TWI837499B - 電子裝置密封用組成物、電子裝置密封膜形成方法及電子裝置密封膜 - Google Patents
電子裝置密封用組成物、電子裝置密封膜形成方法及電子裝置密封膜 Download PDFInfo
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- TWI837499B TWI837499B TW110128911A TW110128911A TWI837499B TW I837499 B TWI837499 B TW I837499B TW 110128911 A TW110128911 A TW 110128911A TW 110128911 A TW110128911 A TW 110128911A TW I837499 B TWI837499 B TW I837499B
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- acrylate
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- 238000007789 sealing Methods 0.000 title claims abstract description 267
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- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
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- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- KTQYWNARBMKMCX-UHFFFAOYSA-N tetraphenylene Chemical group C1=CC=C2C3=CC=CC=C3C3=CC=CC=C3C3=CC=CC=C3C2=C1 KTQYWNARBMKMCX-UHFFFAOYSA-N 0.000 description 1
- XROWMBWRMNHXMF-UHFFFAOYSA-J titanium tetrafluoride Chemical compound [F-].[F-].[F-].[F-].[Ti+4] XROWMBWRMNHXMF-UHFFFAOYSA-J 0.000 description 1
- ZWYDDDAMNQQZHD-UHFFFAOYSA-L titanium(ii) chloride Chemical compound [Cl-].[Cl-].[Ti+2] ZWYDDDAMNQQZHD-UHFFFAOYSA-L 0.000 description 1
- YONPGGFAJWQGJC-UHFFFAOYSA-K titanium(iii) chloride Chemical compound Cl[Ti](Cl)Cl YONPGGFAJWQGJC-UHFFFAOYSA-K 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 125000005580 triphenylene group Chemical group 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- DUNKXUFBGCUVQW-UHFFFAOYSA-J zirconium tetrachloride Chemical compound Cl[Zr](Cl)(Cl)Cl DUNKXUFBGCUVQW-UHFFFAOYSA-J 0.000 description 1
- OMQSJNWFFJOIMO-UHFFFAOYSA-J zirconium tetrafluoride Chemical compound F[Zr](F)(F)F OMQSJNWFFJOIMO-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Electroluminescent Light Sources (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020138397 | 2020-08-19 | ||
| JP2020-138397 | 2020-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202219232A TW202219232A (zh) | 2022-05-16 |
| TWI837499B true TWI837499B (zh) | 2024-04-01 |
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| TW110128911A TWI837499B (zh) | 2020-08-19 | 2021-08-05 | 電子裝置密封用組成物、電子裝置密封膜形成方法及電子裝置密封膜 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7736004B2 (https=) |
| CN (1) | CN116096563B (https=) |
| TW (1) | TWI837499B (https=) |
| WO (1) | WO2022039019A1 (https=) |
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| CN117296450A (zh) * | 2021-04-30 | 2023-12-26 | 柯尼卡美能达株式会社 | 电子器件密封用组合物、电子器件密封膜形成方法以及电子器件密封膜 |
| WO2024024942A1 (ja) * | 2022-07-29 | 2024-02-01 | コニカミノルタ株式会社 | 電子デバイス封止用組成物、電子デバイス封止膜及び電子デバイス封止膜の形成方法 |
| KR20250027790A (ko) * | 2022-07-29 | 2025-02-27 | 코니카 미놀타 가부시키가이샤 | 전자 디바이스 봉지용 조성물, 전자 디바이스 봉지막 및 전자 디바이스 봉지막의 형성 방법 |
| WO2025094586A1 (ja) * | 2023-10-31 | 2025-05-08 | コニカミノルタ株式会社 | インクジェット用の電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜 |
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| JP2007092037A (ja) * | 2005-09-02 | 2007-04-12 | Dainippon Ink & Chem Inc | シール剤用光硬化性組成物、液晶シール剤、及び液晶パネル |
| JP2010030290A (ja) * | 2008-06-26 | 2010-02-12 | Fujifilm Corp | バリア性積層体、ガスバリアフィルム、デバイスおよび積層体の製造方法 |
| TWI613221B (zh) * | 2012-11-27 | 2018-02-01 | 富士軟片股份有限公司 | 光硬化性組成物、轉印材料、硬化物及其製造方法、樹脂圖案製造方法、硬化膜、液晶顯示裝置、有機ｅｌ顯示裝置及觸控面板顯示裝置 |
| TW201908370A (zh) * | 2017-07-14 | 2019-03-01 | 日商富士軟片股份有限公司 | 熱硬化性樹脂組成物及其硬化膜、積層體、半導體裝置、以及該等的製造方法 |
| TW202028304A (zh) * | 2018-10-19 | 2020-08-01 | 日商富士軟片股份有限公司 | 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5620852B2 (ja) * | 2011-02-25 | 2014-11-05 | 富士フイルム株式会社 | バリア性積層体およびバリア性積層体の製造方法 |
| JP5835344B2 (ja) * | 2011-11-24 | 2015-12-24 | コニカミノルタ株式会社 | ガスバリアーフィルム及び電子機器 |
| JP6019791B2 (ja) * | 2012-06-19 | 2016-11-02 | 日立化成株式会社 | 隔壁形成材料、これを用いた感光性エレメント、隔壁の形成方法及び画像表示装置の製造方法 |
| JP6099198B2 (ja) * | 2013-03-29 | 2017-03-22 | 日本化薬株式会社 | エネルギー線硬化型樹脂組成物及びその硬化物 |
| WO2015002100A1 (ja) * | 2013-07-04 | 2015-01-08 | Jsr株式会社 | 有機ｅｌ素子 |
| KR20160049953A (ko) * | 2014-10-28 | 2016-05-10 | 삼성에스디아이 주식회사 | 광경화 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 장치 |
| JP2016169297A (ja) * | 2015-03-12 | 2016-09-23 | 日東電工株式会社 | 架橋剤および硬化性樹脂組成物、偏光フィルムおよびその製造方法、光学フィルムならびに画像表示装置 |
| KR101943687B1 (ko) * | 2015-06-19 | 2019-01-30 | 삼성에스디아이 주식회사 | 유기발광표시장치 |
| JP6868345B2 (ja) * | 2016-04-22 | 2021-05-12 | 日東電工株式会社 | 硬化性樹脂組成物、偏光フィルムおよびその製造方法、光学フィルムならびに画像表示装置 |
| TW201940337A (zh) * | 2018-03-23 | 2019-10-16 | 日商琳得科股份有限公司 | 氣體阻隔性層合體 |
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- 2021-08-03 JP JP2022543360A patent/JP7736004B2/ja active Active
- 2021-08-03 CN CN202180050776.2A patent/CN116096563B/zh active Active
- 2021-08-05 TW TW110128911A patent/TWI837499B/zh active
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|---|---|---|---|---|
| JP2007092037A (ja) * | 2005-09-02 | 2007-04-12 | Dainippon Ink & Chem Inc | シール剤用光硬化性組成物、液晶シール剤、及び液晶パネル |
| JP2010030290A (ja) * | 2008-06-26 | 2010-02-12 | Fujifilm Corp | バリア性積層体、ガスバリアフィルム、デバイスおよび積層体の製造方法 |
| TWI613221B (zh) * | 2012-11-27 | 2018-02-01 | 富士軟片股份有限公司 | 光硬化性組成物、轉印材料、硬化物及其製造方法、樹脂圖案製造方法、硬化膜、液晶顯示裝置、有機ｅｌ顯示裝置及觸控面板顯示裝置 |
| TW201908370A (zh) * | 2017-07-14 | 2019-03-01 | 日商富士軟片股份有限公司 | 熱硬化性樹脂組成物及其硬化膜、積層體、半導體裝置、以及該等的製造方法 |
| TW202028304A (zh) * | 2018-10-19 | 2020-08-01 | 日商富士軟片股份有限公司 | 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2022039019A1 (https=) | 2022-02-24 |
| TW202219232A (zh) | 2022-05-16 |
| CN116096563A (zh) | 2023-05-09 |
| WO2022039019A1 (ja) | 2022-02-24 |
| JP7736004B2 (ja) | 2025-09-09 |
| CN116096563B (zh) | 2025-02-28 |
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