TWI892005B - 圖型形成用組成物 - Google Patents

圖型形成用組成物

Info

Publication number
TWI892005B
TWI892005B TW111115428A TW111115428A TWI892005B TW I892005 B TWI892005 B TW I892005B TW 111115428 A TW111115428 A TW 111115428A TW 111115428 A TW111115428 A TW 111115428A TW I892005 B TWI892005 B TW I892005B
Authority
TW
Taiwan
Prior art keywords
group
carbon atoms
pattern
formula
forming composition
Prior art date
Application number
TW111115428A
Other languages
English (en)
Chinese (zh)
Other versions
TW202309147A (zh
Inventor
樹
古川智規
Original Assignee
日商日產化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日產化學股份有限公司 filed Critical 日商日產化學股份有限公司
Publication of TW202309147A publication Critical patent/TW202309147A/zh
Application granted granted Critical
Publication of TWI892005B publication Critical patent/TWI892005B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/0644—Poly(1,3,5)triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Plural Heterocyclic Compounds (AREA)
TW111115428A 2021-04-23 2022-04-22 圖型形成用組成物 TWI892005B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-073304 2021-04-23
JP2021073304 2021-04-23

Publications (2)

Publication Number Publication Date
TW202309147A TW202309147A (zh) 2023-03-01
TWI892005B true TWI892005B (zh) 2025-08-01

Family

ID=83722395

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111115428A TWI892005B (zh) 2021-04-23 2022-04-22 圖型形成用組成物

Country Status (5)

Country Link
JP (1) JPWO2022225014A1 (https=)
KR (1) KR20230175251A (https=)
CN (1) CN117597398A (https=)
TW (1) TWI892005B (https=)
WO (1) WO2022225014A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7334875B1 (ja) * 2023-03-10 2023-08-29 東ソー株式会社 ブロックイソシアネート組成物及びその製造方法、塗料用硬化剤、塗料組成物、並びに、塗膜

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201341426A (zh) * 2011-12-20 2013-10-16 Nissan Chemical Ind Ltd 含三嗪環之聚合物及含有該聚合物之膜形成用組成物
JP2013245206A (ja) * 2012-05-28 2013-12-09 Iwate Univ ヒドロキシ基含有芳香族ジアミン、ポリアミド樹脂、樹脂組成物、及び、それらの用途
JP2014162829A (ja) * 2013-02-22 2014-09-08 Idemitsu Kosan Co Ltd トリアジン環含有線状ポリマーからなる高屈折率材料
TW201734061A (zh) * 2016-02-09 2017-10-01 日產化學工業股份有限公司 含三嗪環聚合物及包含此之組成物
TW201930399A (zh) * 2017-11-08 2019-08-01 日商日產化學股份有限公司 含三嗪環之聚合物及包含該聚合物之組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101950714B1 (ko) 2009-05-07 2019-02-21 닛산 가가쿠 가부시키가이샤 트리아진환 함유 중합체 및 그것을 포함하는 막 형성용 조성물
EP2848967A4 (en) * 2012-05-11 2015-11-25 Nissan Chemical Ind Ltd FILM-COMPOSITE COMPOSITION
US10717818B2 (en) 2014-08-13 2020-07-21 Nissan Chemical Industries, Ltd. Polymer containing triazine ring and composition containing same
KR20170106369A (ko) 2015-01-15 2017-09-20 닛산 가가쿠 고교 가부시키 가이샤 트라이아진환 함유 중합체 및 그것을 포함하는 조성물
JP7605132B2 (ja) * 2019-12-09 2024-12-24 日産化学株式会社 パターン形成用組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201341426A (zh) * 2011-12-20 2013-10-16 Nissan Chemical Ind Ltd 含三嗪環之聚合物及含有該聚合物之膜形成用組成物
JP2013245206A (ja) * 2012-05-28 2013-12-09 Iwate Univ ヒドロキシ基含有芳香族ジアミン、ポリアミド樹脂、樹脂組成物、及び、それらの用途
JP2014162829A (ja) * 2013-02-22 2014-09-08 Idemitsu Kosan Co Ltd トリアジン環含有線状ポリマーからなる高屈折率材料
TW201734061A (zh) * 2016-02-09 2017-10-01 日產化學工業股份有限公司 含三嗪環聚合物及包含此之組成物
TW201930399A (zh) * 2017-11-08 2019-08-01 日商日產化學股份有限公司 含三嗪環之聚合物及包含該聚合物之組成物

Also Published As

Publication number Publication date
WO2022225014A1 (ja) 2022-10-27
TW202309147A (zh) 2023-03-01
JPWO2022225014A1 (https=) 2022-10-27
CN117597398A (zh) 2024-02-23
KR20230175251A (ko) 2023-12-29

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