TWI903125B - 保護片及電子器件封裝的製造方法 - Google Patents

保護片及電子器件封裝的製造方法

Info

Publication number
TWI903125B
TWI903125B TW111143663A TW111143663A TWI903125B TW I903125 B TWI903125 B TW I903125B TW 111143663 A TW111143663 A TW 111143663A TW 111143663 A TW111143663 A TW 111143663A TW I903125 B TWI903125 B TW I903125B
Authority
TW
Taiwan
Prior art keywords
protective layer
protective
layer
protective sheet
sheet
Prior art date
Application number
TW111143663A
Other languages
English (en)
Chinese (zh)
Other versions
TW202322301A (zh
Inventor
松尾玲季
松戸和規
岸大将
日野光晴
Original Assignee
日商愛天思股份有限公司
日商東洋科美股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商愛天思股份有限公司, 日商東洋科美股份有限公司 filed Critical 日商愛天思股份有限公司
Publication of TW202322301A publication Critical patent/TW202322301A/zh
Application granted granted Critical
Publication of TWI903125B publication Critical patent/TWI903125B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111143663A 2021-11-29 2022-11-16 保護片及電子器件封裝的製造方法 TWI903125B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021193194 2021-11-29
JP2021-193194 2021-11-29

Publications (2)

Publication Number Publication Date
TW202322301A TW202322301A (zh) 2023-06-01
TWI903125B true TWI903125B (zh) 2025-11-01

Family

ID=86539662

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111143663A TWI903125B (zh) 2021-11-29 2022-11-16 保護片及電子器件封裝的製造方法

Country Status (5)

Country Link
JP (2) JP7609301B2 (https=)
KR (1) KR20240113761A (https=)
CN (1) CN118266274A (https=)
TW (1) TWI903125B (https=)
WO (1) WO2023095697A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025062977A1 (ja) * 2023-09-21 2025-03-27 日本発條株式会社 積層体製造用器具、及び積層体の製造方法
JP7460013B1 (ja) * 2023-11-30 2024-04-02 ａｒｔｉｅｎｃｅ株式会社 電子部品搭載基板及び電子機器
JP7783968B1 (ja) * 2024-12-18 2025-12-10 ａｒｔｉｅｎｃｅ株式会社 研磨パッド固定用粘着シート、剥離シート付きの研磨パッド固定用粘着シート、粘着層ａ付きの研磨パッド、剥離シートおよび粘着層ａ付きの研磨パッド、および研磨パッドを定盤に固定する方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201218288A (en) * 2010-09-06 2012-05-01 Nitto Denko Corp Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation
US20160376473A1 (en) * 2015-06-26 2016-12-29 Nitto Denko Corporation Pressure-sensitive adhesive sheet and magnetic disk drive

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7445968B2 (en) 2005-12-16 2008-11-04 Sige Semiconductor (U.S.), Corp. Methods for integrated circuit module packaging and integrated circuit module packages
JP5893917B2 (ja) 2011-12-28 2016-03-23 日東電工株式会社 電子部品用樹脂シート、電子部品用樹脂シートの製造方法、及び、半導体装置の製造方法
JP6623513B2 (ja) 2013-12-03 2019-12-25 東洋インキＳｃホールディングス株式会社 電子素子およびシート材
CN207638990U (zh) 2015-07-13 2018-07-20 株式会社村田制作所 树脂基板以及搭载有部件的树脂基板
JP2020069720A (ja) 2018-10-31 2020-05-07 京セラ株式会社 封止用シート及びそれを用いた電子部品の製造方法
US20220124911A1 (en) 2019-03-11 2022-04-21 Sekisui Chemical Co., Ltd. Coating agent and method for manufacturing module using the coating agent

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201218288A (en) * 2010-09-06 2012-05-01 Nitto Denko Corp Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation
US20160376473A1 (en) * 2015-06-26 2016-12-29 Nitto Denko Corporation Pressure-sensitive adhesive sheet and magnetic disk drive

Also Published As

Publication number Publication date
JPWO2023095697A1 (https=) 2023-06-01
TW202322301A (zh) 2023-06-01
WO2023095697A1 (ja) 2023-06-01
JP2025041717A (ja) 2025-03-26
JP7609301B2 (ja) 2025-01-07
CN118266274A (zh) 2024-06-28
KR20240113761A (ko) 2024-07-23

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