KR20240113761A - 보호 시트, 전자 디바이스 패키지 및 그 제조 방법 - Google Patents

보호 시트, 전자 디바이스 패키지 및 그 제조 방법 Download PDF

Info

Publication number
KR20240113761A
KR20240113761A KR1020247015303A KR20247015303A KR20240113761A KR 20240113761 A KR20240113761 A KR 20240113761A KR 1020247015303 A KR1020247015303 A KR 1020247015303A KR 20247015303 A KR20247015303 A KR 20247015303A KR 20240113761 A KR20240113761 A KR 20240113761A
Authority
KR
South Korea
Prior art keywords
protective layer
electronic device
protective
protective sheet
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247015303A
Other languages
English (en)
Korean (ko)
Inventor
타마키 마츠오
카즈노리 마츠도
다이스케 키시
미츠하루 히노
Original Assignee
아티엔스 가부시키가이샤
토요켐주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아티엔스 가부시키가이샤, 토요켐주식회사 filed Critical 아티엔스 가부시키가이샤
Publication of KR20240113761A publication Critical patent/KR20240113761A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • H01L23/29—
    • H01L23/3121—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247015303A 2021-11-29 2022-11-16 보호 시트, 전자 디바이스 패키지 및 그 제조 방법 Pending KR20240113761A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021193194 2021-11-29
JPJP-P-2021-193194 2021-11-29
PCT/JP2022/042570 WO2023095697A1 (ja) 2021-11-29 2022-11-16 保護シート、電子デバイスパッケージ及びその製造方法

Publications (1)

Publication Number Publication Date
KR20240113761A true KR20240113761A (ko) 2024-07-23

Family

ID=86539662

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247015303A Pending KR20240113761A (ko) 2021-11-29 2022-11-16 보호 시트, 전자 디바이스 패키지 및 그 제조 방법

Country Status (5)

Country Link
JP (2) JP7609301B2 (https=)
KR (1) KR20240113761A (https=)
CN (1) CN118266274A (https=)
TW (1) TWI903125B (https=)
WO (1) WO2023095697A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025062977A1 (ja) * 2023-09-21 2025-03-27 日本発條株式会社 積層体製造用器具、及び積層体の製造方法
JP7460013B1 (ja) * 2023-11-30 2024-04-02 ａｒｔｉｅｎｃｅ株式会社 電子部品搭載基板及び電子機器
JP7783968B1 (ja) * 2024-12-18 2025-12-10 ａｒｔｉｅｎｃｅ株式会社 研磨パッド固定用粘着シート、剥離シート付きの研磨パッド固定用粘着シート、粘着層ａ付きの研磨パッド、剥離シートおよび粘着層ａ付きの研磨パッド、および研磨パッドを定盤に固定する方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7445968B2 (en) 2005-12-16 2008-11-04 Sige Semiconductor (U.S.), Corp. Methods for integrated circuit module packaging and integrated circuit module packages

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5349432B2 (ja) * 2010-09-06 2013-11-20 日東電工株式会社 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート
JP5893917B2 (ja) 2011-12-28 2016-03-23 日東電工株式会社 電子部品用樹脂シート、電子部品用樹脂シートの製造方法、及び、半導体装置の製造方法
JP6623513B2 (ja) 2013-12-03 2019-12-25 東洋インキＳｃホールディングス株式会社 電子素子およびシート材
US9683138B2 (en) * 2015-06-26 2017-06-20 Nitto Denko Corporation Pressure-sensitive adhesive sheet and magnetic disk drive
CN207638990U (zh) 2015-07-13 2018-07-20 株式会社村田制作所 树脂基板以及搭载有部件的树脂基板
JP2020069720A (ja) 2018-10-31 2020-05-07 京セラ株式会社 封止用シート及びそれを用いた電子部品の製造方法
US20220124911A1 (en) 2019-03-11 2022-04-21 Sekisui Chemical Co., Ltd. Coating agent and method for manufacturing module using the coating agent

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7445968B2 (en) 2005-12-16 2008-11-04 Sige Semiconductor (U.S.), Corp. Methods for integrated circuit module packaging and integrated circuit module packages

Also Published As

Publication number Publication date
JPWO2023095697A1 (https=) 2023-06-01
TW202322301A (zh) 2023-06-01
WO2023095697A1 (ja) 2023-06-01
JP2025041717A (ja) 2025-03-26
TWI903125B (zh) 2025-11-01
JP7609301B2 (ja) 2025-01-07
CN118266274A (zh) 2024-06-28

Similar Documents

Publication Publication Date Title
KR20240113761A (ko) 보호 시트, 전자 디바이스 패키지 및 그 제조 방법
KR101640349B1 (ko) 다이싱 테이프 일체형 반도체 이면용 필름
KR101920083B1 (ko) 반도체 장치용 접착 필름, 플립 칩형 반도체 이면용 필름 및 다이싱 테이프 일체형 반도체 이면용 필름
US8138580B2 (en) Adhesive composition for electronic components, and adhesive sheet for electronic components using the same
KR100894208B1 (ko) 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착 필름,반도체 탑재용 기판 및 반도체 장치
TWI429034B (zh) 覆晶型半導體背面用膜及其應用
JP6171280B2 (ja) 半導体装置の製造方法
TWI465542B (zh) 覆晶型半導體背面用膜
KR20130056863A (ko) 플립칩형 반도체 이면용 필름, 다이싱 테이프 일체형 반도체 이면용 필름, 반도체 장치의 제조방법, 및 플립칩형 반도체 장치
KR20150135284A (ko) 보호막 형성용 필름 및 보호막 형성용 복합 시트
KR101539471B1 (ko) 다이싱 테이프 일체형 반도체 이면용 필름
KR20160060073A (ko) 반도체칩 밀봉용 열경화성 수지 시트 및 반도체 패키지의 제조 방법
JP6313165B2 (ja) 熱硬化性の封止用樹脂シート、セパレータ付き封止用シート、半導体装置、及び、半導体装置の製造方法
KR101555741B1 (ko) 플립칩형 반도체 이면용 필름
JP6089567B2 (ja) 電子部品被覆用熱硬化性接着シートおよびその製造方法ならびにそれを用いた電子部材の製造方法
KR20150143594A (ko) 반도체 장치의 제조에 이용되는 접착 시트, 다이싱 테이프 일체형 접착 시트, 반도체 장치, 및 반도체 장치의 제조 방법
KR20150097446A (ko) 플립 칩형 반도체 이면용 필름, 다이싱 테이프 일체형 반도체 이면용 필름, 반도체 장치의 제조 방법 및 플립 칩형 반도체 장치
JPWO2018181761A1 (ja) 封止フィルム、電子部品装置の製造方法及び電子部品装置
JP2014192446A (ja) 電子部材の製造方法
JP2010258086A (ja) 半導体用接着シート及びダイシング一体型半導体用接着シート
JP2017183376A (ja) フレキシブル基板、フレキシブル回路基板および支持体レスフレキシブル回路基板の製造方法
JP2024075810A (ja) 樹脂シート
JP5234729B2 (ja) 絶縁材料、配線基板及び半導体装置
TW202220115A (zh) 電子器件封裝及其製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D13 Search requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D13-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000