TWI813076B - 儲存系統 - Google Patents
儲存系統 Download PDFInfo
- Publication number
- TWI813076B TWI813076B TW110143355A TW110143355A TWI813076B TW I813076 B TWI813076 B TW I813076B TW 110143355 A TW110143355 A TW 110143355A TW 110143355 A TW110143355 A TW 110143355A TW I813076 B TWI813076 B TW I813076B
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- TW
- Taiwan
- Prior art keywords
- package
- semiconductor package
- tray
- storage
- priority
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0668—Interfaces specially adapted for storage systems adopting a particular infrastructure
- G06F3/0671—In-line storage system
- G06F3/0683—Plurality of storage devices
- G06F3/0688—Non-volatile semiconductor memory arrays
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0602—Interfaces specially adapted for storage systems specifically adapted to achieve a particular effect
- G06F3/0625—Power saving in storage systems
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0628—Interfaces specially adapted for storage systems making use of a particular technique
- G06F3/0653—Monitoring storage devices or systems
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
- G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40036—Transport plates or sheets between two locations without motion inversion
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/12—Group selection circuits, e.g. for memory block selection, chip selection, array selection
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Memory System (AREA)
- Vehicle Body Suspensions (AREA)
- Memory System Of A Hierarchy Structure (AREA)
- Valve Device For Special Equipments (AREA)
- Read Only Memory (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/032273 WO2023032121A1 (ja) | 2021-09-02 | 2021-09-02 | ストレージシステム |
| WOJP2021/032273 | 2021-09-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202312454A TW202312454A (zh) | 2023-03-16 |
| TWI813076B true TWI813076B (zh) | 2023-08-21 |
Family
ID=85410830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110143355A TWI813076B (zh) | 2021-09-02 | 2021-11-22 | 儲存系統 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240201660A1 (https=) |
| EP (1) | EP4383082A4 (https=) |
| JP (1) | JP7585507B2 (https=) |
| CN (1) | CN117396855A (https=) |
| DE (1) | DE112021008171T5 (https=) |
| TW (1) | TWI813076B (https=) |
| WO (1) | WO2023032121A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197697A (ja) * | 2001-12-28 | 2003-07-11 | Hitachi Ltd | 半導体装置の製造方法 |
| TWI371068B (https=) * | 2003-12-22 | 2012-08-21 | Renesas Electronics Corp | |
| TWI397946B (zh) * | 2005-07-29 | 2013-06-01 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
| TWI529726B (zh) * | 2012-09-06 | 2016-04-11 | 東芝股份有限公司 | 半導體記憶裝置、控制其之方法及記憶系統 |
| JP2020194889A (ja) * | 2019-05-28 | 2020-12-03 | 東京エレクトロン株式会社 | 搬送システム、検査システム及び検査方法 |
| TWI716685B (zh) * | 2017-05-22 | 2021-01-21 | 旺宏電子股份有限公司 | 電子系統及其操作方法 |
| TWI736342B (zh) * | 2019-12-31 | 2021-08-11 | 台灣積體電路製造股份有限公司 | 用於托盤匣倉儲的系統及方法 |
| TWI736049B (zh) * | 2019-02-06 | 2021-08-11 | 美商惠普發展公司有限責任合夥企業 | 用於流體晶粒之具有位址驅動器的積體電路 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000030433A (ja) * | 1998-07-09 | 2000-01-28 | Sony Corp | メモリカードとそのチェンジャー装置 |
| US7480807B2 (en) * | 2002-02-05 | 2009-01-20 | Asaca Corporation | Data storage system |
| KR100899942B1 (ko) * | 2007-05-31 | 2009-05-28 | 미래산업 주식회사 | 테스트 핸들러, 그를 이용한 반도체 소자 제조방법, 및테스트트레이 이송방법 |
| US8238099B2 (en) * | 2008-04-17 | 2012-08-07 | Teradyne, Inc. | Enclosed operating area for disk drive testing systems |
| US8402196B2 (en) * | 2010-03-04 | 2013-03-19 | Xyratex Technology Limited | Storage assembly, a physical expander and a method |
| US8743549B2 (en) * | 2011-03-22 | 2014-06-03 | Amazon Technologies, Inc. | Modular mass storage system |
| WO2014041905A1 (ja) * | 2012-09-11 | 2014-03-20 | シャープ株式会社 | 試験用治具、検査装置、載置装置および試験装置 |
| US20140310458A1 (en) * | 2013-04-11 | 2014-10-16 | Tencent Technology (Shenzhen) Company Limited | Data transferring method and apparatus and storage system |
| US9501110B2 (en) * | 2014-06-05 | 2016-11-22 | Liqid Inc. | Adjustable data storage drive module carrier assembly |
| JP2016081332A (ja) | 2014-10-17 | 2016-05-16 | 株式会社日立エルジーデータストレージ | 計算機システムおよび装置管理サーバ |
| US9607660B2 (en) * | 2015-05-28 | 2017-03-28 | Seagate Technology Llc | Carrier used for mounting data storage drive into enclosure |
| US10467163B1 (en) | 2015-10-27 | 2019-11-05 | Pavilion Data Systems, Inc. | Solid state drive multiplexer |
| US9812410B2 (en) * | 2015-12-31 | 2017-11-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lid structure for a semiconductor device package and method for forming the same |
| US10334334B2 (en) | 2016-07-22 | 2019-06-25 | Intel Corporation | Storage sled and techniques for a data center |
| US10922071B2 (en) | 2019-03-13 | 2021-02-16 | Quanta Computer Inc. | Centralized off-board flash memory for server devices |
| WO2021095252A1 (ja) | 2019-11-15 | 2021-05-20 | キオクシア株式会社 | ストレージデバイスおよびストレージシステム |
| WO2021095232A1 (ja) | 2019-11-15 | 2021-05-20 | キオクシア株式会社 | ストレージシステム及びウェハ |
| DE112020007731T5 (de) * | 2020-12-25 | 2023-08-10 | Yamaha Hatsudoki Kabushiki Kaisha | Bauteillagerungssystem, Bauteillager und Magazinvorbereitungsverfahren |
-
2021
- 2021-09-02 JP JP2023544910A patent/JP7585507B2/ja active Active
- 2021-09-02 CN CN202180098859.9A patent/CN117396855A/zh active Pending
- 2021-09-02 EP EP21956010.9A patent/EP4383082A4/en active Pending
- 2021-09-02 DE DE112021008171.3T patent/DE112021008171T5/de active Pending
- 2021-09-02 WO PCT/JP2021/032273 patent/WO2023032121A1/ja not_active Ceased
- 2021-11-22 TW TW110143355A patent/TWI813076B/zh active
-
2024
- 2024-02-29 US US18/592,235 patent/US20240201660A1/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197697A (ja) * | 2001-12-28 | 2003-07-11 | Hitachi Ltd | 半導体装置の製造方法 |
| TWI371068B (https=) * | 2003-12-22 | 2012-08-21 | Renesas Electronics Corp | |
| TWI397946B (zh) * | 2005-07-29 | 2013-06-01 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
| TWI529726B (zh) * | 2012-09-06 | 2016-04-11 | 東芝股份有限公司 | 半導體記憶裝置、控制其之方法及記憶系統 |
| TWI622986B (zh) * | 2012-09-06 | 2018-05-01 | 東芝記憶體股份有限公司 | 用於在半導體記憶裝置執行抹除操作之方法及半導體記憶裝置 |
| TWI713035B (zh) * | 2012-09-06 | 2020-12-11 | 日商東芝記憶體股份有限公司 | 半導體記憶裝置、半導體記憶系統、及操作半導體記憶裝置之方法 |
| TWI716685B (zh) * | 2017-05-22 | 2021-01-21 | 旺宏電子股份有限公司 | 電子系統及其操作方法 |
| TWI736049B (zh) * | 2019-02-06 | 2021-08-11 | 美商惠普發展公司有限責任合夥企業 | 用於流體晶粒之具有位址驅動器的積體電路 |
| JP2020194889A (ja) * | 2019-05-28 | 2020-12-03 | 東京エレクトロン株式会社 | 搬送システム、検査システム及び検査方法 |
| TWI736342B (zh) * | 2019-12-31 | 2021-08-11 | 台灣積體電路製造股份有限公司 | 用於托盤匣倉儲的系統及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023032121A1 (ja) | 2023-03-09 |
| TW202312454A (zh) | 2023-03-16 |
| EP4383082A4 (en) | 2025-04-09 |
| US20240201660A1 (en) | 2024-06-20 |
| DE112021008171T5 (de) | 2024-08-08 |
| JPWO2023032121A1 (https=) | 2023-03-09 |
| EP4383082A1 (en) | 2024-06-12 |
| JP7585507B2 (ja) | 2024-11-18 |
| CN117396855A (zh) | 2024-01-12 |
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