JP6750228B2 - バンプ形成用フィルム、半導体装置及びその製造方法、並びに接続構造体 - Google Patents

バンプ形成用フィルム、半導体装置及びその製造方法、並びに接続構造体 Download PDF

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JP6750228B2
JP6750228B2 JP2016004215A JP2016004215A JP6750228B2 JP 6750228 B2 JP6750228 B2 JP 6750228B2 JP 2016004215 A JP2016004215 A JP 2016004215A JP 2016004215 A JP2016004215 A JP 2016004215A JP 6750228 B2 JP6750228 B2 JP 6750228B2
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bump
bumps
base electrode
conductive filler
forming film
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JP2016131242A5 (enExample
JP2016131242A (ja
Inventor
恭志 阿久津
恭志 阿久津
朋之 石松
朋之 石松
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Dexerials Corp
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Dexerials Corp
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    • H10W72/019—
    • H10W72/20—
    • H10W72/012—
    • H10W72/0711—
    • H10W72/01204—
    • H10W72/01212—
    • H10W72/01236—
    • H10W72/01304—
    • H10W72/01325—
    • H10W72/01336—
    • H10W72/01361—
    • H10W72/072—
    • H10W72/073—
    • H10W72/07338—
    • H10W72/223—
    • H10W72/225—
    • H10W72/232—
    • H10W72/234—
    • H10W72/241—
    • H10W72/252—
    • H10W72/253—
    • H10W72/255—
    • H10W72/281—
    • H10W72/29—
    • H10W72/322—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W72/90—
    • H10W72/944—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—
    • H10W99/00—

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Laminated Bodies (AREA)
JP2016004215A 2015-01-13 2016-01-13 バンプ形成用フィルム、半導体装置及びその製造方法、並びに接続構造体 Active JP6750228B2 (ja)

Applications Claiming Priority (2)

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JP2015004591 2015-01-13
JP2015004591 2015-01-13

Publications (3)

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JP2016131242A JP2016131242A (ja) 2016-07-21
JP2016131242A5 JP2016131242A5 (enExample) 2019-02-21
JP6750228B2 true JP6750228B2 (ja) 2020-09-02

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JP2016004215A Active JP6750228B2 (ja) 2015-01-13 2016-01-13 バンプ形成用フィルム、半導体装置及びその製造方法、並びに接続構造体

Country Status (6)

Country Link
US (1) US10943879B2 (enExample)
JP (1) JP6750228B2 (enExample)
KR (2) KR102182945B1 (enExample)
CN (1) CN107112253B (enExample)
TW (2) TWI774640B (enExample)
WO (1) WO2016114293A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7000685B2 (ja) * 2017-02-07 2022-01-20 昭和電工マテリアルズ株式会社 接続構造体の製造方法、及び、端子付き電極の製造方法並びにこれに用いられる導電粒子
JP7313913B2 (ja) * 2018-06-06 2023-07-25 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法
WO2019235596A1 (ja) * 2018-06-06 2019-12-12 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法
TWI826476B (zh) * 2018-06-26 2023-12-21 日商力森諾科股份有限公司 各向異性導電膜及其製造方法以及連接結構體的製造方法
US12172240B2 (en) 2018-06-26 2024-12-24 Resonac Corporation Solder particles
KR102786343B1 (ko) * 2018-06-26 2025-03-26 가부시끼가이샤 레조낙 땜납 입자 및 땜납 입자의 제조 방법
EP4084051A4 (en) * 2019-12-27 2023-08-02 Resonac Corporation SOLDER BALL FORMING ELEMENT, METHOD OF MAKING A SOLDER BALL FORMING MEMBER AND METHOD OF MAKING AN ELECTRODE SUBSTRATE WITH A SOLDER BALL
KR20220122663A (ko) * 2019-12-27 2022-09-02 쇼와덴코머티리얼즈가부시끼가이샤 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법
EP4191644A4 (en) * 2020-07-27 2024-02-07 Sony Semiconductor Solutions Corporation ELECTRONIC DEVICE
KR20220155139A (ko) 2021-05-14 2022-11-22 삼성전자주식회사 반도체 패키지
JP7697292B2 (ja) * 2021-06-30 2025-06-24 株式会社レゾナック はんだバンプ形成装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229714A (ja) * 1986-03-31 1987-10-08 日東電工株式会社 異方導電性シ−ト
JPH0574512A (ja) 1991-09-12 1993-03-26 Japan Aviation Electron Ind Ltd 電気接続用コネクタ
JP3812682B2 (ja) * 1994-05-10 2006-08-23 日立化成工業株式会社 異方導電性樹脂フィルム状成形物の製造法
JP4032439B2 (ja) 1996-05-23 2008-01-16 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JPH09320345A (ja) 1996-05-31 1997-12-12 Whitaker Corp:The 異方導電性フィルム
JPH10135224A (ja) * 1996-11-01 1998-05-22 Citizen Watch Co Ltd 半導体素子のバンプ形成方法
US7842599B2 (en) * 1997-05-27 2010-11-30 Wstp, Llc Bumping electronic components using transfer substrates
JP3362370B2 (ja) * 1998-05-14 2003-01-07 住友ベークライト株式会社 導電性ボール配列シートおよび導電性ボール配列シート製造装置
JP3995942B2 (ja) * 2002-01-29 2007-10-24 旭化成株式会社 異方性を有する導電性接着シートの製造方法
JP2004080024A (ja) * 2002-08-02 2004-03-11 Senju Metal Ind Co Ltd はんだボール配置シート、その製造方法およびはんだバンプ形成方法
CN1477703A (zh) * 2002-08-02 2004-02-25 ǧס������ҵ��ʽ���� 焊球组件及其生产方法，形成焊块的方法
JP3582654B2 (ja) 2002-10-04 2004-10-27 日立化成工業株式会社 接続部材
JP2004256788A (ja) * 2002-11-29 2004-09-16 Sekisui Chem Co Ltd 加熱消滅性材料
JP2005286349A (ja) 2005-05-23 2005-10-13 Sony Chem Corp バンプレス半導体装置
JPWO2007023834A1 (ja) * 2005-08-23 2009-02-26 株式会社ブリヂストン 接着剤組成物
US20070063344A1 (en) * 2005-09-22 2007-03-22 Chun-Hung Lin Chip package structure and bumping process
KR100772454B1 (ko) * 2006-04-24 2007-11-01 엘지전자 주식회사 이방성 도전 필름 및 그 제조방법
KR101240155B1 (ko) * 2006-04-27 2013-03-11 아사히 가세이 일렉트로닉스 가부시끼가이샤 도전 입자 배치 시트 및 이방성 도전 필름
US9123835B2 (en) * 2006-10-10 2015-09-01 Hitachi Chemical Company, Ltd. Connected structure and method for manufacture thereof
TWI416673B (zh) * 2007-03-30 2013-11-21 住友電木股份有限公司 覆晶半導體封裝用之接續構造、增層材料、密封樹脂組成物及電路基板
JP2008031483A (ja) * 2007-09-03 2008-02-14 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP5291917B2 (ja) * 2007-11-09 2013-09-18 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
TWI518810B (zh) * 2009-06-02 2016-01-21 史達晶片有限公司 半導體元件以及基於半導體晶粒的調準而形成與互連結構相對固定之凸塊下金層化之方法
JP6061443B2 (ja) 2010-12-24 2017-01-18 デクセリアルズ株式会社 異方性導電接着フィルム、接続構造体及びその製造方法
JP2012190871A (ja) * 2011-03-09 2012-10-04 Teramikros Inc 半導体装置およびその製造方法
CN109334132B (zh) * 2012-08-24 2022-02-25 迪睿合电子材料有限公司 各向异性导电膜及其制造方法
WO2014034741A1 (ja) 2012-08-29 2014-03-06 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法

Also Published As

Publication number Publication date
KR20190099103A (ko) 2019-08-23
TW201639090A (zh) 2016-11-01
KR102398451B1 (ko) 2022-05-16
CN107112253A (zh) 2017-08-29
JP2016131242A (ja) 2016-07-21
CN107112253B (zh) 2021-04-20
KR20170093170A (ko) 2017-08-14
US10943879B2 (en) 2021-03-09
US20180218990A1 (en) 2018-08-02
WO2016114293A1 (ja) 2016-07-21
KR102182945B1 (ko) 2020-11-25
TWI824412B (zh) 2023-12-01
TW202224113A (zh) 2022-06-16
TWI774640B (zh) 2022-08-21

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