KR20220139354A - 피가공물을 전해 처리하기 위한 전극 및 장치, 장치의 셀을 형성하기 위한 어셈블리, 방법 및 컴퓨터 프로그램 - Google Patents

피가공물을 전해 처리하기 위한 전극 및 장치, 장치의 셀을 형성하기 위한 어셈블리, 방법 및 컴퓨터 프로그램 Download PDF

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Publication number
KR20220139354A
KR20220139354A KR1020227030834A KR20227030834A KR20220139354A KR 20220139354 A KR20220139354 A KR 20220139354A KR 1020227030834 A KR1020227030834 A KR 1020227030834A KR 20227030834 A KR20227030834 A KR 20227030834A KR 20220139354 A KR20220139354 A KR 20220139354A
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KR
South Korea
Prior art keywords
electrode
workpiece
segment
edge
coordinates
Prior art date
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Pending
Application number
KR1020227030834A
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English (en)
Korean (ko)
Inventor
헨리 쿤체
페르디난트 비너
브리타 쉘러
Original Assignee
아토테크 도이칠란트 게엠베하 운트 콤파니 카게
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Publication of KR20220139354A publication Critical patent/KR20220139354A/ko
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008Current shielding devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
KR1020227030834A 2020-02-07 2021-02-05 피가공물을 전해 처리하기 위한 전극 및 장치, 장치의 셀을 형성하기 위한 어셈블리, 방법 및 컴퓨터 프로그램 Pending KR20220139354A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20156050 2020-02-07
EP20156050.5 2020-02-07
PCT/EP2021/052760 WO2021156415A1 (en) 2020-02-07 2021-02-05 Electrode and apparatus for electrolytically treating a workpiece, assembly for forming a cell of the apparatus and method and computer program

Publications (1)

Publication Number Publication Date
KR20220139354A true KR20220139354A (ko) 2022-10-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227030834A Pending KR20220139354A (ko) 2020-02-07 2021-02-05 피가공물을 전해 처리하기 위한 전극 및 장치, 장치의 셀을 형성하기 위한 어셈블리, 방법 및 컴퓨터 프로그램

Country Status (8)

Country Link
US (1) US12522942B2 (https=)
EP (1) EP4100562A1 (https=)
JP (1) JP7747642B2 (https=)
KR (1) KR20220139354A (https=)
CN (1) CN115349035B (https=)
PH (1) PH12022552031A1 (https=)
TW (1) TWI878447B (https=)
WO (1) WO2021156415A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117802557A (zh) * 2022-09-23 2024-04-02 奥特斯科技(重庆)有限公司 用于对部件承载件结构进行电镀覆的电镀覆设备和方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06306693A (ja) * 1993-04-27 1994-11-01 Kawasaki Steel Corp 金属ストリップの幅方向めっき付着量制御用めっき電極ならびにめっき付着量制御方法
JPH10287997A (ja) * 1997-04-17 1998-10-27 Tomoji Watanabe メッキ装置
US6919010B1 (en) 2001-06-28 2005-07-19 Novellus Systems, Inc. Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
US6322673B1 (en) * 1999-12-18 2001-11-27 Electroplating Technologies, Ltd. Apparatus for electrochemical treatment of a continuous web
US7682498B1 (en) * 2001-06-28 2010-03-23 Novellus Systems, Inc. Rotationally asymmetric variable electrode correction
DE10141056C2 (de) * 2001-08-22 2003-12-24 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
US8858774B2 (en) 2008-11-07 2014-10-14 Novellus Systems, Inc. Electroplating apparatus for tailored uniformity profile
US10011917B2 (en) * 2008-11-07 2018-07-03 Lam Research Corporation Control of current density in an electroplating apparatus
CN102725442B (zh) 2009-11-03 2015-01-28 新南创新私人有限公司 用于太阳能电池的金属电极的光镀
TWI530593B (zh) 2014-08-11 2016-04-21 亞智科技股份有限公司 多陽極控制裝置及具有該裝置的電鍍設備

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Publication number Publication date
PH12022552031A1 (en) 2023-11-29
US20230062477A1 (en) 2023-03-02
WO2021156415A1 (en) 2021-08-12
JP7747642B2 (ja) 2025-10-01
CN115349035A (zh) 2022-11-15
EP4100562A1 (en) 2022-12-14
CN115349035B (zh) 2025-10-03
TWI878447B (zh) 2025-04-01
JP2023512815A (ja) 2023-03-29
TW202136592A (zh) 2021-10-01
US12522942B2 (en) 2026-01-13

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