JP2020192550A - レーザ加工装置 - Google Patents
レーザ加工装置 Download PDFInfo
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- JP2020192550A JP2020192550A JP2019098389A JP2019098389A JP2020192550A JP 2020192550 A JP2020192550 A JP 2020192550A JP 2019098389 A JP2019098389 A JP 2019098389A JP 2019098389 A JP2019098389 A JP 2019098389A JP 2020192550 A JP2020192550 A JP 2020192550A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
Description
マスクを介された加工用レーザ光を被加工物に照射する投影光学系と、
被加工物が載置されると共に、x−y方向に被加工物を移動させる被加工物載置テーブルと、
一体で変位するように、照明光学系、マスク支持部、投影光学系及び被加工物載置テーブルが固定される支持体と、
支持体の振動を抑制する制振装置と
を備えたレーザ加工装置である。
13・・・マスク、14・・・投影光学系、15・・・載置テーブル、
16・・・走査機構、17・・・照明光学系、18・・・マスクステージ、
25・・・ガイドビーム光源、27・・・ビーム位置補正部、32・・・センサ
Claims (6)
- ライン状の加工用レーザ光をマスクに照射すると共に、走査機構によって前記マスクを走査する照明光学系と、
前記マスクを介された前記加工用レーザ光を被加工物に照射する投影光学系と、
前記被加工物が載置されると共に、x−y方向に前記被加工物を移動させる被加工物載置テーブルと、
一体で変位するように、前記照明光学系、前記マスクの支持部、前記投影光学系及び前
記被加工物載置テーブルが固定される支持体と、
前記支持体の振動を抑制する制振装置と
を備えたレーザ加工装置。 - 前記照明光学系がライン状の前記加工用レーザ光を出射し、前記走査機構が前記加工用レーザ光をライン方向と直交する方向に直線的に変位させるようにした請求項1に記載のレーザ加工装置。
- 前記加工用レーザ光を発生するレーザ光源が前記支持体と別個に設けられ、
ビーム位置補正部によって、前記加工用レーザ光の前記照明光学系に対する入射位置及び入射角度が所定のものに制御されるようにした請求項1又は2に記載のレーザ加工装置。 - 前記加工用レーザ光及びガイド用レーザ光を発生するレーザ光源が前記支持体と別個に設けられ、
前記加工用レーザ光が前記照明光学系に対して入射され、
前記加工用レーザ光及び前記ガイド用レーザ光がビーム位置補正部に供給され、
前記ビーム位置補正部によって、前記加工用レーザ光の前記照明光学系に対する入射位置及び入射角度が所定のものに補正されるようにした請求項1から3のいずれかに記載のレーザ加工装置。 - 前記ビーム位置補正部は少なくとも1つの光学素子を備え、
前記光学素子は、前記加工用レーザ光に対応した表面処理と前記ガイド用レーザ光に対
応した表面処理とが1つの面内に施されていることを特徴とする請求項4に記載のレーザ加工装置。 - 被加工物載置テーブルが、前記ライン方向に間欠的に移動することで、前記被加工物の複数の領域に逐次加工を行なうことを特徴とする前記請求項2に記載のレーザ加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019098389A JP7278868B2 (ja) | 2019-05-27 | 2019-05-27 | レーザ加工装置 |
TW109104661A TW202042948A (zh) | 2019-05-27 | 2020-02-14 | 雷射加工裝置 |
KR1020200021531A KR102627053B1 (ko) | 2019-05-27 | 2020-02-21 | 레이저 가공 장치 |
CN202010277835.7A CN111992893A (zh) | 2019-05-27 | 2020-04-10 | 激光加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019098389A JP7278868B2 (ja) | 2019-05-27 | 2019-05-27 | レーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020192550A true JP2020192550A (ja) | 2020-12-03 |
JP7278868B2 JP7278868B2 (ja) | 2023-05-22 |
Family
ID=73461720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019098389A Active JP7278868B2 (ja) | 2019-05-27 | 2019-05-27 | レーザ加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7278868B2 (ja) |
KR (1) | KR102627053B1 (ja) |
CN (1) | CN111992893A (ja) |
TW (1) | TW202042948A (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001096390A (ja) * | 1999-09-29 | 2001-04-10 | Sumitomo Heavy Ind Ltd | レーザ加工装置用コンタクトマスクのクリーニング方法及びマスククリーニング機構付きレーザ加工装置 |
JP2008068275A (ja) * | 2006-09-13 | 2008-03-27 | Hiraide Seimitsu:Kk | ビーム加工装置およびビーム観察装置 |
JP2008147242A (ja) * | 2006-12-06 | 2008-06-26 | Hitachi Via Mechanics Ltd | プリント基板のレーザ加工方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001079678A (ja) | 1999-09-13 | 2001-03-27 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
US20050237895A1 (en) * | 2004-04-23 | 2005-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus and method for manufacturing semiconductor device |
KR100556586B1 (ko) * | 2004-08-03 | 2006-03-06 | 주식회사 이오테크닉스 | 오차 보정이 가능한 폴리곤 미러를 이용한 레이저 가공장치 |
KR101210979B1 (ko) * | 2007-11-27 | 2012-12-11 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 레이저 가공 장치 |
JP5931537B2 (ja) * | 2012-03-28 | 2016-06-08 | 東レエンジニアリング株式会社 | レーザの光軸アライメント方法およびそれを用いたレーザ加工装置 |
JP5649015B1 (ja) * | 2013-02-22 | 2015-01-07 | 古河電気工業株式会社 | レーザ溶接装置及びレーザ溶接方法 |
-
2019
- 2019-05-27 JP JP2019098389A patent/JP7278868B2/ja active Active
-
2020
- 2020-02-14 TW TW109104661A patent/TW202042948A/zh unknown
- 2020-02-21 KR KR1020200021531A patent/KR102627053B1/ko active IP Right Grant
- 2020-04-10 CN CN202010277835.7A patent/CN111992893A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001096390A (ja) * | 1999-09-29 | 2001-04-10 | Sumitomo Heavy Ind Ltd | レーザ加工装置用コンタクトマスクのクリーニング方法及びマスククリーニング機構付きレーザ加工装置 |
JP2008068275A (ja) * | 2006-09-13 | 2008-03-27 | Hiraide Seimitsu:Kk | ビーム加工装置およびビーム観察装置 |
JP2008147242A (ja) * | 2006-12-06 | 2008-06-26 | Hitachi Via Mechanics Ltd | プリント基板のレーザ加工方法 |
Also Published As
Publication number | Publication date |
---|---|
CN111992893A (zh) | 2020-11-27 |
TW202042948A (zh) | 2020-12-01 |
KR20200136304A (ko) | 2020-12-07 |
KR102627053B1 (ko) | 2024-01-19 |
JP7278868B2 (ja) | 2023-05-22 |
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