KR20240026200A - 수지 조성물 및 접착제 - Google Patents

수지 조성물 및 접착제 Download PDF

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Publication number
KR20240026200A
KR20240026200A KR1020247002790A KR20247002790A KR20240026200A KR 20240026200 A KR20240026200 A KR 20240026200A KR 1020247002790 A KR1020247002790 A KR 1020247002790A KR 20247002790 A KR20247002790 A KR 20247002790A KR 20240026200 A KR20240026200 A KR 20240026200A
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KR
South Korea
Prior art keywords
resin composition
compound
group
component
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247002790A
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English (en)
Korean (ko)
Inventor
노부유키 아베
Original Assignee
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Publication of KR20240026200A publication Critical patent/KR20240026200A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C09J181/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H01L23/293—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020247002790A 2021-06-28 2022-06-21 수지 조성물 및 접착제 Pending KR20240026200A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2021-106245 2021-06-28
JP2021106245 2021-06-28
JPJP-P-2021-133624 2021-08-18
JP2021133624 2021-08-18
PCT/JP2022/024658 WO2023276773A1 (ja) 2021-06-28 2022-06-21 樹脂組成物及び接着剤

Publications (1)

Publication Number Publication Date
KR20240026200A true KR20240026200A (ko) 2024-02-27

Family

ID=84691775

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247002790A Pending KR20240026200A (ko) 2021-06-28 2022-06-21 수지 조성물 및 접착제

Country Status (4)

Country Link
JP (1) JPWO2023276773A1 (https=)
KR (1) KR20240026200A (https=)
TW (1) TWI911458B (https=)
WO (1) WO2023276773A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023181831A1 (https=) * 2022-03-23 2023-09-28
JP2023149261A (ja) * 2022-03-30 2023-10-13 日油株式会社 電子部品の封止に使用する樹脂組成物、及び該樹脂組成物で封止された電子部品
JPWO2024071132A1 (https=) * 2022-09-29 2024-04-04
JPWO2024204435A1 (https=) * 2023-03-31 2024-10-03

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005052021A1 (ja) 2003-11-26 2005-06-09 Mitsui Chemicals, Inc. １液型の光及び熱併用硬化性樹脂組成物及びその用途
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
WO2016143777A1 (ja) 2015-03-12 2016-09-15 ナミックス株式会社 樹脂組成物、接着剤、および封止剤

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5406845B2 (ja) * 2008-10-08 2014-02-05 電気化学工業株式会社 接着剤組成物及び接着方法
JP5588631B2 (ja) * 2009-06-12 2014-09-10 帝人株式会社 環状カルボジイミドを含有する樹脂組成物
JP5436394B2 (ja) * 2010-10-29 2014-03-05 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物
TWI534235B (zh) * 2011-02-18 2016-05-21 ３Ｍ新設資產公司 光學透明黏著劑，其使用方法，及得自其之物件
JP4976575B1 (ja) * 2011-07-07 2012-07-18 ナミックス株式会社 樹脂組成物
JP6339619B2 (ja) * 2016-03-31 2018-06-06 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7266881B2 (ja) * 2018-01-30 2023-05-01 ナミックス株式会社 光硬化性および熱硬化性を有する樹脂組成物およびその硬化物、接着剤、半導体装置、ならびに電子部品
CN109943072A (zh) * 2019-02-26 2019-06-28 南亚新材料科技股份有限公司 一种热固性树脂组合物
JP7437695B2 (ja) * 2020-07-30 2024-02-26 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、硬化物、機器、及び機器の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005052021A1 (ja) 2003-11-26 2005-06-09 Mitsui Chemicals, Inc. １液型の光及び熱併用硬化性樹脂組成物及びその用途
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
WO2016143777A1 (ja) 2015-03-12 2016-09-15 ナミックス株式会社 樹脂組成物、接着剤、および封止剤

Also Published As

Publication number Publication date
WO2023276773A1 (ja) 2023-01-05
JPWO2023276773A1 (https=) 2023-01-05
TW202309233A (zh) 2023-03-01
TWI911458B (zh) 2026-01-11

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