TWI911458B - 樹脂組成物及接著劑 - Google Patents

樹脂組成物及接著劑

Info

Publication number
TWI911458B
TWI911458B TW111123055A TW111123055A TWI911458B TW I911458 B TWI911458 B TW I911458B TW 111123055 A TW111123055 A TW 111123055A TW 111123055 A TW111123055 A TW 111123055A TW I911458 B TWI911458 B TW I911458B
Authority
TW
Taiwan
Prior art keywords
resin composition
compound
compounds
groups
meth
Prior art date
Application number
TW111123055A
Other languages
English (en)
Chinese (zh)
Other versions
TW202309233A (zh
Inventor
阿部信幸
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202309233A publication Critical patent/TW202309233A/zh
Application granted granted Critical
Publication of TWI911458B publication Critical patent/TWI911458B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C09J181/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW111123055A 2021-06-28 2022-06-21 樹脂組成物及接著劑 TWI911458B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021-106245 2021-06-28
JP2021106245 2021-06-28
JP2021133624 2021-08-18
JP2021-133624 2021-08-18

Publications (2)

Publication Number Publication Date
TW202309233A TW202309233A (zh) 2023-03-01
TWI911458B true TWI911458B (zh) 2026-01-11

Family

ID=84691775

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111123055A TWI911458B (zh) 2021-06-28 2022-06-21 樹脂組成物及接著劑

Country Status (4)

Country Link
JP (1) JPWO2023276773A1 (https=)
KR (1) KR20240026200A (https=)
TW (1) TWI911458B (https=)
WO (1) WO2023276773A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023181831A1 (https=) * 2022-03-23 2023-09-28
JP2023149261A (ja) * 2022-03-30 2023-10-13 日油株式会社 電子部品の封止に使用する樹脂組成物、及び該樹脂組成物で封止された電子部品
JPWO2024071132A1 (https=) * 2022-09-29 2024-04-04
JPWO2024204435A1 (https=) * 2023-03-31 2024-10-03

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285557A (ja) * 2009-06-12 2010-12-24 Teijin Ltd 環状カルボジイミドを含有する樹脂組成物
CN102177205A (zh) * 2008-10-08 2011-09-07 电气化学工业株式会社 粘合剂组合物及粘合方法
TW201229187A (en) * 2010-10-29 2012-07-16 Cheil Ind Inc Adhesive composition, optical member, surface protective film and adhesive sheet
CN103370387A (zh) * 2011-02-18 2013-10-23 3M创新有限公司 光学透明的粘合剂、使用方法和由其制得的制品
TW201739873A (zh) * 2016-03-31 2017-11-16 古河電氣工業股份有限公司 電子裝置封裝用膠帶
CN109943072A (zh) * 2019-02-26 2019-06-28 南亚新材料科技股份有限公司 一种热固性树脂组合物
TW201934645A (zh) * 2018-01-30 2019-09-01 日商納美仕股份有限公司 樹脂組成物及其硬化物、接著劑、半導體裝置，以及電子零件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100736240B1 (ko) 2003-11-26 2007-07-06 미쓰이 가가쿠 가부시키가이샤 1액형의 광 및 열병용 경화성 수지 조성물 및 그 용도
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
JP4976575B1 (ja) * 2011-07-07 2012-07-18 ナミックス株式会社 樹脂組成物
US10221282B2 (en) 2015-03-12 2019-03-05 Namics Corporation Resin composition, adhesive agent, and sealing agent
JP7437695B2 (ja) * 2020-07-30 2024-02-26 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、硬化物、機器、及び機器の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102177205A (zh) * 2008-10-08 2011-09-07 电气化学工业株式会社 粘合剂组合物及粘合方法
JP2010285557A (ja) * 2009-06-12 2010-12-24 Teijin Ltd 環状カルボジイミドを含有する樹脂組成物
TW201229187A (en) * 2010-10-29 2012-07-16 Cheil Ind Inc Adhesive composition, optical member, surface protective film and adhesive sheet
CN103370387A (zh) * 2011-02-18 2013-10-23 3M创新有限公司 光学透明的粘合剂、使用方法和由其制得的制品
TW201739873A (zh) * 2016-03-31 2017-11-16 古河電氣工業股份有限公司 電子裝置封裝用膠帶
TW201934645A (zh) * 2018-01-30 2019-09-01 日商納美仕股份有限公司 樹脂組成物及其硬化物、接著劑、半導體裝置，以及電子零件
CN109943072A (zh) * 2019-02-26 2019-06-28 南亚新材料科技股份有限公司 一种热固性树脂组合物

Also Published As

Publication number Publication date
WO2023276773A1 (ja) 2023-01-05
JPWO2023276773A1 (https=) 2023-01-05
TW202309233A (zh) 2023-03-01
KR20240026200A (ko) 2024-02-27

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