KR102246419B1 - 전기 인터페이스 - Google Patents

전기 인터페이스 Download PDF

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Publication number
KR102246419B1
KR102246419B1 KR1020177008336A KR20177008336A KR102246419B1 KR 102246419 B1 KR102246419 B1 KR 102246419B1 KR 1020177008336 A KR1020177008336 A KR 1020177008336A KR 20177008336 A KR20177008336 A KR 20177008336A KR 102246419 B1 KR102246419 B1 KR 102246419B1
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KR
South Korea
Prior art keywords
connection
plane
electrical
contact surface
connection plane
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Active
Application number
KR1020177008336A
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English (en)
Korean (ko)
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KR20170082504A (ko
Inventor
산딥 산카라라만
Original Assignee
로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게
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Application filed by 로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게 filed Critical 로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게
Publication of KR20170082504A publication Critical patent/KR20170082504A/ko
Application granted granted Critical
Publication of KR102246419B1 publication Critical patent/KR102246419B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020177008336A 2014-11-06 2015-11-03 전기 인터페이스 Active KR102246419B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE202014008844.6 2014-11-06
DE202014008844.6U DE202014008844U1 (de) 2014-11-06 2014-11-06 Elektrisches Interface
PCT/EP2015/002212 WO2016070992A1 (de) 2014-11-06 2015-11-03 Elektrisches interface

Publications (2)

Publication Number Publication Date
KR20170082504A KR20170082504A (ko) 2017-07-14
KR102246419B1 true KR102246419B1 (ko) 2021-05-03

Family

ID=52017724

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177008336A Active KR102246419B1 (ko) 2014-11-06 2015-11-03 전기 인터페이스

Country Status (9)

Country Link
US (1) US10230183B2 (enExample)
EP (1) EP3216089B1 (enExample)
JP (1) JP6559790B2 (enExample)
KR (1) KR102246419B1 (enExample)
CN (1) CN107078423B (enExample)
CA (1) CA2963290A1 (enExample)
DE (1) DE202014008844U1 (enExample)
TW (1) TWM525567U (enExample)
WO (1) WO2016070992A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202014008844U1 (de) * 2014-11-06 2014-11-24 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Interface
DE202014009499U1 (de) * 2014-11-28 2015-01-16 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Winkelverbinder zur differentiellen Übertragung von Datensignalen
KR20230031546A (ko) 2021-08-27 2023-03-07 삼성전자주식회사 반도체 모듈용 모듈 기판 및 반도체 메모리 모듈

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258390A (ja) 2009-04-28 2010-11-11 Kyocer Slc Technologies Corp 配線基板
US20120243184A1 (en) 2011-03-23 2012-09-27 Via Technologies, Inc. Differential signal pair transmission structure, wiring board and electronic module

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6843657B2 (en) 2001-01-12 2005-01-18 Litton Systems Inc. High speed, high density interconnect system for differential and single-ended transmission applications
WO2004010749A2 (en) 2002-07-24 2004-01-29 Litton Systems, Inc. Interconnection system
US7083425B2 (en) * 2004-08-27 2006-08-01 Micron Technology, Inc. Slanted vias for electrical circuits on circuit boards and other substrates
TWI294682B (en) * 2006-02-03 2008-03-11 Siliconware Precision Industries Co Ltd Semiconductor package substrate
JP4942811B2 (ja) 2007-02-27 2012-05-30 京セラ株式会社 配線基板、電気信号伝送システムおよび電子機器
WO2009119849A1 (ja) 2008-03-28 2009-10-01 京セラ株式会社 複合配線基板
US7850492B1 (en) 2009-11-03 2010-12-14 Panduit Corp. Communication connector with improved crosstalk compensation
CN102117993B (zh) 2009-12-30 2013-05-08 富士康(昆山)电脑接插件有限公司 电连接器
JP5595289B2 (ja) 2011-01-06 2014-09-24 富士通コンポーネント株式会社 コネクタ
US8920199B2 (en) * 2012-02-13 2014-12-30 Commscope, Inc. Of North Carolina Patch cord having a plug with differential transmission lines
TW201345209A (zh) * 2012-04-17 2013-11-01 Hon Hai Prec Ind Co Ltd 等化器
DE202014008844U1 (de) * 2014-11-06 2014-11-24 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Interface
DE202014009499U1 (de) 2014-11-28 2015-01-16 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Winkelverbinder zur differentiellen Übertragung von Datensignalen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258390A (ja) 2009-04-28 2010-11-11 Kyocer Slc Technologies Corp 配線基板
US20120243184A1 (en) 2011-03-23 2012-09-27 Via Technologies, Inc. Differential signal pair transmission structure, wiring board and electronic module

Also Published As

Publication number Publication date
TWM525567U (zh) 2016-07-11
JP2017539068A (ja) 2017-12-28
JP6559790B2 (ja) 2019-08-14
CN107078423B (zh) 2019-04-16
EP3216089B1 (de) 2019-02-13
CA2963290A1 (en) 2016-05-12
EP3216089A1 (de) 2017-09-13
US20170317438A1 (en) 2017-11-02
KR20170082504A (ko) 2017-07-14
US10230183B2 (en) 2019-03-12
WO2016070992A1 (de) 2016-05-12
DE202014008844U1 (de) 2014-11-24
CN107078423A (zh) 2017-08-18

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