TWM258332U - Heat sink assembly - Google Patents

Description

M258332 V. Creation Description (1) [Technical Field to which the New Type belongs] This creation is about a heat sink assembly, especially a heat sink assembly used to exclude heat generated by heating electronic components. [Prior art]

As the output power and operating frequency of electronic components such as the central processing unit continue to increase, the corresponding amount of heat generated is also significantly increased. If the heat generated by them is not eliminated in time, it will lead to heat accumulation and increase the temperature, which will seriously affect the electronic components. The normal operation. For this reason, the industry usually installs a heat dissipation device on the surface of these heat-generating electronic components to assist heat dissipation, and at the same time, a fan is installed on the heat dissipation device to enhance the heat dissipation effect. In order to securely install the heat sink on the surface of the heat-generating electronic component, it is usually necessary to make the heat sink close to the heat-generating electronic component carried on the circuit board by means of the auxiliary fastening of the buckle device. Generally, once the fastening device is used in conjunction with the heat sink, the two are relatively positioned. When the buckle is fastened to the circuit board, the orientation of the heat sink is relatively fixed, and the orientation of the heat sink cannot be achieved. Make adjustments.

However, the design and layout of different systems, such as desktop computer systems or notebook computer systems, and whether there is a system fan in the same system, or different air intake and exhaust hole locations, will cause different airflow directions in the system, causing the same The heat dissipating performance of the heat dissipating device is very different, which brings the need for adjusting the orientation of the heat dissipating device. Therefore, how to make the orientation of the heat sink easy to adjust to suit different system designs or different airflow directions and heat dissipation needs to optimize the overall heat dissipation performance has always been a problem that the industry expects to solve.

Page 5 M258332 V. Creation Instructions C2) [Content] The different music systems of this creation are adjusted to the required creation. The heat sink is equipped with a base that includes a small end and abuts against the base of the thermal device along the direction of the air flow parallel to the basic creation. To the desired orientation [the embodiment is explained in the following. See the heat generated by 10 and a buckle (not shown). The central processor, the heat sink, the heat sink, the heat sink, the heat sink, the heat sink, and the base. The heat dissipating device includes a large end of the heat dissipating device and the heat dissipating seat in the direction of the large seat, so as to provide a heat dissipating device combination, which can be conveniently arranged for different airflow directions and heat dissipation needs. A fastening device base and a heat sink located above the base, and a small end 'the fastening device can pass through the end of the base' and the fastening device and the base are provided with an upper part Adjusting mechanism for adjusting the orientation of the heat sink. The installation combination can be designed for different systems or different needs. By adjusting the settings on the fastening device and the dispersing adjustment mechanism, the heat dissipating device can be easily and conveniently adjusted. A further detailed diagram of the cooperation of the creative cooling device group with the accompanying drawings is as follows: The creative cooling device combination includes a cooling device set 20, and the fan pack is installed, ^ ^… is set to 0 to exclude hot electrons installed on the circuit board. The components (the same soil-N ^ ^ Figures are not shown) as the central processing unit, the fastening device 20 is used to fix Xi will also strong ^ scar Α fix the heat sink 10 to the upper 0 clothes 1 including- The base 11 is composed of a plurality of flat and several round heat pipes 14-a heat sink and a fan, including a large end 111 and a small end located above the large end m.

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M258332

V. Creative Instructions (3) 113, the big end 111 and the small end 113 are both cylindrical, and a joint is formed at the connection between the two. The lower surface of the big end 111 is used to contact the central processing unit. A plurality of grooves 115 are arranged in parallel on the upper surface of 1-13. The heat sink 丨 3 and the heat pipe 14 are located above the base 11, wherein the heat sink 13 is parallel to the upper surface of the small end 113, and each heat pipe 14 is in an "L " shape and can be fixed through the heat sink 1 3 The fan 15 is disposed on the side of the heat sink 13, and two fixing brackets 17 for fixing the fan 15 are provided between the two. The fastening device 20 has a central opening 21 and an outer ring 23 And a plurality of buckle arms 2 5 'extending outwardly from the outer ring 2 3 are provided at the near ends of each buckle arm 25 with perforations 27 that cooperate with screw members 26 such as screws, etc. In addition, the outer circle The ring 23 is provided with a braking pin 28 for horizontal penetration through the ring wall = two fixing holes 29. Please refer to the first to third figures. During assembly, the outer ring 23 of the fastening device 20 passes through from top to bottom. The small end 113 of the base U abuts on the boss connected to the large end ui, the brake pin 28 passes through the fixing hole 29 of the outer ring 23 and abuts on the outer peripheral surface of the end 113 to make the outer circle The ring 23 remains relatively fixed to the small end u 3.

One end of the Ln-shaped heat element 14 passes through and is fixed to a through hole (not shown) of the stacked heat sink 丨 3, and the fan 15 is installed on the side of the heat sink 13 through two fixing brackets 17. The other end of the heat pipe 1 4 is exposed at the bottom end of the heat sink 丨 3 and can be attached to the groove 11 5 of the small end 11 3. For good contact, the combination of the heat pipe 丨 4 and the heat sink 丨 3 or the groove 115 can be passed. Welding or interference fit. The screwing members 26 can pass through the holes 27 of the buckle arm 25 and be further fixed on the circuit board. Of course, they can also be fixed to other components, such as through the circuit board and fixed on the circuit board.

Page 7 M258332 V. Creative Instructions (4) " The back plate (not shown) below, so that the heat sink j 〇 is firmly fixed to the CPU, so that the heat generated by the CPU can be conducted 1 It is transmitted to the base 11 ′ and transmitted to the heat sink 1 1 3 through the heat pipe 1 4. Please refer to the third and fourth diagrams. For different system designs or different airflow directions and heat dissipation needs, the heat sink is installed. Before the final fastening to the heating electronic component, the position of the fastening device 20 can be kept still,

Adjust the positioning of the outer peripheral surface of the moving pin 2 8 and the base 1 1 small end 1 1 3, and freely adjust the scattered center 1 to the desired orientation in a direction parallel to the base, so that the system and the heat sink 1 can achieve heat dissipation. Performance optimization. Of course, to achieve the adjustment of the orientation of the heat sink device 10, other adjustment mechanisms other than the above-mentioned brake pin 28 can be used. For example, the central opening 21a of the ring 23a is correspondingly set as a polygon except for the fifth figure. After passing the small end 113 and abutting on the large end U1, the outer ring ^, the top surface and the upper surface of the small end 11 3 or the fish / # & — the jacket φ times and the heat sink 13 at the bottom end hold the sheep Move away to leave enough space for the outer ring 23a to move up. After the outer ring 23a moves up and is temporarily separated from the polygon structure, the movement =

The buyer then advises the outer circle to be moved down and re-fixed to the base lu device = Convenient = The heat sink device 10 realizes that the smallest unit is one side. Two: Square: f positive. The adjustment mechanism shown in Fig. 6 is similar to that in the fifth picture, and the only two: the polygonal structure of the meshed meshes is replaced by the meshing parts 117 and 237, so that the heat sink 10 can achieve the most directional adjustment. ^ Indexing teeth

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Page 9 M258332 Simple illustration of the drawing [Simple illustration of the drawing] The first drawing is a three-dimensional exploded view of the first embodiment of the creative heat sink assembly. The second drawing is a pre-assembled drawing of the first drawing. The third figure is a perspective view after the first figure is assembled. The fourth picture is similar to the third picture, but the heat sink is adjusted to another orientation. The fifth figure is the second embodiment of the adjusting mechanism in the creative heat sink assembly. The sixth diagram is the third embodiment of the adjusting mechanism in the creative heat sink assembly. [Simple description of component representative symbols] Radiator 10 Base 1 1, 1 la Large end 111 Small end 113 Groove 115 Polygonal structure 116 Indexing tooth 1 17, 237 Radiator 13 Stern tube 14 Fan 15 Fixing frame 17 Fastening device 20 Opening hole 21, 21a Outer ring 23, 23a Buckle arm 25 Screw connection 26 Perforation 27 Brake pin 28 Fixture L 29

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Claims (1)

M258332 6. Scope of patent application 1. A heat dissipation device combination including a heat dissipation device and a fastening device. The heat dissipation device includes a base and a heat sink located above the base. The base includes a large end and a heat sink. Small end, the fastening device can pass through the small end of the base and abut against the large end, and the fastening device and the base are provided with a position that can adjust the orientation of the heat sink in a direction parallel to the base. Adjustment mechanism. 2. The heat-dissipating device combination according to item 1 of the patent application scope, wherein the upper surface of the small end is provided with a groove. 3. The heat-dissipating device combination according to item 2 of the scope of the patent application, wherein the heat-dissipating body includes a plurality of parallel-spaced heat-dissipating fins and a heat pipe combined with the heat-dissipating fins and a small-end groove. 4. The heat dissipation device combination as described in item 3 of the scope of the patent application, wherein the heat sinks are parallel to the upper surface of the small end, and the heat pipe is "Ln-shaped," one end of which is connected to the heat sink, and the other end of which is connected to the small end groove. 5. The heat sink assembly as described in item 4 of the scope of patent application, wherein a fan is further installed on the side of the heat sink. 6. The heat sink assembly as described in item 1 of the scope of patent application, wherein the large Both the end and the small end are cylindrical. 7. The heat dissipation device combination described in item 1 of the scope of patent application, wherein the small end is cylindrical, and the adjusting mechanism is the outer peripheral surface of the small end and is provided on the fastening device. Brake pin. 8. The heat-dissipating device combination described in item 1 of the scope of patent application, wherein the adjusting mechanism is a polygonal structure that can be fitted between the big end and the small end and on the fastening device. Page 11 M258332 VI. Application scope of patent 9. The heat dissipation device combination as described in item 1 of the scope of patent application, wherein the adjustment mechanism is a reciprocating device which is arranged between the big end and the little end and on the fastening device. Indexing teeth. 10. The heat dissipation device combination according to item 1 of the scope of patent application, wherein the fastening device has a central opening outer ring and a plurality of buckle arms extending outwardly from the outer ring. 11. The heat-dissipating device combination as described in item 10 of the scope of patent application, wherein the fastening device further comprises a plurality of screw joints, and a near end of each arm of the buckle is provided with a perforation that cooperates with the screw joints. Page 12