KR20210106458A - 방열성 수지 조성물용 무기분체 및 이를 이용한 방열성 수지 조성물, 그리고 이들의 제조 방법 - Google Patents

방열성 수지 조성물용 무기분체 및 이를 이용한 방열성 수지 조성물, 그리고 이들의 제조 방법 Download PDF

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KR20210106458A
KR20210106458A KR1020217019910A KR20217019910A KR20210106458A KR 20210106458 A KR20210106458 A KR 20210106458A KR 1020217019910 A KR1020217019910 A KR 1020217019910A KR 20217019910 A KR20217019910 A KR 20217019910A KR 20210106458 A KR20210106458 A KR 20210106458A
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inorganic
inorganic particles
resin composition
particles
particle
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Korean (ko)
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아츠시 나카야마
카츠노리 타케모토
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스미또모 가가꾸 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020217019910A 2018-12-27 2019-12-26 방열성 수지 조성물용 무기분체 및 이를 이용한 방열성 수지 조성물, 그리고 이들의 제조 방법 Pending KR20210106458A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018244647 2018-12-27
JPJP-P-2018-244647 2018-12-27
PCT/JP2019/051239 WO2020138335A1 (ja) 2018-12-27 2019-12-26 放熱性樹脂組成物用無機粉体およびそれを用いた放熱性樹脂組成物、並びにそれらの製造方法

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KR20210106458A true KR20210106458A (ko) 2021-08-30

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US (1) US20220064400A1 (https=)
EP (1) EP3904310A4 (https=)
JP (1) JP7470051B2 (https=)
KR (1) KR20210106458A (https=)
CN (1) CN113227238B (https=)
TW (1) TWI840482B (https=)
WO (1) WO2020138335A1 (https=)

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WO2022210928A1 (ja) * 2021-03-31 2022-10-06 日鉄ケミカル＆マテリアル株式会社 球状アルミナ粒子混合物及びその製造方法、並びに当該球状アルミナ粒子混合物を含む樹脂複合組成物及び樹脂複合体
WO2023007894A1 (ja) * 2021-07-29 2023-02-02 昭和電工株式会社 熱伝導性樹脂組成物、硬化物、熱伝導部材及び電子機器
KR20240042413A (ko) * 2021-08-05 2024-04-02 가부시끼가이샤 도꾸야마 조성물 및 필러 혼합물
JP2023164332A (ja) * 2022-04-28 2023-11-10 住友化学株式会社 樹脂組成物およびそれに用いるアルミナ粉末
JP2023164333A (ja) * 2022-04-28 2023-11-10 住友化学株式会社 樹脂組成物およびそれに用いるアルミナ粉末
GB2633405A (en) * 2023-09-11 2025-03-12 Landa Labs 2012 Ltd Method an apparatus for 3D printing

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2000232190A (ja) 1999-02-12 2000-08-22 Fuji Kobunshi Kogyo Kk 熱伝導性エラストマー組成物およびこれを用いた熱伝導性エラストマー

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JP3189590B2 (ja) * 1994-09-20 2001-07-16 東海ゴム工業株式会社 放熱シートおよびその製法
JP5085972B2 (ja) * 2007-04-25 2012-11-28 三菱電機株式会社 絶縁シートおよび半導体装置
WO2009136508A1 (ja) * 2008-05-08 2009-11-12 富士高分子工業株式会社 熱伝導性樹脂組成物
JP2011088759A (ja) * 2009-10-20 2011-05-06 Nikkato:Kk アルミナ質耐火物及びその製造方法
JP5695780B1 (ja) * 2014-07-09 2015-04-08 株式会社ジーエル・マテリアルズホールディングス 高熱伝導性・電気絶縁性・低熱膨張性粉末及びそれを用いた放熱構造体、並びにその粉末の製造方法
JP6179015B2 (ja) * 2016-07-06 2017-08-16 株式会社アドマテックス 粉粒体及びその製造方法、並びに特性改質材
JP6607166B2 (ja) * 2016-10-31 2019-11-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JPWO2018139642A1 (ja) * 2017-01-30 2019-11-14 積水化学工業株式会社 樹脂材料及び積層体
JP6659639B2 (ja) * 2017-03-22 2020-03-04 株式会社東芝 複合電解質、二次電池、電池パック及び車両
WO2019065148A1 (ja) * 2017-09-28 2019-04-04 富士フイルム株式会社 放熱シートおよび放熱シート付きデバイス

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000232190A (ja) 1999-02-12 2000-08-22 Fuji Kobunshi Kogyo Kk 熱伝導性エラストマー組成物およびこれを用いた熱伝導性エラストマー

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WO2020138335A1 (ja) 2020-07-02
US20220064400A1 (en) 2022-03-03
EP3904310A4 (en) 2022-09-07
TWI840482B (zh) 2024-05-01
CN113227238A (zh) 2021-08-06
JP7470051B2 (ja) 2024-04-17
CN113227238B (zh) 2023-04-11
JPWO2020138335A1 (ja) 2021-11-11
TW202033643A (zh) 2020-09-16
EP3904310A1 (en) 2021-11-03

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