JPWO2023276773A1 - - Google Patents

Info

Publication number
JPWO2023276773A1
JPWO2023276773A1 JP2023531832A JP2023531832A JPWO2023276773A1 JP WO2023276773 A1 JPWO2023276773 A1 JP WO2023276773A1 JP 2023531832 A JP2023531832 A JP 2023531832A JP 2023531832 A JP2023531832 A JP 2023531832A JP WO2023276773 A1 JPWO2023276773 A1 JP WO2023276773A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023531832A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023276773A1 publication Critical patent/JPWO2023276773A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C09J181/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023531832A 2021-06-28 2022-06-21 Pending JPWO2023276773A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021106245 2021-06-28
JP2021133624 2021-08-18
PCT/JP2022/024658 WO2023276773A1 (ja) 2021-06-28 2022-06-21 樹脂組成物及び接着剤

Publications (1)

Publication Number Publication Date
JPWO2023276773A1 true JPWO2023276773A1 (ja) 2023-01-05

Family

ID=84691775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023531832A Pending JPWO2023276773A1 (ja) 2021-06-28 2022-06-21

Country Status (4)

Country Link
JP (1) JPWO2023276773A1 (ja)
KR (1) KR20240026200A (ja)
TW (1) TW202309233A (ja)
WO (1) WO2023276773A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202344552A (zh) * 2022-03-23 2023-11-16 日商納美仕有限公司 樹脂組成物、接著劑或密封材、硬化物、半導體裝置及電子元件
WO2024071132A1 (ja) * 2022-09-29 2024-04-04 株式会社レゾナック 構造体の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070096056A1 (en) 2003-11-26 2007-05-03 Mitsui Chemicals, Inc. One component resin composition curable with combination of light and heat and use of the same
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
JP5588631B2 (ja) * 2009-06-12 2014-09-10 帝人株式会社 環状カルボジイミドを含有する樹脂組成物
JP4976575B1 (ja) * 2011-07-07 2012-07-18 ナミックス株式会社 樹脂組成物
WO2016143777A1 (ja) 2015-03-12 2016-09-15 ナミックス株式会社 樹脂組成物、接着剤、および封止剤
EP3747933B1 (en) * 2018-01-30 2023-06-07 Namics Corporation Resin composition and cured material of same, adhesive, semiconductor device, and electronic component
CN109943072A (zh) * 2019-02-26 2019-06-28 南亚新材料科技股份有限公司 一种热固性树脂组合物
JP7437695B2 (ja) * 2020-07-30 2024-02-26 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、硬化物、機器、及び機器の製造方法

Also Published As

Publication number Publication date
WO2023276773A1 (ja) 2023-01-05
TW202309233A (zh) 2023-03-01
KR20240026200A (ko) 2024-02-27

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