility, may increase in a channel during operation of the transistor.
  • the second source/drain patterns SD 2 may include the same semiconductor element as that of the substrate 100 .
  • the second source/drain patterns SD 2 may be doped with N-type conductive impurities, for example, phosphorus (P) and/or arsenic (As).
  • First to sixth gate electrodes GE 1 to GE 6 may be provided to extend in a first direction D 1 , while running across the first and second channel patterns CH 1 and CH 2 .
  • the first to sixth gate electrodes GE 1 to GE 6 may respectively cross over the first to sixth regions RG 1 to RG 6 .
  • the first to sixth gate electrodes GE 1 to GE 6 may respectively include first to sixth work function patterns WF 1 to WF 6 .
  • the first to sixth gate electrodes GE 1 to GE 6 may respectively further include first to sixth electrode patterns EL 1 to EL 6 .
  • the first to sixth electrode patterns EL 1 to EL 6 may be respectively on the first to sixth work function patterns WF 1 to WF 6 .
  • the first to sixth electrode patterns EL 1 to EL 6 may each have resistance, e.g. a sheet resistance, less than that of each of the first to sixth work function patterns WF 1 to WF 6 .
  • the first to sixth electrode patterns EL 1 to EL 6 may include one or more low resistance or low resistivity metals such as aluminum (Al), tungsten (W), titanium (Ti), and tantalum (Ta).
  • the first to third work function patterns WF 1 to WF 3 of the first to third gate electrodes GE 1 to GE 3 may respectively fill first to third spaces SP 1 to SP 3 each between the first semiconductor patterns NS 1 .
  • the first to third spaces SP 1 to SP 3 may be positioned between the first semiconductor patterns NS 1 on the first to third regions RG 1 to RG 3 , respectively.
  • the fourth to sixth work function patterns WF 4 to WF 6 of the fourth to sixth gate electrodes GE 4 to GE 6 may respectively fill fourth to sixth spaces SP 4 to SP 6 each between the second semiconductor patterns NS 2 .
  • the fourth to sixth spaces SP 4 to SP 6 may be positioned between the second semiconductor patterns NS 2 on the fourth to sixth regions RG 4 to RG 6 , respectively.
  • the first to sixth spaces SP 1 to SP 6 at the same level may have the same, or substantially the same, size as each other.
  • the first to sixth spaces SP 1 to SP 6 at the same level may have the same length in the third direction D 3 .
  • the first to sixth work function patterns WF 1 to WF 6 of the first to sixth gate electrodes GE 1 to GE 6 may surround the first and second semiconductor patterns NS 1 and NS 2 (see FIG. 2C ).
  • the first to sixth work function patterns WF 1 to WF 6 may surround top surfaces, bottom surfaces, and sidewalls of the first and second semiconductor patterns NS 1 and NS 2 .
  • each of the first to sixth transistors TR 1 to TR 6 may be a gate-all-around field effect transistor.
  • the first to third electrode patterns EL 1 to EL 3 of the first to third gate electrodes GE 1 to GE 3 may not respectively fill the first to third spaces SP 1 to SP 3 .
  • the first to third electrode patterns EL 1 to EL 3 may be spaced apart from the first semiconductor patterns NS 1 across the first to third work function patterns WF 1 to WF 3 .
  • the fourth to sixth electrode patterns EL 4 to EL 6 of the fourth to sixth gate electrodes GE 4 to GE 6 may not respectively fill the fourth to sixth spaces SP 4 to SP 6 .
  • the fourth to sixth electrode patterns EL 4 to EL 6 may be spaced apart from the second semiconductor patterns NS 2 across the fourth to sixth work function patterns WF 4 to WF 6 .
  • a pair of gate spacers GS may be on opposite sidewalls of each of the first to sixth gate electrodes GE 1 to GE 6 .
  • the gate spacers GS may extend in the first direction D 1 along the first to sixth gate electrodes GE 1 to GE 6 .
  • the gate spacers GS may have top surfaces higher than those of the first to sixth gate electrodes GE 1 to GE 6 .
  • the first to sixth work function patterns WF 1 to WF 6 on the first and second channel patterns CH 1 and CH 2 may extend in the third direction D 3 along inner walls of the gate spacers GS.
  • the gate spacers GS may include one or more of SiCN, SiCON, and SiN.
  • the gate spacers GS may include a multi-layer consisting of two or more of SiCN, SiCON, and SiN.
  • Gate capping layers CP may be on the first to sixth gate electrodes GE 1 to GE 6 .
  • the gate capping layers CP may extend in the first direction D 1 along the first to sixth gate electrodes GE 1 to GE 6 .
  • the gate capping layers CP may have top surfaces coplanar with those of the gate spacers GS.
  • the gate capping layers CP may include a material having an etch selectivity to a first interlayer dielectric layer 110 , which will be discussed below.
  • the gate capping layers CP may include one or more of SiON, SiCN, SiCON, and SiN.
  • Barrier insulation patterns BP may be between the first and second source/drain patterns SD 1 and SD 2 and the first to sixth gate electrodes GE 1 to GE 6 .
  • the barrier insulation patterns BP may be either between the first semiconductor patterns NS 1 vertically spaced apart from each other or between the second semiconductor patterns NS 2 vertically spaced apart from each other.
  • the barrier insulation patterns BP may electrically insulate the first to sixth gate electrodes GE 1 to GE 6 from the first and second source/drain patterns SD 1 and SD 2 .
  • the first to third spaces SP 1 to SP 3 may be defined by a pair of barrier insulation patterns BP horizontally adjacent to each other and a pair of the first semiconductor patterns NS 1 vertically adjacent to each other, and the fourth to sixth spaces SP 4 to SP 6 may be defined by a pair of the barrier insulation patterns BP horizontally adjacent to each other and a pair of the second semiconductor patterns NS 2 vertically adjacent to each other.
  • the barrier insulation patterns BP may include, for example, a silicon nitride layer.
  • An interface layer IL may be provided to surround each of the first and second semiconductor patterns NS 1 and NS 2 .
  • the interface layers IL may cover, e.g. directly cover, the first and second semiconductor patterns NS 1 and NS 2 .
  • the interface layers IL may include, for example, a silicon oxide layer.
  • Gate dielectric layers GI may be between the first and second semiconductor patterns NS 1 and NS 2 and the first to sixth gate electrodes GE 1 to GE 6 . Each of the gate dielectric layers GI may conformally fill a portion of a corresponding one of the first to sixth spaces SP 1 to SP 6 .
  • the gate dielectric layers GI may include a high-k dielectric material whose dielectric constant is greater than that of a silicon oxide layer.
  • the high-k dielectric material may include one or more of hafnium oxide, hafnium silicon oxide, lanthanum oxide, zirconium oxide, zirconium silicon oxide, tantalum oxide, titanium oxide, barium strontium titanium oxide, barium titanium oxide, strontium titanium oxide, lithium oxide, aluminum oxide, lead scandium tantalum oxide, and lead zinc niobate.
  • the second transistor TR 2 may have a threshold voltage greater than, e.g. greater in absolute value than, that of the first transistor TR 1
  • the third transistor TR 3 may have a threshold voltage greater than, e.g. greater in absolute value than, that of the second transistor TR 2 .
  • the first work function pattern WF 1 of the first transistor TR 1 may include a first work function metal layer W 1 .
  • the second work function pattern WF 2 of the second transistor TR 2 may include a same, or substantially, same first work function metal layer W 1 .
  • the material included in the first work function pattern WF 1 may be the same, or substantially the same, as that included in the second work function pattern WF 2 .
  • the first work function metal layer W 1 may be or may include a metal nitride layer having a relatively high work function.
  • the first work function metal layer W 1 may be a titanium nitride (TiN) layer or a titanium oxynitride (TiON) layer.
  • a work function control liner CL may be between the second work function pattern WF 2 and the first semiconductor patterns NS 1 .
  • the work function control liner CL may generate a dipole, and thus a threshold voltage of the second transistor TR may be increased due to variation in energy band caused by the dipole.
  • the work function control liner CL may include a high-k dielectric material whose dielectric constant is greater than that of a silicon oxide layer.
  • the work function control liner CL may include metal oxide such as lanthanum oxide or aluminum oxide.
  • the work function control liner CL may cause the second transistor TR 2 to have a threshold voltage greater than, e.g. greater in absolute value than, that of the first transistor TR 1 .
  • the third work function pattern WF 3 of the third transistor TR 3 may include a first work function metal layer W 1 , a second work function metal layer W 2 , and other first work function metal layer W 1 sequentially stacked on the first semiconductor pattern NS 1 .
  • the second work function metal layer W 2 may have a thickness greater than that of each of the first work function metal layers W 1 .
  • the second work function metal layer W 2 may be a metal nitride layer whose work function is less than that of the first work function metal layer W 1 .
  • the second work function metal layer W 2 may be a silicon-doped titanium nitride (TiSiN) layer, a silicon-doped tantalum nitride (TaSiN) layer, an aluminum-doped titanium nitride (TiAlN) layer, or an aluminum-doped tantalum nitride (TaAlN) layer.
  • TiSiN silicon-doped titanium nitride
  • TaSiN silicon-doped tantalum nitride
  • TiAlN aluminum-doped titanium nitride
  • TaAlN aluminum-doped tantalum nitride
  • the work function of the second work function metal layer W 2 may be altered by controlling a concentration of dopants such as silicon and/or aluminum.
  • the third work function pattern WF 3 may be controlled in work function by adjustment of an impurity concentration in the second work function metal layer W 2 .
  • the second work function metal layer W 2 may have an impurity concentration (e.g., a silicon and/or aluminum concentration) in a range from about 10 at % to about 30 at %.
  • the first to third spaces SP 1 to SP 3 filled with the first to third work function patterns WF 1 to WF 3 may have the same, or substantially the same, size as each other. Accordingly, the first to third work function patterns WF 1 to WF 3 filled between the first semiconductor patterns NS 1 may have the same, or substantially the same, thickness (e.g., a length in the third direction D 3 of the first to third work function patterns WF 1 to WF 3 ). In some embodiments, the work function control liner CL may be employed to cause the first to third work function patterns WF 1 to WF 3 to have different work functions from each other.
  • a combination of a plurality of work function metal layers may be employed to cause the first to third work function patterns WF 1 to WF 3 to have different work functions from each other.
  • the second work function metal layer W 2 may be controlled in doping concentration to cause the first to third work function patterns WF 1 to WF 3 to have different work functions from each other.
  • the fifth transistor TR 5 may have a threshold voltage greater than that of the fourth transistor TR 4
  • the sixth transistor TR 6 may have a threshold voltage greater than that of the fifth transistor TR 5 .
  • the fourth work function pattern WF 4 of the fourth transistor TR 4 may include a first work function metal layer W 1 and a third work function metal layer W 3 stacked, e.g. sequentially stacked, on the second semiconductor pattern NS 2 .
  • the fifth work function pattern WF 5 of the fifth transistor TR 5 may include a first work function metal layer W 1 and a third work function metal layer W 3 sequentially stacked on the second semiconductor pattern NS 2 .
  • the material included in the fourth work function pattern WF 4 may be the same, or substantially the same, as that included in the fifth work function pattern WF 5 .
  • the third work function metal layer W 3 may be or include a work function metal layer used in an NMOSFET, and may be or include a metal layer having a relatively low work function.
  • the third work function metal layer W 3 may be or include a TiAlC layer.
  • a work function control liner CL may be between the fourth work function pattern WF 4 and the second semiconductor patterns NS 2 .
  • the work function control liner CL of the fourth transistor TR 4 may be the same, or substantially the same, as the work function control liner CL of the second transistor TR discussed above.
  • the work function control liner CL of the fourth transistor TR may generate a dipole, and in contrast to the PMOSFET, the fourth transistor TR 4 as the NMOSFET may decrease in threshold voltage.
  • the work function control liner CL may cause the fifth transistor TR 5 to have a threshold voltage greater than that of the fourth transistor TR 4 .
  • the sixth work function pattern WF 6 of the sixth transistor TR 6 may include a first work function metal layer W 1 , a second work function metal layer W 2 , other first work function metal layer W 1 , and a third work function metal layer W 3 sequentially stacked on the second semiconductor pattern NS 2 .
  • the second work function metal layer W 2 of the sixth work function pattern WF 6 may have a thickness less than that of the second work function metal layer W 2 of the third work function pattern WF 3 .
  • a combination of work function metal layers W 1 , W 2 , W 1 , and W 3 may be employed to cause the sixth work function pattern WF 6 to have a work function different from those of the fourth and fifth work function patterns WF 4 and WF 5 .
  • the sixth transistor TR 6 may have a threshold voltage greater than that of the fifth transistor TR 5 .
  • a work function control liner CL may be between the sixth work function pattern WF 6 and the second semiconductor patterns NS 2 .
  • the work function control liner CL may prevent the sixth transistor TR 6 from excessively increasing its threshold voltage.
  • a first interlayer dielectric layer 110 may be provided on an entire surface of the substrate 100 .
  • the first interlayer dielectric layer 110 may cover, e.g. directly cover, the device isolation layer ST, the first to sixth gate electrodes GE 1 to GE 6 , and the first and second source/drain patterns SD 1 and SD 2 .
  • the first interlayer dielectric layer 110 may have a top surface coplanar, or substantially coplanar, with those of the gate capping layers GP.
  • the first interlayer dielectric layer 110 may include a silicon oxide layer or a silicon oxynitride layer.
  • contacts may be provided to penetrate the first interlayer dielectric layer 110 to come into contact with the first and second source/drain patterns SD 1 and SD 2 .
  • the contacts may include a metallic material such as T 1 , W, and Ta.
  • FIGS. 3, 5, 7, and 9 illustrate plan views showing a method of manufacturing a semiconductor device according to some example embodiments of inventive concepts.
  • FIGS. 4A, 6A, 8A, and 10A illustrate cross-sectional views taken along line A-A′ of FIGS. 3, 5, 7 , and 9 , respectively.
  • FIGS. 4B, 6B, 8B, and 10B illustrate cross-sectional views taken along line B-B′ of FIGS. 3, 5, 7, and 9 , respectively.
  • FIG. 10C illustrates a cross-sectional view taken along line C-C′ of FIG. 9 .
  • FIG. 10D illustrates a cross-sectional view taken along line D-D′ of FIG. 9 .
  • FIGS. 11 to 14 illustrate cross-sectional views showing a method of forming first to third gate electrodes according to some example embodiments of inventive concepts.
  • sacrificial layers 120 and semiconductor layers 130 may be alternately and repeatedly stacked on an entire surface of a substrate 100 .
  • the semiconductor layers 130 may be repeatedly stacked three times, but inventive concepts are not limited thereto.
  • the sacrificial layers 120 may include a material having an etch selectivity to the semiconductor layers 130 .
  • the semiconductor layers 130 may include a material that is not etched in a process where the sacrificial layers 120 are etched.
  • an etch rate ratio of the sacrificial layers 120 to the semiconductor layers 130 may fall within a range from about 10:1 to about 200:1.
  • the sacrificial layers 120 may include SiGe or Ge, and the semiconductor layers 130 may include Si.
  • the sacrificial layers 120 and the semiconductor layers 130 may be formed by an epitaxial growth process in which the substrate 100 is used as a seed layer.
  • the sacrificial layers 120 and the semiconductor layers 130 may be successively formed in the same chamber, for example, the same CVD chamber.
  • the sacrificial layers 120 and the semiconductor layers 130 may be conformally formed on the entire surface of the substrate 100 .
  • the sacrificial layers 120 , the semiconductor layers 130 , and the substrate 100 may be patterned to form a first preliminary active pattern PAP 1 and a second preliminary active pattern PAP 2 .
  • the patterning process may also etch an upper portion of the substrate 100 to form first and second upper patterns UP 1 and UP 2 .
  • the first and second preliminary active patterns PAP 1 and PAP 2 may be respectively on the first and second upper patterns UP 1 and UP 2 .
  • the first and second preliminary active patterns PAP 1 and PAP 2 may have a linear or bar shape extending in a second direction D 2 .
  • trenches may be formed on opposite sides of each of the first and second upper patterns UP 1 and UP 2 .
  • a device isolation layer ST may be formed to fill the trenches.
  • the formation of the device isolation layer ST may include forming an insulation layer on the entire surface of the substrate 100 and recessing the insulation layer until the first and second preliminary active patterns PAP 1 and PAP 2 are completely exposed. Accordingly, the device isolation layer ST may have a top surface lower than those of the first and second upper patterns UP 1 and UP 2 .
  • sacrificial gate patterns 140 may be formed to run across the first and second preliminary active patterns PAP 1 and PAP 2 .
  • the sacrificial gate patterns 140 may be formed to have a linear or bar shape extending in a first direction D 1 .
  • Gate mask patterns MP may correspondingly be formed on the sacrificial gate patterns 140 .
  • the formation of the sacrificial gate patterns 140 and the gate mask patterns MP may include sequentially forming on the substrate 100 a sacrificial gate layer and a gate mask layer, and sequentially patterning the gate mask layer and the sacrificial gate layer.
  • the sacrificial gate layer may include polysilicon.
  • the gate mask layer may include a silicon nitride layer and/or a silicon oxynitride layer.
  • a pair of gate spacers GS may be formed on opposite sidewalls of each of the sacrificial gate patterns 140 .
  • the gate spacers GS may include one or more of SiCN, SiCON, and SiN.
  • the formation of the gate spacers GS may include forming a spacer layer by a deposition process such as CVD or atomic layer deposition (ALD) and performing an anisotropic etching process on the spacer layer.
  • the first and second preliminary active patterns PAP 1 and PAP 2 may be patterned to respectively form first and second channel patterns CH 1 and CH 2 .
  • the first and second preliminary active patterns PAP 1 and PAP 2 may be patterned using the gate mask patterns MP and the gate spacers GS as an etching mask.
  • the first and second upper patterns UP 1 and UP 2 may therefore be partially exposed through the gate mask patterns MP and the gate spacers GS.
  • the sacrificial layers 120 of the first and second preliminary active patterns PAP 1 and PAP 2 may be patterned to form sacrificial patterns 125 .
  • the semiconductor layers 130 of the first and second preliminary active patterns PAP 1 and PAP 2 may be patterned to form first and second semiconductor patterns NS 1 and NS 2 .
  • the first semiconductor patterns NS 1 may be included in the first channel pattern CH 1
  • the second semiconductor patterns NS 2 may be included in the second channel pattern CH 2 .
  • exposed portions of the sacrificial patterns 125 may be horizontally removed to form depression regions DR.
  • the formation of the depression regions DR may include performing an etching process using an etch source that exhibits an etch selectivity to the sacrificial patterns 125 .
  • the etching process may include a wet etching process.
  • the formation of the depression regions DR may include performing an etching process with an etchant including peracetic acid.
  • Barrier insulation patterns BP may be formed to fill the depression regions DR.
  • the barrier insulation patterns BP may be vertically spaced apart from each other across the first and second semiconductor patterns NS 1 and NS 2 .
  • a barrier insulation layer may be conformally formed on the entire surface of the substrate 100 .
  • the barrier insulation layer may fill the depression regions DR. After that, the barrier insulation layer may be etched until the barrier insulation patterns BP remain locally in the depression regions DR.
  • First source/drain patterns SD 1 may be formed on opposite sides of each of the first channel patterns CH 1 .
  • Second source/drain patterns SD 2 may be formed on opposite sides of each of the second channel patterns CH 2 .
  • a selective epitaxial process may be performed using the first semiconductor patterns NS 1 and the first upper pattern UP 1 as a seed layer, thereby forming the first source/drain patterns SD 1 .
  • the first channel patterns CH 1 and the first source/drain patterns SD 1 may be connected to each other to be included in a first active pattern AP 1 extending in the second direction D 2 .
  • the first source/drain patterns SD 1 may be formed of a material that provides compressive strain to the first channel patterns CH 1 .
  • the first source/drain patterns SD 1 may include SiGe whose lattice constant is greater than that of Si. Accordingly a mobility of carriers, e.g. hole mobility, may increase in a channel during operation of the transistor.
  • the first source/drain patterns SD 1 may be doped with P-type impurities, for example, boron (B).
  • a selective epitaxial process may be performed using the second semiconductor patterns NS 2 and the second upper pattern UP 2 as a seed layer, thereby forming the second source/drain patterns SD 2 .
  • the second channel patterns CH 2 and the second source/drain patterns SD 2 may be connected to each other to be included in a second active pattern AP 2 extending in the second direction D 2 .
  • the second source/drain patterns SD 2 may be formed of Si.
  • the second source/drain patterns SD 2 may be doped with N-type impurities, for example, phosphorus (P) and/or arsenic (As).
  • a first interlayer dielectric layer 110 may be formed on the entire surface of the substrate 100 . Thereafter, a planarization process may be performed on the first interlayer dielectric layer 110 until top surfaces of the sacrificial gate patterns 140 are exposed.
  • the planarization process may include an etch-back process and/or a chemical mechanical polishing (CMP) process.
  • CMP chemical mechanical polishing
  • the gate mask patterns MP may also be removed.
  • the first interlayer dielectric layer 110 may be formed of a silicon oxide layer or a silicon oxynitride layer.
  • the planarization process may selectively remove the exposed sacrificial gate patterns 140 .
  • first to sixth trenches TC 1 to TC 6 may be respectively formed on first to sixth regions RG 1 to RG 6 of the substrate 100 .
  • the first to sixth trenches TC 1 to TC 6 may expose the first and second channel patterns CH 1 and CH 2 .
  • the first to sixth trenches TC 1 to TC 6 may also expose the sacrificial patterns 125 .
  • the exposed sacrificial patterns 125 may be selectively removed, for example, with a wet etching process.
  • the selective etching process may be performed using an etchant including peracetic acid.
  • the etchant may further include a hydrofluoric acid (HF) solution and a deionized water.
  • the first and second source/drain patterns SD 1 and SD 2 may be covered with the barrier insulation patterns BP and the first interlayer dielectric layer 110 , and may thereby be protected from the etching process.
  • the sacrificial patterns 125 may be removed to form first to sixth spaces SP 1 to SP 6 on the first to sixth regions RG 1 to RG 6 .
  • the first to sixth spaces SP 1 to SP 6 may be respectively spatially connected to the first to sixth trenches TC 1 to TC 6 to expose the first and second semiconductor patterns NS 1 and NS 2 .
  • first to sixth gate electrodes GE 1 to GE 6 may be respectively formed in the first to sixth trenches TC 1 to TC 6 .
  • the formation of the first to sixth gate electrodes GE 1 to GE 6 will be discussed below with reference to FIGS. 11 to 14 .
  • Gate capping layers CP may be formed on the first to sixth gate electrodes GE 1 to GE 6 .
  • the gate capping layers CP may include one or more of SiON, SiCN, SiCON, and SiN.
  • contacts may be formed to penetrate the first interlayer dielectric layer 110 to come into contact with the first and second source/drain patterns SD 1 and SD 2 .
  • first to sixth gate electrodes GE 1 to GE 6 in the first to sixth trenches TC 1 to TC 6 will be discussed below with reference to FIGS. 11 to 14 .
  • the formation of the first to third gate electrodes GE 1 to GE 3 will be representatively described below.
  • an oxidation process using plasma may be performed on the first semiconductor patterns NS 1 exposed to the first to third trenches TC 1 to TC 3 , and therefore interface layers IL may be grown from the exposed first semiconductor patterns NS 1 .
  • the interface layers IL may surround, e.g. directly surround, surfaces of the exposed first semiconductor patterns NS 1 .
  • the formation of the interface layer IL may include a thermal oxidation process and/or a chemical oxidation process.
  • the oxidation process may use one or more of oxygen plasma, ozone plasma, and vapor plasma.
  • the interface layers IL may include, for example, a silicon oxide layer.
  • Gate dielectric layers GI may be conformally formed on the interface layers IL.
  • the gate dielectric layers GI may partially fill the first to third spaces SP 1 to SP 3 of the first to third trenches TC 1 to TC 3 .
  • the gate dielectric layers GI may directly cover the barrier insulation patterns BP and the interface layers IL.
  • the gate dielectric layers GI may be formed using a high-k dielectric material whose dielectric constant is greater than that of a silicon oxide layer.
  • a first mask pattern MA 1 may be formed on the first and second regions RG 1 and RG 2 .
  • the first mask pattern MA 1 may selectively expose the third region RG 3 .
  • the first mask pattern MA 1 may fill, e.g. completely fill, the first and second trenches TC 1 and TC 2 .
  • the first mask pattern MA 1 may not fill the third trench TC 3 .
  • a third work function pattern WF 3 may be formed in the third trench TC 3 selectively exposed through the first mask pattern MA 1 .
  • the third work function pattern WF 3 may be formed to completely fill the third space SP 3 of the third trench TC 3 .
  • the formation of the third work function pattern WF 3 may include conformally forming a first work function metal layer W 1 in the third trench TC 3 , conformally forming a second work function metal layer W 2 in the third trench TC 3 , conformally forming other first work function metal layer W 1 in the third trench TC 3 , and recessing upper portions of the first and second work function metal layers W 1 and W 2 .
  • the first and second work function metal layers W 1 and W 2 may be formed by a deposition process such as ALD.
  • the first work function metal layer W 1 may be or include a metal nitride layer having a relatively higher work function
  • the second work function metal layer W 2 may be or include a metal nitride layer having a relatively lower work function that that of the first work function metal layer W 1 .
  • the first mask pattern MA 1 may be removed.
  • a second mask pattern MA 2 may be formed on the first and third regions RG 1 and RG 3 .
  • the second mask pattern MA 2 may selectively expose the second region RG 2 .
  • the second mask pattern MA 2 may fill, e.g. completely fill, the first and third trenches TC 1 and TC 3 .
  • the second mask pattern MA 2 may not fill the second trench TC 2 .
  • a work function control liner CL and a second work function pattern WF 2 may be sequentially formed in the second trench TC 2 selectively exposed through the second mask pattern MA 2 .
  • the second work function pattern WF 2 may be formed to fill, e.g. completely fill, the second space SP 2 of the second trench TC 2 .
  • the work function control liner CL may be conformally formed by a deposition process such as ALD.
  • the work function control liner CL may be formed using a high-k dielectric material whose dielectric constant is greater than that of a silicon oxide layer.
  • the formation of the second work function pattern WF 2 may include conformally forming a first work function metal layer W 1 in the second trench TC 2 and recessing an upper portion of the first work function metal layer W 1 .
  • the second mask pattern MA 2 may be removed.
  • a third mask pattern MA 3 may be formed on the second and third regions RG 2 and RG 3 .
  • the third mask pattern MA 3 may selectively expose the first region RG 1 .
  • the third mask pattern MA 3 may fill, e.g. completely fill, the second and third trenches TC 2 and TC 3 .
  • the third mask pattern MA 3 may not fill the first trench TC 1 .
  • a first work function pattern WF 1 may be formed in the first trench TC 1 selectively exposed through the third mask pattern MA 3 .
  • the first work function pattern WF 1 may be formed to completely fill the first space SP 1 of the first trench TC 1 .
  • the formation of the first work function pattern WF 1 may include conformally forming a first work function metal layer W 1 in the first trench TC 1 and recessing an upper portion of the first work function metal layer W 1 .
  • First to third electrode patterns EL 1 to EL 3 may be respectively formed in the first to third trenches TC 1 to TC 3 .
  • the first to third electrode patterns EL 1 to EL 3 may be respectively formed on the first to third work function patterns WF 1 to WF 3 .
  • the first to third electrode patterns EL 1 to EL 3 may be formed using a low resistance, or low resistivity, metal.
  • Fourth to sixth gate electrodes GE 4 to GE 6 may be formed using formation methods similar to those of the first to third gate electrodes GE 1 to GE 3 discussed above with reference to FIGS. 11 to 14 .
  • gate-all-around type transistors having different threshold voltages from each other may be selectively formed on the first to sixth regions RG 1 to RG 6 .
  • FIG. 15 illustrates an enlarged cross-sectional view of section M of FIG. 2B , partially showing a sixth transistor of a semiconductor device according to some example embodiments of inventive concepts.
  • FIGS. 1 and 2A to 2D a detailed description of technical features repetitive to those formerly discussed with reference to FIGS. 1 and 2A to 2D will be omitted and differences will be discussed in detail.
  • the sixth gate electrode GE 6 may include layers whose thicknesses are different from each other.
  • the first work function metal layer W 1 of the sixth work function pattern WF 6 may have a thickness greater than that of the second work function metal layer W 2 of the sixth work function pattern WF 6 .
  • at least one of the first work function metal layers W 1 may have a first thickness T 1
  • the second work function metal layer W 2 may have a second thickness T 2 .
  • the first thickness T 1 may be greater than the second thickness T 2 .
  • the third work function metal layer W 3 of the sixth work function pattern WF 6 may have a thickness greater than that of each of the first and second work function metal layers W 1 and W 2 of the sixth work function pattern WF 6 .
  • the third work function metal layer W 3 may have a third thickness T 3 .
  • the third thickness T 3 may be greater than the first thickness T 1 .
  • a semiconductor device may be configured such that the gate-all-around type transistors are achieved to have various threshold voltages caused by a combination of work function metal layers.

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