JPWO2023276773A1 - - Google Patents

Info

Publication number
JPWO2023276773A1
JPWO2023276773A1 JP2023531832A JP2023531832A JPWO2023276773A1 JP WO2023276773 A1 JPWO2023276773 A1 JP WO2023276773A1 JP 2023531832 A JP2023531832 A JP 2023531832A JP 2023531832 A JP2023531832 A JP 2023531832A JP WO2023276773 A1 JPWO2023276773 A1 JP WO2023276773A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023531832A
Other languages
Japanese (ja)
Other versions
JPWO2023276773A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023276773A1 publication Critical patent/JPWO2023276773A1/ja
Publication of JPWO2023276773A5 publication Critical patent/JPWO2023276773A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C09J181/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023531832A 2021-06-28 2022-06-21 Pending JPWO2023276773A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021106245 2021-06-28
JP2021133624 2021-08-18
PCT/JP2022/024658 WO2023276773A1 (ja) 2021-06-28 2022-06-21 樹脂組成物及び接着剤

Publications (2)

Publication Number Publication Date
JPWO2023276773A1 true JPWO2023276773A1 (https=) 2023-01-05
JPWO2023276773A5 JPWO2023276773A5 (https=) 2024-12-03

Family

ID=84691775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023531832A Pending JPWO2023276773A1 (https=) 2021-06-28 2022-06-21

Country Status (4)

Country Link
JP (1) JPWO2023276773A1 (https=)
KR (1) KR20240026200A (https=)
TW (1) TWI911458B (https=)
WO (1) WO2023276773A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023181831A1 (https=) * 2022-03-23 2023-09-28
JP2023149261A (ja) * 2022-03-30 2023-10-13 日油株式会社 電子部品の封止に使用する樹脂組成物、及び該樹脂組成物で封止された電子部品
JPWO2024071132A1 (https=) * 2022-09-29 2024-04-04
JPWO2024204435A1 (https=) * 2023-03-31 2024-10-03

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285557A (ja) * 2009-06-12 2010-12-24 Teijin Ltd 環状カルボジイミドを含有する樹脂組成物
JP2014077024A (ja) * 2011-07-07 2014-05-01 Namics Corp 樹脂組成物
WO2019151256A1 (ja) * 2018-01-30 2019-08-08 ナミックス株式会社 樹脂組成物およびその硬化物、接着剤、半導体装置、ならびに電子部品
WO2020173216A1 (zh) * 2019-02-26 2020-09-03 南亚新材料科技股份有限公司 一种热固性树脂组合物
JP2022026245A (ja) * 2020-07-30 2022-02-10 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、硬化物、機器、及び機器の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100736240B1 (ko) 2003-11-26 2007-07-06 미쓰이 가가쿠 가부시키가이샤 1액형의 광 및 열병용 경화성 수지 조성물 및 그 용도
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
JP5406845B2 (ja) * 2008-10-08 2014-02-05 電気化学工業株式会社 接着剤組成物及び接着方法
JP5436394B2 (ja) * 2010-10-29 2014-03-05 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物
TWI534235B (zh) * 2011-02-18 2016-05-21 ３Ｍ新設資產公司 光學透明黏著劑，其使用方法，及得自其之物件
US10221282B2 (en) 2015-03-12 2019-03-05 Namics Corporation Resin composition, adhesive agent, and sealing agent
JP6339619B2 (ja) * 2016-03-31 2018-06-06 古河電気工業株式会社 電子デバイスパッケージ用テープ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285557A (ja) * 2009-06-12 2010-12-24 Teijin Ltd 環状カルボジイミドを含有する樹脂組成物
JP2014077024A (ja) * 2011-07-07 2014-05-01 Namics Corp 樹脂組成物
WO2019151256A1 (ja) * 2018-01-30 2019-08-08 ナミックス株式会社 樹脂組成物およびその硬化物、接着剤、半導体装置、ならびに電子部品
WO2020173216A1 (zh) * 2019-02-26 2020-09-03 南亚新材料科技股份有限公司 一种热固性树脂组合物
JP2022026245A (ja) * 2020-07-30 2022-02-10 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、硬化物、機器、及び機器の製造方法

Also Published As

Publication number Publication date
WO2023276773A1 (ja) 2023-01-05
TW202309233A (zh) 2023-03-01
TWI911458B (zh) 2026-01-11
KR20240026200A (ko) 2024-02-27

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