TWI894823B - 接合體之製造方法 - Google Patents

接合體之製造方法

Info

Publication number
TWI894823B
TWI894823B TW113106264A TW113106264A TWI894823B TW I894823 B TWI894823 B TW I894823B TW 113106264 A TW113106264 A TW 113106264A TW 113106264 A TW113106264 A TW 113106264A TW I894823 B TWI894823 B TW I894823B
Authority
TW
Taiwan
Prior art keywords
intermediate layer
substrate
bonding
bonding surface
peripheral portion
Prior art date
Application number
TW113106264A
Other languages
English (en)
Chinese (zh)
Other versions
TW202439780A (zh
Inventor
伊藤祐葵
Original Assignee
日商日本碍子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本碍子股份有限公司 filed Critical 日商日本碍子股份有限公司
Publication of TW202439780A publication Critical patent/TW202439780A/zh
Application granted granted Critical
Publication of TWI894823B publication Critical patent/TWI894823B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW113106264A 2023-03-28 2024-02-22 接合體之製造方法 TWI894823B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023051421 2023-03-28
JP2023-051421 2023-03-28

Publications (2)

Publication Number Publication Date
TW202439780A TW202439780A (zh) 2024-10-01
TWI894823B true TWI894823B (zh) 2025-08-21

Family

ID=92903782

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113106264A TWI894823B (zh) 2023-03-28 2024-02-22 接合體之製造方法

Country Status (7)

Country Link
US (1) US20260025117A1 (https=)
JP (1) JP7803004B2 (https=)
KR (1) KR20250160194A (https=)
CN (1) CN120883509A (https=)
DE (1) DE112023005816T5 (https=)
TW (1) TWI894823B (https=)
WO (1) WO2024202198A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6362561B1 (en) * 1999-03-18 2002-03-26 Murata Manufacturing Co., Ltd Piezoelectric vibration device and piezoelectric resonance component
JP2018061258A (ja) * 2016-07-20 2018-04-12 信越化学工業株式会社 表面弾性波デバイス用複合基板及びその製造方法とこの複合基板を用いた表面弾性波デバイス
CN112074622A (zh) * 2018-05-16 2020-12-11 日本碍子株式会社 压电性材料基板与支撑基板的接合体
US20210328570A1 (en) * 2019-11-29 2021-10-21 Ngk Insulators, Ltd. Bonded body of piezoelectric material substrate and supporting substrate
US20220140227A1 (en) * 2020-11-03 2022-05-05 Corning Incorporated Substrate thining using temporary bonding processes
EP4149118A1 (en) * 2020-05-07 2023-03-15 FUJIFILM Corporation Piezoelectric element and piezoelectric speaker

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003303793A (ja) * 2002-04-12 2003-10-24 Hitachi Ltd 研磨装置および半導体装置の製造方法
CN102624352B (zh) 2010-10-06 2015-12-09 日本碍子株式会社 复合基板的制造方法以及复合基板
JP6226774B2 (ja) 2014-02-25 2017-11-08 日本碍子株式会社 複合基板の製法及び複合基板
WO2017163722A1 (ja) 2016-03-25 2017-09-28 日本碍子株式会社 接合方法
FR3053532B1 (fr) 2016-06-30 2018-11-16 Soitec Structure hybride pour dispositif a ondes acoustiques de surface
JP6747599B2 (ja) 2017-08-31 2020-08-26 株式会社Sumco シリコンウェーハの両面研磨方法
CN109742023A (zh) 2018-11-27 2019-05-10 上海新傲科技股份有限公司 晶圆表面的平坦化方法
JP7631088B2 (ja) 2021-05-12 2025-02-18 太陽誘電株式会社 弾性波デバイス、フィルタ、マルチプレクサ並びにウエハおよびその製造方法
CN114631260B (zh) 2021-09-01 2023-05-02 福建晶安光电有限公司 滤波器用基板的加工方法、基板及tc-saw滤波器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6362561B1 (en) * 1999-03-18 2002-03-26 Murata Manufacturing Co., Ltd Piezoelectric vibration device and piezoelectric resonance component
JP2018061258A (ja) * 2016-07-20 2018-04-12 信越化学工業株式会社 表面弾性波デバイス用複合基板及びその製造方法とこの複合基板を用いた表面弾性波デバイス
CN112074622A (zh) * 2018-05-16 2020-12-11 日本碍子株式会社 压电性材料基板与支撑基板的接合体
US20210328570A1 (en) * 2019-11-29 2021-10-21 Ngk Insulators, Ltd. Bonded body of piezoelectric material substrate and supporting substrate
EP4149118A1 (en) * 2020-05-07 2023-03-15 FUJIFILM Corporation Piezoelectric element and piezoelectric speaker
US20220140227A1 (en) * 2020-11-03 2022-05-05 Corning Incorporated Substrate thining using temporary bonding processes

Also Published As

Publication number Publication date
DE112023005816T5 (de) 2025-11-27
CN120883509A (zh) 2025-10-31
TW202439780A (zh) 2024-10-01
WO2024202198A1 (ja) 2024-10-03
JPWO2024202198A1 (https=) 2024-10-03
KR20250160194A (ko) 2025-11-11
JP7803004B2 (ja) 2026-01-20
US20260025117A1 (en) 2026-01-22

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