TWI774640B - 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體 - Google Patents

凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體 Download PDF

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TWI774640B
TWI774640B TW105101040A TW105101040A TWI774640B TW I774640 B TWI774640 B TW I774640B TW 105101040 A TW105101040 A TW 105101040A TW 105101040 A TW105101040 A TW 105101040A TW I774640 B TWI774640 B TW I774640B
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Taiwan
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bumps
bump
film
forming
conductive filler
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TW105101040A
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Chinese (zh)
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TW201639090A (zh
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阿久津恭志
石松朋之
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日商迪睿合股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
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    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01212—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps at a different location than on the final device, e.g. forming as prepeg
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    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01236—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in solid form, e.g. by using a powder or by laminating a foil
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    • H10W72/01304—Manufacture or treatment of die-attach connectors using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
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    • H10W72/01336—Manufacture or treatment of die-attach connectors using blanket deposition in solid form, e.g. by using a powder or by laminating a foil
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    • H10W72/01361—Chemical or physical modification, e.g. by sintering or anodisation
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
    • H10W72/223—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core characterised by the structure of the outermost layers, e.g. multilayered coatings
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/225—Bumps having a filler embedded in a matrix
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    • H10W72/231—Shapes
    • H10W72/232—Plan-view shape, i.e. in top view
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    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/253—Materials not comprising solid metals or solid metalloids, e.g. polymers or ceramics
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    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/255—Materials of outermost layers of multilayered bumps, e.g. material of a coating
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  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Laminated Bodies (AREA)
TW105101040A 2015-01-13 2016-01-13 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體 TWI774640B (zh)

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Application Number Priority Date Filing Date Title
JP2015004591 2015-01-13
JPJP2015-004591 2015-01-13

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TW201639090A TW201639090A (zh) 2016-11-01
TWI774640B true TWI774640B (zh) 2022-08-21

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TW105101040A TWI774640B (zh) 2015-01-13 2016-01-13 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體
TW111105452A TWI824412B (zh) 2015-01-13 2016-01-13 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體

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Country Link
US (1) US10943879B2 (enExample)
JP (1) JP6750228B2 (enExample)
KR (2) KR102398451B1 (enExample)
CN (1) CN107112253B (enExample)
TW (2) TWI774640B (enExample)
WO (1) WO2016114293A1 (enExample)

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JP7000685B2 (ja) * 2017-02-07 2022-01-20 昭和電工マテリアルズ株式会社 接続構造体の製造方法、及び、端子付き電極の製造方法並びにこれに用いられる導電粒子
CN119053023A (zh) * 2018-06-06 2024-11-29 迪睿合株式会社 连接体、连接体的制造方法、连接方法
WO2019235596A1 (ja) * 2018-06-06 2019-12-12 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法
WO2020004513A1 (ja) 2018-06-26 2020-01-02 日立化成株式会社 はんだ粒子
TW202533904A (zh) * 2018-06-26 2025-09-01 日商力森諾科股份有限公司 焊料粒及焊料粒的製造方法
JP7452418B2 (ja) * 2018-06-26 2024-03-19 株式会社レゾナック 異方性導電フィルム及びその製造方法並びに接続構造体の製造方法
CN115152007A (zh) * 2019-12-27 2022-10-04 昭和电工材料株式会社 焊料凸块形成用部件、焊料凸块形成用部件的制造方法及带焊料凸块的电极基板的制造方法
EP4084051A4 (en) * 2019-12-27 2023-08-02 Resonac Corporation SOLDER BALL FORMING ELEMENT, METHOD OF MAKING A SOLDER BALL FORMING MEMBER AND METHOD OF MAKING AN ELECTRODE SUBSTRATE WITH A SOLDER BALL
US20240038706A1 (en) * 2020-07-27 2024-02-01 Sony Semiconductor Solutions Corporation Electronic device
KR20220155139A (ko) 2021-05-14 2022-11-22 삼성전자주식회사 반도체 패키지
JP7697292B2 (ja) * 2021-06-30 2025-06-24 株式会社レゾナック はんだバンプ形成装置

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JP2003220669A (ja) * 2002-01-29 2003-08-05 Asahi Kasei Corp 異方性を有する導電性接着シートおよびその製造方法
JP2004080024A (ja) * 2002-08-02 2004-03-11 Senju Metal Ind Co Ltd はんだボール配置シート、その製造方法およびはんだバンプ形成方法
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US20090090545A1 (en) * 2006-04-27 2009-04-09 Taketoshi Usui Electroconductive Particle Placement Sheet and Anisotropic Electroconductive Film
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