TWI829725B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

Info

Publication number
TWI829725B
TWI829725B TW108125760A TW108125760A TWI829725B TW I829725 B TWI829725 B TW I829725B TW 108125760 A TW108125760 A TW 108125760A TW 108125760 A TW108125760 A TW 108125760A TW I829725 B TWI829725 B TW I829725B
Authority
TW
Taiwan
Prior art keywords
substrate
liquid
heating
irradiation point
laser light
Prior art date
Application number
TW108125760A
Other languages
English (en)
Chinese (zh)
Other versions
TW202027190A (zh
Inventor
日高章一郎
池田朋生
磧本榮一
岩永和也
林聖人
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202027190A publication Critical patent/TW202027190A/zh
Application granted granted Critical
Publication of TWI829725B publication Critical patent/TWI829725B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/007—Heating the liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW108125760A 2018-07-25 2019-07-22 基板處理裝置及基板處理方法 TWI829725B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-139747 2018-07-25
JP2018139747A JP7175119B2 (ja) 2018-07-25 2018-07-25 基板処理装置、および基板処理方法

Publications (2)

Publication Number Publication Date
TW202027190A TW202027190A (zh) 2020-07-16
TWI829725B true TWI829725B (zh) 2024-01-21

Family

ID=69178649

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108125760A TWI829725B (zh) 2018-07-25 2019-07-22 基板處理裝置及基板處理方法

Country Status (5)

Country Link
US (1) US11469116B2 (ja)
JP (1) JP7175119B2 (ja)
KR (1) KR20200011892A (ja)
CN (1) CN110783226B (ja)
TW (1) TWI829725B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200122486A (ko) * 2019-04-18 2020-10-28 삼성전자주식회사 웨이퍼 클리닝 장치
KR102270780B1 (ko) * 2019-04-30 2021-06-30 세메스 주식회사 막질 제거 방법, 기판 처리 방법 및 기판 처리 장치
JP7406404B2 (ja) 2020-02-28 2023-12-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7465164B2 (ja) 2020-07-08 2024-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012138510A (ja) * 2010-12-27 2012-07-19 Tokyo Electron Ltd 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
JP2013140881A (ja) * 2012-01-05 2013-07-18 Tokyo Electron Ltd 基板洗浄方法、基板洗浄装置及び基板洗浄用記憶媒体
TW201624595A (zh) * 2011-07-07 2016-07-01 東京威力科創股份有限公司 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體
JP2017224807A (ja) * 2016-05-31 2017-12-21 ラム・リサーチ・アーゲーＬａｍ Ｒｅｓｅａｒｃｈ Ａｇ ウエハ形状の物品を処理するための方法および装置
US20180090342A1 (en) * 2016-09-26 2018-03-29 SCREEN Holdings Co., Ltd. Substrate processing method

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3330300B2 (ja) * 1997-02-28 2002-09-30 東京エレクトロン株式会社 基板洗浄装置
US6334902B1 (en) * 1997-09-24 2002-01-01 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for removing a liquid from a surface
JP4111342B2 (ja) * 2004-07-02 2008-07-02 東京エレクトロン株式会社 周辺露光方法及びその装置
JP5043406B2 (ja) * 2006-11-21 2012-10-10 大日本スクリーン製造株式会社 基板乾燥方法および基板乾燥装置
US8129284B2 (en) * 2009-04-28 2012-03-06 Dainippon Screen Mfg. Co., Ltd. Heat treatment method and heat treatment apparatus for heating substrate by light irradiation
JP2011233574A (ja) * 2010-04-23 2011-11-17 Shibaura Mechatronics Corp 半導体装置の製造装置及び半導体装置の製造方法
KR20120034948A (ko) * 2010-10-04 2012-04-13 삼성전자주식회사 기판 건조 장치 및 이를 이용한 기판 건조 방법
JP5622675B2 (ja) * 2011-07-05 2014-11-12 株式会社東芝 基板処理方法及び基板処理装置
JP5852871B2 (ja) * 2011-12-12 2016-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6017922B2 (ja) 2012-10-29 2016-11-02 東京エレクトロン株式会社 基板乾燥方法、液処理システムおよび記憶媒体
JP6400919B2 (ja) * 2013-03-07 2018-10-03 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6255650B2 (ja) * 2013-05-13 2018-01-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5857001B2 (ja) * 2013-07-19 2016-02-10 東京エレクトロン株式会社 基板処理装置、基板処理方法及び基板処理用記録媒体
KR102308587B1 (ko) * 2014-03-19 2021-10-01 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
KR102343226B1 (ko) * 2014-09-04 2021-12-23 삼성전자주식회사 스팟 히터 및 이를 이용한 웨이퍼 클리닝 장치
JP6461621B2 (ja) * 2015-01-23 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US10332761B2 (en) * 2015-02-18 2019-06-25 SCREEN Holdings Co., Ltd. Substrate processing apparatus
JP6588819B2 (ja) * 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6547650B2 (ja) * 2016-02-05 2019-07-24 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6626762B2 (ja) * 2016-03-30 2019-12-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2017216416A (ja) * 2016-06-02 2017-12-07 株式会社ディスコ 洗浄装置
JP6722551B2 (ja) * 2016-08-31 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
KR101965349B1 (ko) * 2016-10-07 2019-08-14 세메스 주식회사 기판 처리 장치 및 방법
KR101866662B1 (ko) * 2016-10-27 2018-07-04 주식회사 아이엠티 레이저를 이용한 웨이퍼 표면 건조 장치
JP6811619B2 (ja) * 2017-01-12 2021-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US10658204B2 (en) * 2017-08-08 2020-05-19 Lam Research Ag Spin chuck with concentrated center and radial heating

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012138510A (ja) * 2010-12-27 2012-07-19 Tokyo Electron Ltd 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
TW201624595A (zh) * 2011-07-07 2016-07-01 東京威力科創股份有限公司 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體
JP2013140881A (ja) * 2012-01-05 2013-07-18 Tokyo Electron Ltd 基板洗浄方法、基板洗浄装置及び基板洗浄用記憶媒体
JP2017224807A (ja) * 2016-05-31 2017-12-21 ラム・リサーチ・アーゲーＬａｍ Ｒｅｓｅａｒｃｈ Ａｇ ウエハ形状の物品を処理するための方法および装置
US20180090342A1 (en) * 2016-09-26 2018-03-29 SCREEN Holdings Co., Ltd. Substrate processing method

Also Published As

Publication number Publication date
US11469116B2 (en) 2022-10-11
KR20200011892A (ko) 2020-02-04
US20200035517A1 (en) 2020-01-30
CN110783226B (zh) 2024-05-24
JP7175119B2 (ja) 2022-11-18
JP2020017633A (ja) 2020-01-30
TW202027190A (zh) 2020-07-16
CN110783226A (zh) 2020-02-11

Similar Documents

Publication Publication Date Title
TWI829725B (zh) 基板處理裝置及基板處理方法
KR102159840B1 (ko) 기판 액처리 방법, 기판 액처리 장치 및 기억 매체
KR101889145B1 (ko) 기판 처리 방법 및 기판 처리 장치
CN111816589B (zh) 基板处理装置和基板处理方法
JP4937678B2 (ja) 基板処理方法および基板処理装置
JP6728009B2 (ja) 基板処理方法および基板処理装置
JP7034634B2 (ja) 基板処理方法および基板処理装置
TWI785082B (zh) 基板處理裝置、基板處理方法及記錄媒體
KR101586534B1 (ko) 기판 처리 장치 및 기판 처리 방법
TWI798464B (zh) 基板處理裝置及基板處理方法
KR102508052B1 (ko) 기판 처리 방법 및 기판 처리 장치
TWI740095B (zh) 基板處理方法及基板處理裝置
KR20100056993A (ko) 디스크와 같은 물체의 표면에서 액체를 제거하기 위한 장치 및 방법
TWI818119B (zh) 基板處理方法、及基板處理裝置
JP5996329B2 (ja) 基板処理装置、および基板処理方法
JP7406404B2 (ja) 基板処理方法および基板処理装置
JP7512779B2 (ja) 液処理方法及び液処理装置
JP7038824B2 (ja) 基板処理方法および基板処理装置
JP7465164B2 (ja) 基板処理方法
JP2005038963A (ja) 基板の処理装置及び処理方法
TW202245915A (zh) 塗佈處理方法及塗佈處理裝置
JP2020021945A (ja) 基板処理装置および基板処理方法