TWI815946B - 負型感光性樹脂組成物 - Google Patents

負型感光性樹脂組成物 Download PDF

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Publication number
TWI815946B
TWI815946B TW108128458A TW108128458A TWI815946B TW I815946 B TWI815946 B TW I815946B TW 108128458 A TW108128458 A TW 108128458A TW 108128458 A TW108128458 A TW 108128458A TW I815946 B TWI815946 B TW I815946B
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TW
Taiwan
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same
group
component
formula
mass
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TW108128458A
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English (en)
Chinese (zh)
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TW202024672A (zh
Inventor
鈴木朋哉
安達勲
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日商日產化學股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/04—Anhydrides, e.g. cyclic anhydrides
    • C08F222/06—Maleic anhydride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW108128458A 2018-08-30 2019-08-12 負型感光性樹脂組成物 TWI815946B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-162055 2018-08-30
JP2018162055 2018-08-30

Publications (2)

Publication Number Publication Date
TW202024672A TW202024672A (zh) 2020-07-01
TWI815946B true TWI815946B (zh) 2023-09-21

Family

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Family Applications (2)

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TW108128458A TWI815946B (zh) 2018-08-30 2019-08-12 負型感光性樹脂組成物
TW112131099A TWI868861B (zh) 2018-08-30 2019-08-12 負型感光性樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW112131099A TWI868861B (zh) 2018-08-30 2019-08-12 負型感光性樹脂組成物

Country Status (5)

Country Link
JP (2) JP7464911B2 (enExample)
KR (1) KR102723350B1 (enExample)
CN (1) CN112639618B (enExample)
TW (2) TWI815946B (enExample)
WO (1) WO2020044918A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102881600B1 (ko) 2021-08-25 2025-11-11 동우 화인켐 주식회사 감광성 수지 조성물, 이를 이용한 돌출형 패턴 및 화상표시장치
KR102779098B1 (ko) 2021-08-25 2025-03-07 동우 화인켐 주식회사 감광성 수지 조성물, 이를 이용한 돌출형 패턴 및 화상표시장치
KR102696681B1 (ko) 2021-08-25 2024-08-19 동우 화인켐 주식회사 감광성 수지 조성물, 이를 이용한 돌출형 패턴 및 화상표시장치
KR102875044B1 (ko) 2021-08-25 2025-10-21 동우 화인켐 주식회사 감광성 수지 조성물, 이를 이용한 돌출형 패턴 및 화상표시장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200705119A (en) * 2005-05-12 2007-02-01 Tokyo Ohka Kogyo Co Ltd A method for increasing optical stability of three-dimensional micro moldings
JP2010083997A (ja) * 2008-09-30 2010-04-15 Fujifilm Corp 硬化性着色組成物及びその製造方法、カラーフィルタ、並びに、固体撮像素子
TW201800460A (zh) * 2016-02-19 2018-01-01 富士軟片股份有限公司 硬化性組成物、遮光膜、固體攝影裝置及彩色濾光片
TW201827477A (zh) * 2017-01-30 2018-08-01 日商日本化藥股份有限公司 聚胺酯化合物、含有該化合物的活性能量線硬化型樹脂組成物及該組成物的用途

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JPS5867735U (ja) 1981-10-30 1983-05-09 佐藤　英一 紙容器の注出口の開口方法
JP2776810B2 (ja) 1987-07-03 1998-07-16 ソニー株式会社 固体撮像装置の製造方法
JP3254759B2 (ja) 1992-09-25 2002-02-12 ソニー株式会社 光学素子およびオンチップレンズの製造方法
JP4749760B2 (ja) * 2005-05-12 2011-08-17 東京応化工業株式会社 三次元微小成形体の製造方法
JP2007140174A (ja) * 2005-11-18 2007-06-07 Fujifilm Corp パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007249190A (ja) * 2006-02-14 2007-09-27 Fujifilm Electronic Materials Co Ltd 光硬化性組成物、それを用いた反射防止膜、及び固体撮像素子
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JP6019791B2 (ja) * 2012-06-19 2016-11-02 日立化成株式会社 隔壁形成材料、これを用いた感光性エレメント、隔壁の形成方法及び画像表示装置の製造方法
KR20160075566A (ko) * 2013-10-21 2016-06-29 닛산 가가쿠 고교 가부시키 가이샤 네가티브형 감광성 수지 조성물
KR101494733B1 (ko) * 2014-06-25 2015-02-23 동우 화인켐 주식회사 포토레지스트 패턴 형성 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200705119A (en) * 2005-05-12 2007-02-01 Tokyo Ohka Kogyo Co Ltd A method for increasing optical stability of three-dimensional micro moldings
JP2010083997A (ja) * 2008-09-30 2010-04-15 Fujifilm Corp 硬化性着色組成物及びその製造方法、カラーフィルタ、並びに、固体撮像素子
TW201800460A (zh) * 2016-02-19 2018-01-01 富士軟片股份有限公司 硬化性組成物、遮光膜、固體攝影裝置及彩色濾光片
TW201827477A (zh) * 2017-01-30 2018-08-01 日商日本化藥股份有限公司 聚胺酯化合物、含有該化合物的活性能量線硬化型樹脂組成物及該組成物的用途

Also Published As

Publication number Publication date
TW202024672A (zh) 2020-07-01
KR20210052452A (ko) 2021-05-10
TWI868861B (zh) 2025-01-01
JP7464911B2 (ja) 2024-04-10
CN112639618B (zh) 2025-01-28
KR102723350B1 (ko) 2024-10-30
JPWO2020044918A1 (ja) 2021-09-24
JP2024073626A (ja) 2024-05-29
WO2020044918A1 (ja) 2020-03-05
CN112639618A (zh) 2021-04-09
TW202346901A (zh) 2023-12-01

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