TWI824412B - 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體 - Google Patents

凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體 Download PDF

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TWI824412B
TWI824412B TW111105452A TW111105452A TWI824412B TW I824412 B TWI824412 B TW I824412B TW 111105452 A TW111105452 A TW 111105452A TW 111105452 A TW111105452 A TW 111105452A TW I824412 B TWI824412 B TW I824412B
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Taiwan
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bumps
bump
film
conductive filler
base electrode
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TW111105452A
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Chinese (zh)
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TW202224113A (zh
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阿久津恭志
石松朋之
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日商迪睿合股份有限公司
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    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/01212—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps at a different location than on the final device, e.g. forming solder preforms
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    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01236—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in solid form, e.g. by using a powder or by laminating a foil
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    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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    • H10W72/221—Structures or relative sizes
    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
    • H10W72/223—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core characterised by the structure of the outermost layers, e.g. multilayered coatings
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    • H10W72/231—Shapes
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    • H10W72/234—Cross-sectional shape, i.e. in side view
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    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
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  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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TW111105452A 2015-01-13 2016-01-13 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體 TWI824412B (zh)

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Application Number Priority Date Filing Date Title
JPJP2015-004591 2015-01-13
JP2015004591 2015-01-13

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TW202224113A TW202224113A (zh) 2022-06-16
TWI824412B true TWI824412B (zh) 2023-12-01

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TW111105452A TWI824412B (zh) 2015-01-13 2016-01-13 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體
TW105101040A TWI774640B (zh) 2015-01-13 2016-01-13 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體

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US (1) US10943879B2 (enExample)
JP (1) JP6750228B2 (enExample)
KR (2) KR102182945B1 (enExample)
CN (1) CN107112253B (enExample)
TW (2) TWI824412B (enExample)
WO (1) WO2016114293A1 (enExample)

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JP7000685B2 (ja) * 2017-02-07 2022-01-20 昭和電工マテリアルズ株式会社 接続構造体の製造方法、及び、端子付き電極の製造方法並びにこれに用いられる導電粒子
WO2019235596A1 (ja) * 2018-06-06 2019-12-12 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法
JP7313913B2 (ja) * 2018-06-06 2023-07-25 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法
US12172240B2 (en) 2018-06-26 2024-12-24 Resonac Corporation Solder particles
KR20250046348A (ko) * 2018-06-26 2025-04-02 가부시끼가이샤 레조낙 땜납 입자 및 땜납 입자의 제조 방법
TWI826476B (zh) * 2018-06-26 2023-12-21 日商力森諾科股份有限公司 各向異性導電膜及其製造方法以及連接結構體的製造方法
CN115152007A (zh) * 2019-12-27 2022-10-04 昭和电工材料株式会社 焊料凸块形成用部件、焊料凸块形成用部件的制造方法及带焊料凸块的电极基板的制造方法
EP4084051A4 (en) * 2019-12-27 2023-08-02 Resonac Corporation SOLDER BALL FORMING ELEMENT, METHOD OF MAKING A SOLDER BALL FORMING MEMBER AND METHOD OF MAKING AN ELECTRODE SUBSTRATE WITH A SOLDER BALL
CN115868015A (zh) * 2020-07-27 2023-03-28 索尼半导体解决方案公司 电子设备
KR20220155139A (ko) 2021-05-14 2022-11-22 삼성전자주식회사 반도체 패키지
JP7697292B2 (ja) * 2021-06-30 2025-06-24 株式会社レゾナック はんだバンプ形成装置

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JP2003220669A (ja) * 2002-01-29 2003-08-05 Asahi Kasei Corp 異方性を有する導電性接着シートおよびその製造方法
JP2004080024A (ja) * 2002-08-02 2004-03-11 Senju Metal Ind Co Ltd はんだボール配置シート、その製造方法およびはんだバンプ形成方法
TW200849506A (en) * 2007-03-30 2008-12-16 Sumitomo Bakelite Co Connection structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit substrate
TW201101399A (en) * 2009-06-02 2011-01-01 Stats Chippac Ltd Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die
TWI387157B (zh) * 2006-04-27 2013-02-21 旭化成電子材料元件股份有限公司 導電粒子配置片材及其製造方法

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