KR20220139354A - 피가공물을 전해 처리하기 위한 전극 및 장치, 장치의 셀을 형성하기 위한 어셈블리, 방법 및 컴퓨터 프로그램 - Google Patents
피가공물을 전해 처리하기 위한 전극 및 장치, 장치의 셀을 형성하기 위한 어셈블리, 방법 및 컴퓨터 프로그램 Download PDFInfo
- Publication number
- KR20220139354A KR20220139354A KR1020227030834A KR20227030834A KR20220139354A KR 20220139354 A KR20220139354 A KR 20220139354A KR 1020227030834 A KR1020227030834 A KR 1020227030834A KR 20227030834 A KR20227030834 A KR 20227030834A KR 20220139354 A KR20220139354 A KR 20220139354A
- Authority
- KR
- South Korea
- Prior art keywords
- electrode
- workpiece
- segment
- edge
- coordinates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20156050 | 2020-02-07 | ||
| EP20156050.5 | 2020-02-07 | ||
| PCT/EP2021/052760 WO2021156415A1 (en) | 2020-02-07 | 2021-02-05 | Electrode and apparatus for electrolytically treating a workpiece, assembly for forming a cell of the apparatus and method and computer program |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20220139354A true KR20220139354A (ko) | 2022-10-14 |
Family
ID=69526171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227030834A Pending KR20220139354A (ko) | 2020-02-07 | 2021-02-05 | 피가공물을 전해 처리하기 위한 전극 및 장치, 장치의 셀을 형성하기 위한 어셈블리, 방법 및 컴퓨터 프로그램 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12522942B2 (https=) |
| EP (1) | EP4100562A1 (https=) |
| JP (1) | JP7747642B2 (https=) |
| KR (1) | KR20220139354A (https=) |
| CN (1) | CN115349035B (https=) |
| PH (1) | PH12022552031A1 (https=) |
| TW (1) | TWI878447B (https=) |
| WO (1) | WO2021156415A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117802557A (zh) * | 2022-09-23 | 2024-04-02 | 奥特斯科技(重庆)有限公司 | 用于对部件承载件结构进行电镀覆的电镀覆设备和方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06306693A (ja) * | 1993-04-27 | 1994-11-01 | Kawasaki Steel Corp | 金属ストリップの幅方向めっき付着量制御用めっき電極ならびにめっき付着量制御方法 |
| JPH10287997A (ja) * | 1997-04-17 | 1998-10-27 | Tomoji Watanabe | メッキ装置 |
| US6919010B1 (en) | 2001-06-28 | 2005-07-19 | Novellus Systems, Inc. | Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction |
| US6322673B1 (en) * | 1999-12-18 | 2001-11-27 | Electroplating Technologies, Ltd. | Apparatus for electrochemical treatment of a continuous web |
| US7682498B1 (en) * | 2001-06-28 | 2010-03-23 | Novellus Systems, Inc. | Rotationally asymmetric variable electrode correction |
| DE10141056C2 (de) * | 2001-08-22 | 2003-12-24 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen |
| US8858774B2 (en) | 2008-11-07 | 2014-10-14 | Novellus Systems, Inc. | Electroplating apparatus for tailored uniformity profile |
| US10011917B2 (en) * | 2008-11-07 | 2018-07-03 | Lam Research Corporation | Control of current density in an electroplating apparatus |
| CN102725442B (zh) | 2009-11-03 | 2015-01-28 | 新南创新私人有限公司 | 用于太阳能电池的金属电极的光镀 |
| TWI530593B (zh) | 2014-08-11 | 2016-04-21 | 亞智科技股份有限公司 | 多陽極控制裝置及具有該裝置的電鍍設備 |
-
2021
- 2021-02-05 WO PCT/EP2021/052760 patent/WO2021156415A1/en not_active Ceased
- 2021-02-05 PH PH1/2022/552031A patent/PH12022552031A1/en unknown
- 2021-02-05 JP JP2022547977A patent/JP7747642B2/ja active Active
- 2021-02-05 TW TW110104374A patent/TWI878447B/zh active
- 2021-02-05 EP EP21703460.2A patent/EP4100562A1/en active Pending
- 2021-02-05 US US17/796,887 patent/US12522942B2/en active Active
- 2021-02-05 KR KR1020227030834A patent/KR20220139354A/ko active Pending
- 2021-02-05 CN CN202180021766.6A patent/CN115349035B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| PH12022552031A1 (en) | 2023-11-29 |
| US20230062477A1 (en) | 2023-03-02 |
| WO2021156415A1 (en) | 2021-08-12 |
| JP7747642B2 (ja) | 2025-10-01 |
| CN115349035A (zh) | 2022-11-15 |
| EP4100562A1 (en) | 2022-12-14 |
| CN115349035B (zh) | 2025-10-03 |
| TWI878447B (zh) | 2025-04-01 |
| JP2023512815A (ja) | 2023-03-29 |
| TW202136592A (zh) | 2021-10-01 |
| US12522942B2 (en) | 2026-01-13 |
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Legal Events
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| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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St.27 status event code: A-2-3-E10-E13-lim-X000 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PA0201 | Request for examination |
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| D21 | Rejection of application intended |
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