JP7747642B2 - 被加工物を電解処理するための電極ならびに装置、装置のセルを形成するためのアセンブリ、方法、およびコンピュータプログラム - Google Patents
被加工物を電解処理するための電極ならびに装置、装置のセルを形成するためのアセンブリ、方法、およびコンピュータプログラムInfo
- Publication number
- JP7747642B2 JP7747642B2 JP2022547977A JP2022547977A JP7747642B2 JP 7747642 B2 JP7747642 B2 JP 7747642B2 JP 2022547977 A JP2022547977 A JP 2022547977A JP 2022547977 A JP2022547977 A JP 2022547977A JP 7747642 B2 JP7747642 B2 JP 7747642B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- workpiece
- edge
- segment
- coordinate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20156050 | 2020-02-07 | ||
| EP20156050.5 | 2020-02-07 | ||
| PCT/EP2021/052760 WO2021156415A1 (en) | 2020-02-07 | 2021-02-05 | Electrode and apparatus for electrolytically treating a workpiece, assembly for forming a cell of the apparatus and method and computer program |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023512815A JP2023512815A (ja) | 2023-03-29 |
| JP2023512815A5 JP2023512815A5 (https=) | 2024-01-19 |
| JP7747642B2 true JP7747642B2 (ja) | 2025-10-01 |
Family
ID=69526171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022547977A Active JP7747642B2 (ja) | 2020-02-07 | 2021-02-05 | 被加工物を電解処理するための電極ならびに装置、装置のセルを形成するためのアセンブリ、方法、およびコンピュータプログラム |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12522942B2 (https=) |
| EP (1) | EP4100562A1 (https=) |
| JP (1) | JP7747642B2 (https=) |
| KR (1) | KR20220139354A (https=) |
| CN (1) | CN115349035B (https=) |
| PH (1) | PH12022552031A1 (https=) |
| TW (1) | TWI878447B (https=) |
| WO (1) | WO2021156415A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117802557A (zh) * | 2022-09-23 | 2024-04-02 | 奥特斯科技(重庆)有限公司 | 用于对部件承载件结构进行电镀覆的电镀覆设备和方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005501181A (ja) | 2001-08-22 | 2005-01-13 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 電解処理システム用のセグメント化した対向電極 |
| CN105369337A (zh) | 2014-08-11 | 2016-03-02 | 亚智科技股份有限公司 | 多阳极控制装置及具有该装置的电镀设备 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06306693A (ja) * | 1993-04-27 | 1994-11-01 | Kawasaki Steel Corp | 金属ストリップの幅方向めっき付着量制御用めっき電極ならびにめっき付着量制御方法 |
| JPH10287997A (ja) * | 1997-04-17 | 1998-10-27 | Tomoji Watanabe | メッキ装置 |
| US6919010B1 (en) | 2001-06-28 | 2005-07-19 | Novellus Systems, Inc. | Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction |
| US6322673B1 (en) * | 1999-12-18 | 2001-11-27 | Electroplating Technologies, Ltd. | Apparatus for electrochemical treatment of a continuous web |
| US7682498B1 (en) * | 2001-06-28 | 2010-03-23 | Novellus Systems, Inc. | Rotationally asymmetric variable electrode correction |
| US8858774B2 (en) | 2008-11-07 | 2014-10-14 | Novellus Systems, Inc. | Electroplating apparatus for tailored uniformity profile |
| US10011917B2 (en) * | 2008-11-07 | 2018-07-03 | Lam Research Corporation | Control of current density in an electroplating apparatus |
| CN102725442B (zh) | 2009-11-03 | 2015-01-28 | 新南创新私人有限公司 | 用于太阳能电池的金属电极的光镀 |
-
2021
- 2021-02-05 WO PCT/EP2021/052760 patent/WO2021156415A1/en not_active Ceased
- 2021-02-05 PH PH1/2022/552031A patent/PH12022552031A1/en unknown
- 2021-02-05 JP JP2022547977A patent/JP7747642B2/ja active Active
- 2021-02-05 TW TW110104374A patent/TWI878447B/zh active
- 2021-02-05 EP EP21703460.2A patent/EP4100562A1/en active Pending
- 2021-02-05 US US17/796,887 patent/US12522942B2/en active Active
- 2021-02-05 KR KR1020227030834A patent/KR20220139354A/ko active Pending
- 2021-02-05 CN CN202180021766.6A patent/CN115349035B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005501181A (ja) | 2001-08-22 | 2005-01-13 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 電解処理システム用のセグメント化した対向電極 |
| CN105369337A (zh) | 2014-08-11 | 2016-03-02 | 亚智科技股份有限公司 | 多阳极控制装置及具有该装置的电镀设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220139354A (ko) | 2022-10-14 |
| PH12022552031A1 (en) | 2023-11-29 |
| US20230062477A1 (en) | 2023-03-02 |
| WO2021156415A1 (en) | 2021-08-12 |
| CN115349035A (zh) | 2022-11-15 |
| EP4100562A1 (en) | 2022-12-14 |
| CN115349035B (zh) | 2025-10-03 |
| TWI878447B (zh) | 2025-04-01 |
| JP2023512815A (ja) | 2023-03-29 |
| TW202136592A (zh) | 2021-10-01 |
| US12522942B2 (en) | 2026-01-13 |
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