JP7747642B2 - 被加工物を電解処理するための電極ならびに装置、装置のセルを形成するためのアセンブリ、方法、およびコンピュータプログラム - Google Patents

被加工物を電解処理するための電極ならびに装置、装置のセルを形成するためのアセンブリ、方法、およびコンピュータプログラム

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Publication number
JP7747642B2
JP7747642B2 JP2022547977A JP2022547977A JP7747642B2 JP 7747642 B2 JP7747642 B2 JP 7747642B2 JP 2022547977 A JP2022547977 A JP 2022547977A JP 2022547977 A JP2022547977 A JP 2022547977A JP 7747642 B2 JP7747642 B2 JP 7747642B2
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Japan
Prior art keywords
electrode
workpiece
edge
segment
coordinate
Prior art date
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JP2022547977A
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English (en)
Japanese (ja)
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JP2023512815A5 (https=
JP2023512815A (ja
Inventor
クンツェ ヘンリー
ヴィーナー フェアディナント
シェラー ブリッタ
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Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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Publication of JP2023512815A5 publication Critical patent/JP2023512815A5/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008Current shielding devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2022547977A 2020-02-07 2021-02-05 被加工物を電解処理するための電極ならびに装置、装置のセルを形成するためのアセンブリ、方法、およびコンピュータプログラム Active JP7747642B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20156050 2020-02-07
EP20156050.5 2020-02-07
PCT/EP2021/052760 WO2021156415A1 (en) 2020-02-07 2021-02-05 Electrode and apparatus for electrolytically treating a workpiece, assembly for forming a cell of the apparatus and method and computer program

Publications (3)

Publication Number Publication Date
JP2023512815A JP2023512815A (ja) 2023-03-29
JP2023512815A5 JP2023512815A5 (https=) 2024-01-19
JP7747642B2 true JP7747642B2 (ja) 2025-10-01

Family

ID=69526171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022547977A Active JP7747642B2 (ja) 2020-02-07 2021-02-05 被加工物を電解処理するための電極ならびに装置、装置のセルを形成するためのアセンブリ、方法、およびコンピュータプログラム

Country Status (8)

Country Link
US (1) US12522942B2 (https=)
EP (1) EP4100562A1 (https=)
JP (1) JP7747642B2 (https=)
KR (1) KR20220139354A (https=)
CN (1) CN115349035B (https=)
PH (1) PH12022552031A1 (https=)
TW (1) TWI878447B (https=)
WO (1) WO2021156415A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117802557A (zh) * 2022-09-23 2024-04-02 奥特斯科技(重庆)有限公司 用于对部件承载件结构进行电镀覆的电镀覆设备和方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005501181A (ja) 2001-08-22 2005-01-13 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 電解処理システム用のセグメント化した対向電極
CN105369337A (zh) 2014-08-11 2016-03-02 亚智科技股份有限公司 多阳极控制装置及具有该装置的电镀设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06306693A (ja) * 1993-04-27 1994-11-01 Kawasaki Steel Corp 金属ストリップの幅方向めっき付着量制御用めっき電極ならびにめっき付着量制御方法
JPH10287997A (ja) * 1997-04-17 1998-10-27 Tomoji Watanabe メッキ装置
US6919010B1 (en) 2001-06-28 2005-07-19 Novellus Systems, Inc. Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
US6322673B1 (en) * 1999-12-18 2001-11-27 Electroplating Technologies, Ltd. Apparatus for electrochemical treatment of a continuous web
US7682498B1 (en) * 2001-06-28 2010-03-23 Novellus Systems, Inc. Rotationally asymmetric variable electrode correction
US8858774B2 (en) 2008-11-07 2014-10-14 Novellus Systems, Inc. Electroplating apparatus for tailored uniformity profile
US10011917B2 (en) * 2008-11-07 2018-07-03 Lam Research Corporation Control of current density in an electroplating apparatus
CN102725442B (zh) 2009-11-03 2015-01-28 新南创新私人有限公司 用于太阳能电池的金属电极的光镀

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005501181A (ja) 2001-08-22 2005-01-13 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 電解処理システム用のセグメント化した対向電極
CN105369337A (zh) 2014-08-11 2016-03-02 亚智科技股份有限公司 多阳极控制装置及具有该装置的电镀设备

Also Published As

Publication number Publication date
KR20220139354A (ko) 2022-10-14
PH12022552031A1 (en) 2023-11-29
US20230062477A1 (en) 2023-03-02
WO2021156415A1 (en) 2021-08-12
CN115349035A (zh) 2022-11-15
EP4100562A1 (en) 2022-12-14
CN115349035B (zh) 2025-10-03
TWI878447B (zh) 2025-04-01
JP2023512815A (ja) 2023-03-29
TW202136592A (zh) 2021-10-01
US12522942B2 (en) 2026-01-13

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