JP5695780B1 - 高熱伝導性・電気絶縁性・低熱膨張性粉末及びそれを用いた放熱構造体、並びにその粉末の製造方法 - Google Patents
高熱伝導性・電気絶縁性・低熱膨張性粉末及びそれを用いた放熱構造体、並びにその粉末の製造方法 Download PDFInfo
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Physical Vapour Deposition (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
Abstract
Description
2 熱対流経路
3 熱輻射経路
4 ヒートスプレッダー
5 接着剤
6 半導体チップ
7 封止材
8 半田ボール
9 ビルドアップ基板
10 マザーボード
11 AlN又はSi3N4
12 無機粒子
13 銅又はアルミニウム板
14 合成樹脂
15 真空蒸着槽
16 蒸着源
17 撹拌槽
18 プロペラ
19 モーター
20 シャッター
21 ガス導入系
22 真空排気系
Claims (6)
- 無機粒子表面上に、平均粒子径1〜50nmであるAl又はSiのナノ粒子を物理蒸着法で堆積した後、窒素雰囲気下で熱処理することによって得られるAlN又はSi 3 N 4 で被覆されたことを特徴とする粉末。
- 前記無機粒子が、平均粒子径0.05〜100μmのAl2O3、Mg(OH)2、MgO、MgCO3、CaCO3、SiO2であり、前記ナノ粒子の厚さが0.05〜100μmの厚さであることを特徴とする、請求項1に記載のAlN又はSi 3 N 4 で被覆された粉末。
- 前記無機粒子が、平均粒子径1〜75μmの球状Al2O3で、前記ナノ粒子が1〜75μmの厚さであることを特徴とする、請求項2に記載のAlN又はSi 3 N 4 で被覆された粉末。
- 前記熱処理が、窒素雰囲気下、400〜600℃、3〜6時間であることを特徴とする、請求項1〜3のいずれか一つに記載のAlN又はSi 3 N 4 で被覆された粉末。
- 物理蒸着槽内の上部に設けられたAl又はSi蒸発源、前記蒸発源下部に設けられた前記蒸発物質が堆積する無機粒子を投入する撹拌槽、前記撹拌槽内に設けられた前記蒸発物質が前記無機粒子に均一に堆積するための撹拌機を少なくとも設置し、前記無機粒子を撹拌しながら、Al又はSi蒸発源を蒸発させることによって、Al又はSiナノ粒子を平均粒子径1〜50nmとなるように前記無機粒子表面上に堆積した後、窒素雰囲気下、400〜600℃、3〜6時間熱処理することを特徴とする、AlN又はSi 3 N 4 で被覆された粉末の製造方法。
- 請求項1〜4のいずれか一つに記載のAlN又はSi 3 N 4 で被覆された粉末を用いたことを特徴とする放熱構造体。
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JP5695780B1 true JP5695780B1 (ja) | 2015-04-08 |
JP2016017014A JP2016017014A (ja) | 2016-02-01 |
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Cited By (1)
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CN113329973A (zh) * | 2019-01-25 | 2021-08-31 | 电化株式会社 | 填料组合物、有机硅树脂组合物和散热部件 |
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KR102049600B1 (ko) * | 2018-03-16 | 2019-11-27 | 창원대학교 산학협력단 | 세라믹 나노융복합 방열필름 제조방법 |
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