DE112023005816T5 - Verfahren zur Herstellung eines Verbundkörpers - Google Patents

Verfahren zur Herstellung eines Verbundkörpers

Info

Publication number
DE112023005816T5
DE112023005816T5 DE112023005816.4T DE112023005816T DE112023005816T5 DE 112023005816 T5 DE112023005816 T5 DE 112023005816T5 DE 112023005816 T DE112023005816 T DE 112023005816T DE 112023005816 T5 DE112023005816 T5 DE 112023005816T5
Authority
DE
Germany
Prior art keywords
interlayer
piezoelectric material
polishing
bonding
material substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023005816.4T
Other languages
German (de)
English (en)
Inventor
Yuki Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of DE112023005816T5 publication Critical patent/DE112023005816T5/de
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE112023005816.4T 2023-03-28 2023-11-14 Verfahren zur Herstellung eines Verbundkörpers Pending DE112023005816T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023051421 2023-03-28
JP2023-051421 2023-03-28
PCT/JP2023/040884 WO2024202198A1 (ja) 2023-03-28 2023-11-14 接合体の製造方法

Publications (1)

Publication Number Publication Date
DE112023005816T5 true DE112023005816T5 (de) 2025-11-27

Family

ID=92903782

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023005816.4T Pending DE112023005816T5 (de) 2023-03-28 2023-11-14 Verfahren zur Herstellung eines Verbundkörpers

Country Status (7)

Country Link
US (1) US20260025117A1 (https=)
JP (1) JP7803004B2 (https=)
KR (1) KR20250160194A (https=)
CN (1) CN120883509A (https=)
DE (1) DE112023005816T5 (https=)
TW (1) TWI894823B (https=)
WO (1) WO2024202198A1 (https=)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000269774A (ja) * 1999-03-18 2000-09-29 Murata Mfg Co Ltd 圧電振動素子及び圧電共振部品
JP2003303793A (ja) * 2002-04-12 2003-10-24 Hitachi Ltd 研磨装置および半導体装置の製造方法
CN102624352B (zh) 2010-10-06 2015-12-09 日本碍子株式会社 复合基板的制造方法以及复合基板
JP6226774B2 (ja) 2014-02-25 2017-11-08 日本碍子株式会社 複合基板の製法及び複合基板
WO2017163722A1 (ja) 2016-03-25 2017-09-28 日本碍子株式会社 接合方法
FR3053532B1 (fr) 2016-06-30 2018-11-16 Soitec Structure hybride pour dispositif a ondes acoustiques de surface
JP6250856B1 (ja) 2016-07-20 2017-12-20 信越化学工業株式会社 表面弾性波デバイス用複合基板及びその製造方法とこの複合基板を用いた表面弾性波デバイス
JP6747599B2 (ja) 2017-08-31 2020-08-26 株式会社Sumco シリコンウェーハの両面研磨方法
CN112074622B (zh) * 2018-05-16 2021-07-27 日本碍子株式会社 压电性材料基板与支撑基板的接合体
CN109742023A (zh) 2018-11-27 2019-05-10 上海新傲科技股份有限公司 晶圆表面的平坦化方法
KR102402925B1 (ko) * 2019-11-29 2022-05-30 엔지케이 인슐레이터 엘티디 압전성 재료 기판과 지지 기판의 접합체
EP4149118A4 (en) * 2020-05-07 2023-10-18 FUJIFILM Corporation PIEZOELECTRIC ELEMENT AND PIEZOELECTRIC SPEAKER
JP2023550606A (ja) * 2020-11-03 2023-12-04 コーニング インコーポレイテッド 仮結合プロセスを使用する基板の薄化
JP7631088B2 (ja) 2021-05-12 2025-02-18 太陽誘電株式会社 弾性波デバイス、フィルタ、マルチプレクサ並びにウエハおよびその製造方法
CN114631260B (zh) 2021-09-01 2023-05-02 福建晶安光电有限公司 滤波器用基板的加工方法、基板及tc-saw滤波器

Also Published As

Publication number Publication date
TWI894823B (zh) 2025-08-21
CN120883509A (zh) 2025-10-31
TW202439780A (zh) 2024-10-01
WO2024202198A1 (ja) 2024-10-03
JPWO2024202198A1 (https=) 2024-10-03
KR20250160194A (ko) 2025-11-11
JP7803004B2 (ja) 2026-01-20
US20260025117A1 (en) 2026-01-22

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Legal Events

Date Code Title Description
R012 Request for examination validly filed