TWI814859B - 雷射加工裝置、雷射加工方法及成膜遮罩之製造方法 - Google Patents

雷射加工裝置、雷射加工方法及成膜遮罩之製造方法 Download PDF

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Publication number
TWI814859B
TWI814859B TW108123976A TW108123976A TWI814859B TW I814859 B TWI814859 B TW I814859B TW 108123976 A TW108123976 A TW 108123976A TW 108123976 A TW108123976 A TW 108123976A TW I814859 B TWI814859 B TW I814859B
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TW
Taiwan
Prior art keywords
laser
shielding cover
laser processing
optical system
wire harness
Prior art date
Application number
TW108123976A
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English (en)
Chinese (zh)
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TW202005736A (zh
Inventor
齋藤雄二
平山秀雄
Original Assignee
日商Ｖ科技股份有限公司
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Publication of TW202005736A publication Critical patent/TW202005736A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Photovoltaic Devices (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
TW108123976A 2018-07-09 2019-07-08 雷射加工裝置、雷射加工方法及成膜遮罩之製造方法 TWI814859B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018129709 2018-07-09
JP2018-129709 2018-07-09

Publications (2)

Publication Number Publication Date
TW202005736A TW202005736A (zh) 2020-02-01
TWI814859B true TWI814859B (zh) 2023-09-11

Family

ID=69142548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108123976A TWI814859B (zh) 2018-07-09 2019-07-08 雷射加工裝置、雷射加工方法及成膜遮罩之製造方法

Country Status (6)

Country Link
JP (1) JP7175457B2 (de)
KR (1) KR102644949B1 (de)
CN (1) CN112384323B (de)
DE (1) DE112019003473T5 (de)
TW (1) TWI814859B (de)
WO (2) WO2020012771A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7393087B2 (ja) * 2019-09-26 2023-12-06 株式会社オーク製作所 アブレーション加工用の加工装置および加工方法
CN115210973B (zh) * 2020-03-10 2023-08-01 三菱电机株式会社 波长变换激光装置及波长变换激光加工机
CN113795087B (zh) * 2021-11-15 2022-05-03 深圳市大族数控科技股份有限公司 开窗方法及开窗设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1376100A (zh) * 1999-09-28 2002-10-23 住友重机械工业株式会社 激光钻孔的加工方法及其加工装置
CN104105569A (zh) * 2012-11-02 2014-10-15 万佳雷射有限公司 用于在介电基片中形成精细尺度结构的方法和设备
TW201723203A (zh) * 2015-06-17 2017-07-01 V Technology Co Ltd 成膜遮罩及成膜遮罩之製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989476A (ja) * 1983-10-11 1984-05-23 Toshiba Corp レ−ザ光照射方法
US8378258B2 (en) * 2004-08-02 2013-02-19 Ipg Microsystems Llc System and method for laser machining
JP2008147242A (ja) * 2006-12-06 2008-06-26 Hitachi Via Mechanics Ltd プリント基板のレーザ加工方法
KR101335951B1 (ko) * 2012-04-23 2013-12-04 (주)파랑 Ｌｄｓ를 이용한 안테나 패턴형성장치
JP5989476B2 (ja) 2012-09-19 2016-09-07 ヤンマー株式会社 油圧ポンプ装置
JP2015534903A (ja) * 2012-11-02 2015-12-07 エム−ソルヴ・リミテッド 誘電体基板内に微細スケール構造を形成するための方法及び装置
JP6078747B2 (ja) * 2013-01-28 2017-02-15 株式会社ブイ・テクノロジー 蒸着マスクの製造方法及びレーザ加工装置
US11433484B2 (en) * 2016-03-10 2022-09-06 Hon Hai Precision Industry Co., Ltd. Deposition mask, mask member for deposition mask, method of manufacturing deposition mask, and method of manufacturing organic EL display apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1376100A (zh) * 1999-09-28 2002-10-23 住友重机械工业株式会社 激光钻孔的加工方法及其加工装置
CN104105569A (zh) * 2012-11-02 2014-10-15 万佳雷射有限公司 用于在介电基片中形成精细尺度结构的方法和设备
TW201723203A (zh) * 2015-06-17 2017-07-01 V Technology Co Ltd 成膜遮罩及成膜遮罩之製造方法

Also Published As

Publication number Publication date
WO2020012771A1 (ja) 2020-01-16
KR102644949B1 (ko) 2024-03-08
WO2020013122A1 (ja) 2020-01-16
CN112384323A (zh) 2021-02-19
JPWO2020013122A1 (ja) 2021-08-02
DE112019003473T5 (de) 2021-04-01
CN112384323B (zh) 2023-08-15
TW202005736A (zh) 2020-02-01
JP7175457B2 (ja) 2022-11-21
KR20210028650A (ko) 2021-03-12

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