JPWO2024202198A1 - - Google Patents
Info
- Publication number
- JPWO2024202198A1 JPWO2024202198A1 JP2025509691A JP2025509691A JPWO2024202198A1 JP WO2024202198 A1 JPWO2024202198 A1 JP WO2024202198A1 JP 2025509691 A JP2025509691 A JP 2025509691A JP 2025509691 A JP2025509691 A JP 2025509691A JP WO2024202198 A1 JPWO2024202198 A1 JP WO2024202198A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023051421 | 2023-03-28 | ||
| JP2023051421 | 2023-03-28 | ||
| PCT/JP2023/040884 WO2024202198A1 (ja) | 2023-03-28 | 2023-11-14 | 接合体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024202198A1 true JPWO2024202198A1 (https=) | 2024-10-03 |
| JPWO2024202198A5 JPWO2024202198A5 (https=) | 2025-10-31 |
| JP7803004B2 JP7803004B2 (ja) | 2026-01-20 |
Family
ID=92903782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025509691A Active JP7803004B2 (ja) | 2023-03-28 | 2023-11-14 | 接合体の製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20260025117A1 (https=) |
| JP (1) | JP7803004B2 (https=) |
| KR (1) | KR20250160194A (https=) |
| CN (1) | CN120883509A (https=) |
| DE (1) | DE112023005816T5 (https=) |
| TW (1) | TWI894823B (https=) |
| WO (1) | WO2024202198A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003303793A (ja) * | 2002-04-12 | 2003-10-24 | Hitachi Ltd | 研磨装置および半導体装置の製造方法 |
| JP2015159499A (ja) * | 2014-02-25 | 2015-09-03 | 日本碍子株式会社 | 複合基板の製法及び複合基板 |
| JP2018061258A (ja) * | 2016-07-20 | 2018-04-12 | 信越化学工業株式会社 | 表面弾性波デバイス用複合基板及びその製造方法とこの複合基板を用いた表面弾性波デバイス |
| JP2019526194A (ja) * | 2016-06-30 | 2019-09-12 | ソイテック | 表面弾性波デバイスのためのハイブリッド構造 |
| US20200168501A1 (en) * | 2018-11-27 | 2020-05-28 | Shanghai Simgui Technology Co., Ltd. | Method for planarizing wafer surface |
| JP2022174977A (ja) * | 2021-05-12 | 2022-11-25 | 太陽誘電株式会社 | 弾性波デバイス、フィルタ、マルチプレクサ並びにウエハおよびその製造方法 |
| JP2023552014A (ja) * | 2021-09-01 | 2023-12-14 | 福建晶安光電有限公司 | フィルタ用基板の加工方法、基板及びｔｃ－ｓａｗフィルタ |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000269774A (ja) * | 1999-03-18 | 2000-09-29 | Murata Mfg Co Ltd | 圧電振動素子及び圧電共振部品 |
| CN102624352B (zh) | 2010-10-06 | 2015-12-09 | 日本碍子株式会社 | 复合基板的制造方法以及复合基板 |
| WO2017163722A1 (ja) | 2016-03-25 | 2017-09-28 | 日本碍子株式会社 | 接合方法 |
| JP6747599B2 (ja) | 2017-08-31 | 2020-08-26 | 株式会社Sumco | シリコンウェーハの両面研磨方法 |
| CN112074622B (zh) * | 2018-05-16 | 2021-07-27 | 日本碍子株式会社 | 压电性材料基板与支撑基板的接合体 |
| KR102402925B1 (ko) * | 2019-11-29 | 2022-05-30 | 엔지케이 인슐레이터 엘티디 | 압전성 재료 기판과 지지 기판의 접합체 |
| EP4149118A4 (en) * | 2020-05-07 | 2023-10-18 | FUJIFILM Corporation | PIEZOELECTRIC ELEMENT AND PIEZOELECTRIC SPEAKER |
| JP2023550606A (ja) * | 2020-11-03 | 2023-12-04 | コーニング インコーポレイテッド | 仮結合プロセスを使用する基板の薄化 |
-
2023
- 2023-11-14 KR KR1020257034082A patent/KR20250160194A/ko active Pending
- 2023-11-14 JP JP2025509691A patent/JP7803004B2/ja active Active
- 2023-11-14 WO PCT/JP2023/040884 patent/WO2024202198A1/ja not_active Ceased
- 2023-11-14 DE DE112023005816.4T patent/DE112023005816T5/de active Pending
- 2023-11-14 CN CN202380080021.6A patent/CN120883509A/zh active Pending
-
2024
- 2024-02-22 TW TW113106264A patent/TWI894823B/zh active
-
2025
- 2025-09-26 US US19/341,066 patent/US20260025117A1/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003303793A (ja) * | 2002-04-12 | 2003-10-24 | Hitachi Ltd | 研磨装置および半導体装置の製造方法 |
| JP2015159499A (ja) * | 2014-02-25 | 2015-09-03 | 日本碍子株式会社 | 複合基板の製法及び複合基板 |
| JP2019526194A (ja) * | 2016-06-30 | 2019-09-12 | ソイテック | 表面弾性波デバイスのためのハイブリッド構造 |
| JP2018061258A (ja) * | 2016-07-20 | 2018-04-12 | 信越化学工業株式会社 | 表面弾性波デバイス用複合基板及びその製造方法とこの複合基板を用いた表面弾性波デバイス |
| US20200168501A1 (en) * | 2018-11-27 | 2020-05-28 | Shanghai Simgui Technology Co., Ltd. | Method for planarizing wafer surface |
| JP2022174977A (ja) * | 2021-05-12 | 2022-11-25 | 太陽誘電株式会社 | 弾性波デバイス、フィルタ、マルチプレクサ並びにウエハおよびその製造方法 |
| JP2023552014A (ja) * | 2021-09-01 | 2023-12-14 | 福建晶安光電有限公司 | フィルタ用基板の加工方法、基板及びｔｃ－ｓａｗフィルタ |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112023005816T5 (de) | 2025-11-27 |
| TWI894823B (zh) | 2025-08-21 |
| CN120883509A (zh) | 2025-10-31 |
| TW202439780A (zh) | 2024-10-01 |
| WO2024202198A1 (ja) | 2024-10-03 |
| KR20250160194A (ko) | 2025-11-11 |
| JP7803004B2 (ja) | 2026-01-20 |
| US20260025117A1 (en) | 2026-01-22 |
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