TWM525567U - 電接口 - Google Patents

電接口 Download PDF

Info

Publication number
TWM525567U
TWM525567U TW104217534U TW104217534U TWM525567U TW M525567 U TWM525567 U TW M525567U TW 104217534 U TW104217534 U TW 104217534U TW 104217534 U TW104217534 U TW 104217534U TW M525567 U TWM525567 U TW M525567U
Authority
TW
Taiwan
Prior art keywords
contact
connection
electrical
contact surface
contact area
Prior art date
Application number
TW104217534U
Other languages
English (en)
Chinese (zh)
Inventor
Sandeep Sankararaman
Original Assignee
Rosenberger Hochfrequenztech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztech filed Critical Rosenberger Hochfrequenztech
Publication of TWM525567U publication Critical patent/TWM525567U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW104217534U 2014-11-06 2015-11-02 電接口 TWM525567U (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202014008844.6U DE202014008844U1 (de) 2014-11-06 2014-11-06 Elektrisches Interface

Publications (1)

Publication Number Publication Date
TWM525567U true TWM525567U (zh) 2016-07-11

Family

ID=52017724

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104217534U TWM525567U (zh) 2014-11-06 2015-11-02 電接口

Country Status (9)

Country Link
US (1) US10230183B2 (enExample)
EP (1) EP3216089B1 (enExample)
JP (1) JP6559790B2 (enExample)
KR (1) KR102246419B1 (enExample)
CN (1) CN107078423B (enExample)
CA (1) CA2963290A1 (enExample)
DE (1) DE202014008844U1 (enExample)
TW (1) TWM525567U (enExample)
WO (1) WO2016070992A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202014008844U1 (de) * 2014-11-06 2014-11-24 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Interface
DE202014009499U1 (de) * 2014-11-28 2015-01-16 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Winkelverbinder zur differentiellen Übertragung von Datensignalen
KR20230031546A (ko) 2021-08-27 2023-03-07 삼성전자주식회사 반도체 모듈용 모듈 기판 및 반도체 메모리 모듈

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6843657B2 (en) 2001-01-12 2005-01-18 Litton Systems Inc. High speed, high density interconnect system for differential and single-ended transmission applications
AU2003263799A1 (en) 2002-07-24 2004-02-09 Litton Systems, Inc. Interconnection system
SG120200A1 (en) * 2004-08-27 2006-03-28 Micron Technology Inc Slanted vias for electrical circuits on circuit boards and other substrates
TWI294682B (en) 2006-02-03 2008-03-11 Siliconware Precision Industries Co Ltd Semiconductor package substrate
WO2008105478A1 (ja) 2007-02-27 2008-09-04 Kyocera Corporation 配線基板、電気信号伝送システムおよび電子機器
US8324508B2 (en) 2008-03-28 2012-12-04 Kyocera Corporation Composite circuit board
JP5311653B2 (ja) 2009-04-28 2013-10-09 京セラＳｌｃテクノロジー株式会社 配線基板
US7850492B1 (en) 2009-11-03 2010-12-14 Panduit Corp. Communication connector with improved crosstalk compensation
CN102117993B (zh) 2009-12-30 2013-05-08 富士康(昆山)电脑接插件有限公司 电连接器
JP5595289B2 (ja) 2011-01-06 2014-09-24 富士通コンポーネント株式会社 コネクタ
CN102291931B (zh) * 2011-03-23 2013-12-18 威盛电子股份有限公司 差动对信号传输结构、线路板及电子模块
US8920199B2 (en) 2012-02-13 2014-12-30 Commscope, Inc. Of North Carolina Patch cord having a plug with differential transmission lines
TW201345209A (zh) * 2012-04-17 2013-11-01 Hon Hai Prec Ind Co Ltd 等化器
DE202014008844U1 (de) * 2014-11-06 2014-11-24 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Interface
DE202014009499U1 (de) 2014-11-28 2015-01-16 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Winkelverbinder zur differentiellen Übertragung von Datensignalen

Also Published As

Publication number Publication date
CN107078423B (zh) 2019-04-16
JP6559790B2 (ja) 2019-08-14
EP3216089B1 (de) 2019-02-13
EP3216089A1 (de) 2017-09-13
CA2963290A1 (en) 2016-05-12
US10230183B2 (en) 2019-03-12
WO2016070992A1 (de) 2016-05-12
KR102246419B1 (ko) 2021-05-03
KR20170082504A (ko) 2017-07-14
JP2017539068A (ja) 2017-12-28
CN107078423A (zh) 2017-08-18
US20170317438A1 (en) 2017-11-02
DE202014008844U1 (de) 2014-11-24

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees