JP2010258390A - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP2010258390A JP2010258390A JP2009110056A JP2009110056A JP2010258390A JP 2010258390 A JP2010258390 A JP 2010258390A JP 2009110056 A JP2009110056 A JP 2009110056A JP 2009110056 A JP2009110056 A JP 2009110056A JP 2010258390 A JP2010258390 A JP 2010258390A
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- Prior art keywords
- pair
- semiconductor element
- connection pad
- external connection
- connection pads
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】 絶縁基板1の上面に形成された第1の半導体素子接続パッドのペア3aと絶縁基板1の下面に形成された第1の外部接続パッドのペア4aとを接続する第1の帯状配線導体のペア2aと、絶縁基板1の上面に形成された第2の半導体素子接続パッドのペア3bと絶縁基板1の下面に形成された第2の外部接続パッドのペア4bとを接続する第2の帯状配線導体のペア2bとが、間に接地導体層または電源導体層を挟んで互いに異なる絶縁層1b,1c上に形成されている。
【選択図】図2
Description
1a コア基板としての絶縁層
1b,1c ビルドアップ絶縁層としての絶縁層
2 配線導体層
2a 第1の帯状配線導体のペア
2b 第2の帯状配線導体のペア
3 半導体素子接続パッド
3a 第1の半導体素子接続パッドのペア
3b 第2の半導体素子接続パッドのペア
4 外部接続パッド
4a 第1の外部接続パッドのペア
4b 第2の外部接続パッドのペア
S 半導体素子
Claims (5)
- 複数の絶縁層が積層されて成る絶縁基板と、前記絶縁基板の上面に形成されており、第1の半導体素子接続パッドのペアおよび第2の半導体素子接続パッドのペアを含む複数の半導体素子接続パッドと、前記絶縁基板の下面に形成されており、第1の外部接続パッドのペアおよび第2の外部接続パッドのペアを含む複数の外部接続パッドと、前記絶縁層上に互いに隣接して延在するように形成されており、前記第1の半導体素子接続パッドのペアと前記第1の外部接続パッドのペアとの間を電気的に接続する第1の帯状配線導体のペアおよび前記第2の半導体素子接続パッドのペアと前記第2の外部接続パッドのペアとの間を電気的に接続する第2の帯状配線導体のペアとを具備して成る配線基板であって、前記第1の帯状配線導体のペアと前記第2の帯状配線導体のペアとが間に接地導体層または電源導体層を挟んで互いに異なる絶縁層上に形成されていることを特徴とする配線基板。
- 前記第1の帯状配線導体のペアと前記第2の帯状配線導体のペアとの間に、互いに異なる電位に接続される接地導体層または電源導体層が2層以上介在していることを特徴とする請求項2記載の配線基板。
- 前記絶縁基板は、上下面に接地導体層または電源導体層が被着されたコア基板の前記上下面にビルドアップ絶縁層を積層して成り、前記第1の帯状配線導体のペアと前記第2の帯状配線導体のペアとが、前記コア基板を挟んだ上下に分かれて形成されていることを特徴とする請求項1乃至3のいずれかに記載の配線基板。
- 前記第1の半導体素子接続パッドのペアと前記第2の半導体素子接続パッドのペアとの間に接地用または電源用の半導体素子接続パッドが介在していることを特徴とする請求項1乃至4のいずれかに記載の配線基板。
- 前記第1の外部接続パッドのペアと前記第2の外部接続パッドのペアとの間に接地用または電源用の外部接続パッドが介在していることを特徴とする請求項1乃至4のいずれかに記載の配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009110056A JP5311653B2 (ja) | 2009-04-28 | 2009-04-28 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009110056A JP5311653B2 (ja) | 2009-04-28 | 2009-04-28 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010258390A true JP2010258390A (ja) | 2010-11-11 |
JP5311653B2 JP5311653B2 (ja) | 2013-10-09 |
Family
ID=43318927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009110056A Expired - Fee Related JP5311653B2 (ja) | 2009-04-28 | 2009-04-28 | 配線基板 |
Country Status (1)
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JP (1) | JP5311653B2 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012119473A (ja) * | 2010-11-30 | 2012-06-21 | Kyocer Slc Technologies Corp | 配線基板 |
JP2013187249A (ja) * | 2012-03-06 | 2013-09-19 | Toppan Printing Co Ltd | 伝送線路構造、多層配線基板、半導体装置、および半導体システム |
JP2014007210A (ja) * | 2012-06-22 | 2014-01-16 | Kyocer Slc Technologies Corp | 配線基板 |
JP2014038971A (ja) * | 2012-08-18 | 2014-02-27 | Kyocer Slc Technologies Corp | 配線基板 |
TWI479956B (zh) * | 2010-12-09 | 2015-04-01 | Hon Hai Prec Ind Co Ltd | 具有高速差分訊號佈線結構的印刷電路板 |
JP2016139636A (ja) * | 2015-01-26 | 2016-08-04 | 京セラ株式会社 | 配線基板 |
US9565750B2 (en) | 2012-08-18 | 2017-02-07 | Kyocera Corporation | Wiring board for mounting a semiconductor element |
KR20170082504A (ko) * | 2014-11-06 | 2017-07-14 | 로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게 | 전기 인터페이스 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003218480A (ja) * | 2002-01-25 | 2003-07-31 | Mitsubishi Electric Corp | プリント配線板及びその製造方法 |
JP2004253746A (ja) * | 2002-12-26 | 2004-09-09 | Kyocera Corp | 配線基板 |
JP2005294383A (ja) * | 2004-03-31 | 2005-10-20 | Shinko Electric Ind Co Ltd | キャパシタ実装配線基板及びその製造方法 |
JP2005353835A (ja) * | 2004-06-10 | 2005-12-22 | Ngk Spark Plug Co Ltd | 配線基板 |
JP2008153542A (ja) * | 2006-12-19 | 2008-07-03 | Shinko Electric Ind Co Ltd | 多層配線基板 |
JP2008244179A (ja) * | 2007-03-27 | 2008-10-09 | Nec Corp | 多層配線基板 |
-
2009
- 2009-04-28 JP JP2009110056A patent/JP5311653B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003218480A (ja) * | 2002-01-25 | 2003-07-31 | Mitsubishi Electric Corp | プリント配線板及びその製造方法 |
JP2004253746A (ja) * | 2002-12-26 | 2004-09-09 | Kyocera Corp | 配線基板 |
JP2005294383A (ja) * | 2004-03-31 | 2005-10-20 | Shinko Electric Ind Co Ltd | キャパシタ実装配線基板及びその製造方法 |
JP2005353835A (ja) * | 2004-06-10 | 2005-12-22 | Ngk Spark Plug Co Ltd | 配線基板 |
JP2008153542A (ja) * | 2006-12-19 | 2008-07-03 | Shinko Electric Ind Co Ltd | 多層配線基板 |
JP2008244179A (ja) * | 2007-03-27 | 2008-10-09 | Nec Corp | 多層配線基板 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012119473A (ja) * | 2010-11-30 | 2012-06-21 | Kyocer Slc Technologies Corp | 配線基板 |
TWI479956B (zh) * | 2010-12-09 | 2015-04-01 | Hon Hai Prec Ind Co Ltd | 具有高速差分訊號佈線結構的印刷電路板 |
JP2013187249A (ja) * | 2012-03-06 | 2013-09-19 | Toppan Printing Co Ltd | 伝送線路構造、多層配線基板、半導体装置、および半導体システム |
JP2014007210A (ja) * | 2012-06-22 | 2014-01-16 | Kyocer Slc Technologies Corp | 配線基板 |
JP2014038971A (ja) * | 2012-08-18 | 2014-02-27 | Kyocer Slc Technologies Corp | 配線基板 |
US9565750B2 (en) | 2012-08-18 | 2017-02-07 | Kyocera Corporation | Wiring board for mounting a semiconductor element |
KR20170082504A (ko) * | 2014-11-06 | 2017-07-14 | 로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게 | 전기 인터페이스 |
JP2017539068A (ja) * | 2014-11-06 | 2017-12-28 | ローゼンベルガー ホーフフレクベンツテクニーク ゲーエムベーハー ウント ツェーオー カーゲー | 電気的インターフェース |
US10230183B2 (en) | 2014-11-06 | 2019-03-12 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Electrical interposer |
KR102246419B1 (ko) | 2014-11-06 | 2021-05-03 | 로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게 | 전기 인터페이스 |
JP2016139636A (ja) * | 2015-01-26 | 2016-08-04 | 京セラ株式会社 | 配線基板 |
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