TWI820206B - 基板清洗構件及基板清洗裝置 - Google Patents

基板清洗構件及基板清洗裝置 Download PDF

Info

Publication number
TWI820206B
TWI820206B TW108132505A TW108132505A TWI820206B TW I820206 B TWI820206 B TW I820206B TW 108132505 A TW108132505 A TW 108132505A TW 108132505 A TW108132505 A TW 108132505A TW I820206 B TWI820206 B TW I820206B
Authority
TW
Taiwan
Prior art keywords
substrate
cleaning member
cleaning
small
diameter
Prior art date
Application number
TW108132505A
Other languages
English (en)
Chinese (zh)
Other versions
TW202017030A (zh
Inventor
石橋知淳
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202017030A publication Critical patent/TW202017030A/zh
Application granted granted Critical
Publication of TWI820206B publication Critical patent/TWI820206B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143—Wipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW108132505A 2018-10-12 2019-09-10 基板清洗構件及基板清洗裝置 TWI820206B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-193312 2018-10-12
JP2018193312A JP7166132B2 (ja) 2018-10-12 2018-10-12 基板洗浄部材および基板洗浄装置

Publications (2)

Publication Number Publication Date
TW202017030A TW202017030A (zh) 2020-05-01
TWI820206B true TWI820206B (zh) 2023-11-01

Family

ID=68280895

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108132505A TWI820206B (zh) 2018-10-12 2019-09-10 基板清洗構件及基板清洗裝置

Country Status (7)

Country Link
US (1) US11501983B2 (enExample)
EP (1) EP3636356B1 (enExample)
JP (1) JP7166132B2 (enExample)
KR (1) KR102708935B1 (enExample)
CN (1) CN111048442B (enExample)
SG (1) SG10201909509UA (enExample)
TW (1) TWI820206B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230163413A1 (en) 2020-04-06 2023-05-25 Lg Energy Solution, Ltd. Separator for electrochemical device and method for manufacturing same
JP6892176B1 (ja) * 2020-11-19 2021-06-23 不二越機械工業株式会社 ワーク洗浄装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW446583B (en) * 1998-07-10 2001-07-21 Applied Materials Inc Method and apparatus for wafer edge scrubbing
US20140366913A1 (en) * 2013-06-13 2014-12-18 K.C. Tech Co., Ltd. Substrate cleaning apparatus and method and brush assembly used therein

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB772599A (en) 1954-01-23 1957-04-17 Service Eng Ltd Improvements relating to brushing machines
US5375291A (en) 1992-05-18 1994-12-27 Tokyo Electron Limited Device having brush for scrubbing substrate
US5937469A (en) 1996-12-03 1999-08-17 Intel Corporation Apparatus for mechanically cleaning the edges of wafers
JPH11283952A (ja) * 1998-03-30 1999-10-15 Shibaura Mechatronics Corp ブラシ洗浄装置
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US20040040576A1 (en) 2002-08-29 2004-03-04 Yuxia Sun Wafer cleaning brush
KR100562502B1 (ko) 2003-07-02 2006-03-21 삼성전자주식회사 반도체 기판의 가장자리부 처리 장치 및 방법
JP3933670B2 (ja) 2005-03-29 2007-06-20 東京エレクトロン株式会社 基板洗浄方法及び基板洗浄装置
JP4768556B2 (ja) 2006-09-15 2011-09-07 Ｎｅｃ液晶テクノロジー株式会社 基板洗浄装置及び基板洗浄方法
JP2007272236A (ja) 2007-04-11 2007-10-18 Advanced Display Inc 基板端面洗浄装置、基板端面洗浄方法及び半導体装置の製造方法
JP2008282865A (ja) 2007-05-08 2008-11-20 Fuji Electric Device Technology Co Ltd スクラブ洗浄装置及びそれに用いられるロールスポンジアセンブリ
KR101020676B1 (ko) * 2008-11-26 2011-03-09 세메스 주식회사 기판 세정 장치
WO2010125663A1 (ja) * 2009-04-30 2010-11-04 アイオン株式会社 洗浄用スポンジローラ
JP5535687B2 (ja) 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
JP5645752B2 (ja) * 2011-05-25 2014-12-24 株式会社荏原製作所 基板洗浄方法及びロール洗浄部材
JP7224128B2 (ja) * 2018-08-09 2023-02-17 株式会社荏原製作所 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW446583B (en) * 1998-07-10 2001-07-21 Applied Materials Inc Method and apparatus for wafer edge scrubbing
US20140366913A1 (en) * 2013-06-13 2014-12-18 K.C. Tech Co., Ltd. Substrate cleaning apparatus and method and brush assembly used therein

Also Published As

Publication number Publication date
CN111048442B (zh) 2024-10-11
JP7166132B2 (ja) 2022-11-07
EP3636356A1 (en) 2020-04-15
JP2020061514A (ja) 2020-04-16
SG10201909509UA (en) 2020-05-28
US20200118843A1 (en) 2020-04-16
US11501983B2 (en) 2022-11-15
KR20200041791A (ko) 2020-04-22
KR102708935B1 (ko) 2024-09-25
CN111048442A (zh) 2020-04-21
EP3636356B1 (en) 2024-12-18
TW202017030A (zh) 2020-05-01

Similar Documents

Publication Publication Date Title
JP3549141B2 (ja) 基板処理装置および基板保持装置
JP5904169B2 (ja) 基板洗浄装置、基板洗浄方法及び記憶媒体
JP4621055B2 (ja) 基板とメニスカスとの境界面およびその取り扱い方法
JP5606471B2 (ja) 基板回転保持装置および基板処理装置
US20020094684A1 (en) Foam cleaning process in semiconductor manufacturing
US7743449B2 (en) System and method for a combined contact and non-contact wafer cleaning module
KR100695980B1 (ko) 기판세정장치
JP2010212295A (ja) 基板洗浄装置および基板洗浄方法
TWI820206B (zh) 基板清洗構件及基板清洗裝置
JP7290695B2 (ja) 超音波洗浄装置および洗浄具のクリーニング装置
JP3892635B2 (ja) 洗浄装置
US7007333B1 (en) System and method for a combined contact and non-contact wafer cleaning module
JP4451429B2 (ja) 洗浄装置
JP2002079190A (ja) 基板洗浄部材、ならびにこれを用いた基板洗浄装置および基板洗浄方法
JP4070686B2 (ja) 基板回転保持装置および回転式基板処理装置
JP7109291B2 (ja) 基板処理装置、基板処理方法、フォトマスク洗浄方法、及びフォトマスク製造方法
JP4963411B2 (ja) 半導体装置または半導体ウェハの製造方法
KR20100048407A (ko) 기판 지지 부재 및 이를 구비하는 기판 처리 장치
CN120834041A (zh) 晶片的清洗方法以及清洗装置
JP2004247746A (ja) 基板処理装置
JP2006332386A (ja) 基板洗浄装置及び基板洗浄方法
WO2022186227A1 (ja) ブラシローラ
JP2008244248A (ja) 基板処理装置および基板処理方法
JP2004356639A (ja) 基板処理装置および基板処理方法
JP2005123648A (ja) 基板処理装置