TWI878447B - 用於電解處理工件之電極和設備、用於形成該設備之單元的組件以及方法和電腦程式 - Google Patents

用於電解處理工件之電極和設備、用於形成該設備之單元的組件以及方法和電腦程式 Download PDF

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Publication number
TWI878447B
TWI878447B TW110104374A TW110104374A TWI878447B TW I878447 B TWI878447 B TW I878447B TW 110104374 A TW110104374 A TW 110104374A TW 110104374 A TW110104374 A TW 110104374A TW I878447 B TWI878447 B TW I878447B
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TW
Taiwan
Prior art keywords
electrode
edge
workpiece
segment
segments
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TW110104374A
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English (en)
Chinese (zh)
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TW202136592A (zh
Inventor
亨利 庫茲
菲德納 溫諾
布瑞塔 席勒
Original Assignee
德商德國艾托特克公司
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Publication of TW202136592A publication Critical patent/TW202136592A/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
TW110104374A 2020-02-07 2021-02-05 用於電解處理工件之電極和設備、用於形成該設備之單元的組件以及方法和電腦程式 TWI878447B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20156050 2020-02-07
EP20156050.5 2020-02-07

Publications (2)

Publication Number Publication Date
TW202136592A TW202136592A (zh) 2021-10-01
TWI878447B true TWI878447B (zh) 2025-04-01

Family

ID=69526171

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110104374A TWI878447B (zh) 2020-02-07 2021-02-05 用於電解處理工件之電極和設備、用於形成該設備之單元的組件以及方法和電腦程式

Country Status (8)

Country Link
US (1) US12522942B2 (https=)
EP (1) EP4100562A1 (https=)
JP (1) JP7747642B2 (https=)
KR (1) KR20220139354A (https=)
CN (1) CN115349035B (https=)
PH (1) PH12022552031A1 (https=)
TW (1) TWI878447B (https=)
WO (1) WO2021156415A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117802557A (zh) * 2022-09-23 2024-04-02 奥特斯科技(重庆)有限公司 用于对部件承载件结构进行电镀覆的电镀覆设备和方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6919010B1 (en) * 2001-06-28 2005-07-19 Novellus Systems, Inc. Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06306693A (ja) * 1993-04-27 1994-11-01 Kawasaki Steel Corp 金属ストリップの幅方向めっき付着量制御用めっき電極ならびにめっき付着量制御方法
JPH10287997A (ja) * 1997-04-17 1998-10-27 Tomoji Watanabe メッキ装置
US6322673B1 (en) * 1999-12-18 2001-11-27 Electroplating Technologies, Ltd. Apparatus for electrochemical treatment of a continuous web
US7682498B1 (en) * 2001-06-28 2010-03-23 Novellus Systems, Inc. Rotationally asymmetric variable electrode correction
DE10141056C2 (de) * 2001-08-22 2003-12-24 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
US8858774B2 (en) 2008-11-07 2014-10-14 Novellus Systems, Inc. Electroplating apparatus for tailored uniformity profile
US10011917B2 (en) * 2008-11-07 2018-07-03 Lam Research Corporation Control of current density in an electroplating apparatus
CN102725442B (zh) 2009-11-03 2015-01-28 新南创新私人有限公司 用于太阳能电池的金属电极的光镀
TWI530593B (zh) 2014-08-11 2016-04-21 亞智科技股份有限公司 多陽極控制裝置及具有該裝置的電鍍設備

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6919010B1 (en) * 2001-06-28 2005-07-19 Novellus Systems, Inc. Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction

Also Published As

Publication number Publication date
KR20220139354A (ko) 2022-10-14
PH12022552031A1 (en) 2023-11-29
US20230062477A1 (en) 2023-03-02
WO2021156415A1 (en) 2021-08-12
JP7747642B2 (ja) 2025-10-01
CN115349035A (zh) 2022-11-15
EP4100562A1 (en) 2022-12-14
CN115349035B (zh) 2025-10-03
JP2023512815A (ja) 2023-03-29
TW202136592A (zh) 2021-10-01
US12522942B2 (en) 2026-01-13

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