TWI840482B - 散熱性樹脂組成物用無機粉體及使用此的散熱性樹脂組成物，以及該等的製造方法 - Google Patents

散熱性樹脂組成物用無機粉體及使用此的散熱性樹脂組成物，以及該等的製造方法 Download PDF

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TWI840482B
TWI840482B TW108147730A TW108147730A TWI840482B TW I840482 B TWI840482 B TW I840482B TW 108147730 A TW108147730 A TW 108147730A TW 108147730 A TW108147730 A TW 108147730A TW I840482 B TWI840482 B TW I840482B
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inorganic
inorganic particles
resin composition
particles
particle size
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TW108147730A
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TW202033643A (zh
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中山篤
竹本克則
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日商住友化學股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW108147730A 2018-12-27 2019-12-26 散熱性樹脂組成物用無機粉體及使用此的散熱性樹脂組成物，以及該等的製造方法 TWI840482B (zh)

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JP2018-244647 2018-12-27
JP2018244647 2018-12-27

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TW202033643A TW202033643A (zh) 2020-09-16
TWI840482B true TWI840482B (zh) 2024-05-01

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TW108147730A TWI840482B (zh) 2018-12-27 2019-12-26 散熱性樹脂組成物用無機粉體及使用此的散熱性樹脂組成物，以及該等的製造方法

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US (1) US20220064400A1 (https=)
EP (1) EP3904310A4 (https=)
JP (1) JP7470051B2 (https=)
KR (1) KR20210106458A (https=)
CN (1) CN113227238B (https=)
TW (1) TWI840482B (https=)
WO (1) WO2020138335A1 (https=)

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WO2022210928A1 (ja) * 2021-03-31 2022-10-06 日鉄ケミカル＆マテリアル株式会社 球状アルミナ粒子混合物及びその製造方法、並びに当該球状アルミナ粒子混合物を含む樹脂複合組成物及び樹脂複合体
WO2023007894A1 (ja) * 2021-07-29 2023-02-02 昭和電工株式会社 熱伝導性樹脂組成物、硬化物、熱伝導部材及び電子機器
KR20240042413A (ko) * 2021-08-05 2024-04-02 가부시끼가이샤 도꾸야마 조성물 및 필러 혼합물
JP2023164332A (ja) * 2022-04-28 2023-11-10 住友化学株式会社 樹脂組成物およびそれに用いるアルミナ粉末
JP2023164333A (ja) * 2022-04-28 2023-11-10 住友化学株式会社 樹脂組成物およびそれに用いるアルミナ粉末
GB2633405A (en) * 2023-09-11 2025-03-12 Landa Labs 2012 Ltd Method an apparatus for 3D printing

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TW201821584A (zh) * 2016-10-31 2018-06-16 日商信越化學工業股份有限公司 熱傳導性矽氧組合物、半導體裝置及半導體裝置的製造方法

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JP3189590B2 (ja) * 1994-09-20 2001-07-16 東海ゴム工業株式会社 放熱シートおよびその製法
JP3490011B2 (ja) 1999-02-12 2004-01-26 富士高分子工業株式会社 熱伝導性エラストマー組成物およびこれを用いた熱伝導性エラストマー
JP5085972B2 (ja) * 2007-04-25 2012-11-28 三菱電機株式会社 絶縁シートおよび半導体装置
WO2009136508A1 (ja) * 2008-05-08 2009-11-12 富士高分子工業株式会社 熱伝導性樹脂組成物
JP2011088759A (ja) * 2009-10-20 2011-05-06 Nikkato:Kk アルミナ質耐火物及びその製造方法
JP5695780B1 (ja) * 2014-07-09 2015-04-08 株式会社ジーエル・マテリアルズホールディングス 高熱伝導性・電気絶縁性・低熱膨張性粉末及びそれを用いた放熱構造体、並びにその粉末の製造方法
JP6179015B2 (ja) * 2016-07-06 2017-08-16 株式会社アドマテックス 粉粒体及びその製造方法、並びに特性改質材
JPWO2018139642A1 (ja) * 2017-01-30 2019-11-14 積水化学工業株式会社 樹脂材料及び積層体
JP6659639B2 (ja) * 2017-03-22 2020-03-04 株式会社東芝 複合電解質、二次電池、電池パック及び車両
WO2019065148A1 (ja) * 2017-09-28 2019-04-04 富士フイルム株式会社 放熱シートおよび放熱シート付きデバイス

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Publication number Priority date Publication date Assignee Title
TW201821584A (zh) * 2016-10-31 2018-06-16 日商信越化學工業股份有限公司 熱傳導性矽氧組合物、半導體裝置及半導體裝置的製造方法

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WO2020138335A1 (ja) 2020-07-02
US20220064400A1 (en) 2022-03-03
EP3904310A4 (en) 2022-09-07
KR20210106458A (ko) 2021-08-30
CN113227238A (zh) 2021-08-06
JP7470051B2 (ja) 2024-04-17
CN113227238B (zh) 2023-04-11
JPWO2020138335A1 (ja) 2021-11-11
TW202033643A (zh) 2020-09-16
EP3904310A1 (en) 2021-11-03

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