TWI774640B - 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體 - Google Patents

凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體 Download PDF

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TWI774640B
TWI774640B TW105101040A TW105101040A TWI774640B TW I774640 B TWI774640 B TW I774640B TW 105101040 A TW105101040 A TW 105101040A TW 105101040 A TW105101040 A TW 105101040A TW I774640 B TWI774640 B TW I774640B
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bumps
bump
film
forming
conductive filler
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TW105101040A
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English (en)
Chinese (zh)
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TW201639090A (zh
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阿久津恭志
石松朋之
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日商迪睿合股份有限公司
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

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