TWI811392B - 柔性光電子裝置 - Google Patents

柔性光電子裝置 Download PDF

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TWI811392B
TWI811392B TW108123448A TW108123448A TWI811392B TW I811392 B TWI811392 B TW I811392B TW 108123448 A TW108123448 A TW 108123448A TW 108123448 A TW108123448 A TW 108123448A TW I811392 B TWI811392 B TW I811392B
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assembly
sheet
driver
lamella
component
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TW202015231A (zh
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威廉 瑞維斯
沙吉爾 西迪基
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英商弗萊克英納寶技術有限公司
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Abstract

一種包括單元的光電子裝置，所述單元包括：接合在一起的多個彈性柔性薄片組件，所述彈性柔性薄片組件包括：(i)第一薄片組件，其包括限定像素電極陣列和電路的至少一個層堆疊，所述電路用於經由所述像素電極陣列外部的定址導體來獨立地定址每個像素電極；以及(ii)第二薄片組件，其接合到所述第一薄片組件的頂表面；其中所述裝置進一步包括一個或多個驅動器晶片，所述一個或多個驅動器晶片在所述第二組件下方的位置處接合到所述第一薄片組件，且用於所述定址導體與所述一個或多個驅動器晶片的端子之間的電接觸；且其中所述單元中在所述一個或多個驅動器晶片的區域中的材料厚度與所述單元中在所述陣列的區域中的材料厚度基本上相同。

Description

柔性光電子裝置
本發明涉及一種柔性光電子裝置。
一些光電子裝置包括在支撐元件上原位形成且限定像素電極陣列和電路的層堆疊，經由所述電路，每個像素電極可經由像素電極陣列外部的定址導體獨立地定址；且一些裝置的一個或多個驅動器晶片的端子直接接合到支撐元件上的定址導體，而非使用軟膜覆晶接合(Chip-On-Flex，COF)技術。在COF技術中，驅動器晶片端子接合到剛度比光電子裝置的支撐元件小的單獨柔性襯底上的佈線導體，且佈線導體接合到光電子裝置的支撐元件上的定址導體。
本申請的發明人已進行關於進一步改善驅動器晶片與定址導體之保持接觸的研究。
特此提供一種包括單元的光電子裝置，所述單元包括：接合在一起的多個彈性柔性薄片組件，所述彈性柔性薄片組件包括：(i)第一薄片組件，其包括限定像素電極陣列和電路的至少一個層堆疊，所述電路用於經由所 述像素電極陣列外部的定址導體來獨立地定址每個像素電極；以及(ii)第二薄片組件，其接合到所述第一薄片組件的頂表面；其中所述裝置進一步包括一個或多個驅動器晶片，所述一個或多個驅動器晶片在所述第二組件下方的位置處接合到所述第一薄片組件，且用於所述定址導體與所述一個或多個驅動器晶片的端子之間的電接觸；且其中所述單元中在所述一個或多個驅動器晶片的區域中的材料厚度與所述單元中在所述陣列的區域中的材料厚度基本上相同。
根據一個實施例，所述一個或多個驅動器晶片除了接合到所述第一薄片組件之外還接合到所述第二薄片組件。
根據一個實施例，所述單元具有穿過所述一個或多個驅動器晶片或緊鄰所述一個或多個驅動器晶片上方或下方的中性軸線。
根據一個實施例，所述驅動器晶片經由填充所述第一薄片組件與所述第二薄片組件之間的所述一個或多個驅動器晶片周圍的空間的材料而接合到所述第二薄片組件。
根據一個實施例，所述第一薄片組件包括支撐至少所述層堆疊的彈性柔性支撐膜。
根據一個實施例，所述第一薄片組件包括接合到所述堆疊的第二彈性柔性支撐膜，以及含於所述第二彈性柔性支撐膜與所述堆疊之間的液晶材料。
根據一個實施例，所述第二薄片組件包括偏振濾波器組件。
根據一個實施例，所述多個彈性柔性薄片組件進一步包括在所述第一組件的與所述第二組件相對的側上的第三薄片組件。
根據一個實施例，所述第三薄片組件包括偏振濾波器組件。
還特此提供了一種生成如上所述的裝置的方法，所述方法包括：將所述一個或多個驅動器晶片施加到所述第一薄片組件；將所述第二薄片組件接合到所述第一組件以上覆所述一個或多個驅動器晶片；以及用材料填充所述第一薄片組件與所述第二薄片組件之間以及所述一個或多個驅動器晶片周圍的空間。
2:支撐元件
4:平面化層
6:堆疊/島
8:圖案化導體層
10:像素電極/柵極導體
12:第二彈性柔性薄片組件
14:黏合材料
16:間隔物
18:驅動器晶片
20:輸出端子/輸入端子
22:柔性襯底材料
24:導體
26:防潮層
28:第三彈性柔性薄片組件/第三薄片組件/偏振器組件
30:防潮層
32:第四彈性柔性薄片組件
34:灌封化合物
35:光學透明黏合劑層
36:第五彈性柔性薄片組件/觸摸感測器組件/觸控式螢幕組件
38:第六彈性柔性薄片組件/窗口組件
40:漫射器組件
下文僅通過舉例的方式參考附圖詳細描述本發明的實施例，其中：圖8示出了根據本發明的實施例的裝置的實例；且圖1至7示出了根據本發明的實施例的用於生產圖8的裝置的技術的實例。
本發明的實施例是針對液晶顯示(LCD)裝置的實例而描述的，但所述技術也適用於其它類型的顯示裝置，例如發光二極體(LED)裝置，和其它類型的光電子裝置，例如感測器裝置。
術語“源極導體”用於表示晶片端子與半導體通道之間的電串聯導體，術語“漏極導體”用於表示經由半導體通道與晶片端子電串聯的導體。
原位形成圖案化層包含原位形成連續層與原位圖案化所述連續層的組合。
另外，圖8的實例裝置包括提供觸摸感測器功能性的組件和漫射器組件，但所述技術也適用於無這些組件和/或包含額外組件的LCD裝置。
如下文更詳細描述的，圖8的裝置單元包括接合在一起以形成整體結構的一組彈性柔性薄片組件。整體結構的撓曲，涉及了結構中的所有薄片組件之共同撓曲，而在任何兩個薄片組件之間，基本上無任何當結構隨後鬆弛時不會自動移回的橫向滑動。一個或多個驅動器晶片18位於裝置單元的兩個薄片組件之間，且在這兩個薄片組件之間的一個或多個驅動器晶片18周圍的空間填充有材料，使得裝置單元中在一個或多個驅動器晶片的區域中的材料厚度與裝置單元的有源區域(例如，在顯示裝置的情況下，像素電極陣列的區域)中的材料厚度基本上相同(即，在裝置單元的有源區域與裝置單元的驅動器晶片區域之間無大的厚度變化)。這為裝置單元之跨越驅動器晶片區域和有源區域的彎曲剛度特性提供了更好均勻性。此外，裝置單元被設計成使得裝置單元的中性軸線(用於使單元遠離平面配置來撓曲)穿過一個或多個驅動器晶片18或緊鄰一個或多個驅動器晶片18的上方或下方，以便對於裝置 單元的給定撓曲程度而言，基本上最小化施加在一個或多個驅動器晶片上的力(且由此基本上將一個或多個驅動器晶片例如施加在一個或多個驅動器晶片18的端子與定址導體之間的導電接合部上的作用力予以最小化)。
參考圖1，第一彈性柔性薄片組件包括支撐元件2，所述支撐元件包括至少一個彈性柔性支撐膜(例如有機聚合物膜，例如三醋酸纖維素(TAC)膜)，其塗布有平面化層(例如，SU-8層)。支撐元件可包含在支撐膜與平面化層4之間的其它層，例如提供光學和/或電學功能的一個或多個層，例如用於屏蔽半導體通道(下文提及)使其免受來自支撐膜方向的光的圖案化導體層。
在平面化層4上原位形成導體、半導體和絕緣體/介電層，以產生至少限定以下各者的堆疊6：像素電極10的陣列，以及電路，經由所述電路，每個像素電極可經由像素電極陣列外部的導體獨立地定址。像素電極10在附圖中示出在堆疊6的頂部，但對於某些類型的顯示裝置(例如邊緣場切換(Fringe Field Switching，FFS)LCD裝置，其中圖案化共同導體(COM)經由電介質上覆像素電極)，像素電極陣列可在堆疊6的頂部下方。
在堆疊的第一導體層級處，堆疊6包含了在平面化層4上原位形成的圖案化導體層8(其可包括或可不包括子層堆疊)，以至少限定：(i)源極導體陣列，每個源極導體與相應的一列電晶體相關聯且延伸超出像素電極陣列的邊緣，用於連接到驅動器晶片的相應端子(下文更詳細 地論述)，以及(ii)漏極導體陣列，每個漏極導體與相應的電晶體相關聯。每個源極導體包含了用於連接到驅動器晶片之相應端子的延伸超出陣列邊緣的定址線，以及用於每個電晶體的一個或多個源極導體指狀物，所述源極導體指狀物從定址線分支出來。源極導體指狀物是源極導體中最靠近漏極導體的部分。漏極導體包含一個或多個漏極導體指狀物，其平行於源極導體指狀物來延伸(例如，與源極導體指狀物叉合)，且是漏極導體中最靠近源極導體的部分。每個漏極導體還包含漏極焊盤。
如附圖中示意性所示，第一導體層級處的圖案化導體層8延伸超出堆疊6的其餘部分的橫向邊緣，其中源極導體終止於相應接觸焊盤中以接觸一個或多個驅動器晶片18的相應端子。在第一導體層級處的此圖案化導體層8還限定了柵極定址導體陣列，每個柵極定址導體經由堆疊6內的導電層級之間的導電連接來連接到在堆疊6的另一導體層級(下文論述)處的導體圖案的相應柵極導體，且每個柵極定址導體終止於相應接觸焊盤中，用於接觸一個或多個驅動器晶片18的相應端子。
在第一導體層級處，堆疊6包含了在圖案化導體層8上原位形成的(例如，有機聚合物)半導體通道材料的圖案化層(其可包括或可不包括子層的堆疊)。在形成圖案化半導體層之前，可在源極-漏極導體圖案的表面上形成一個或多個層，這改善了源極-漏極導體圖案與半導體通道材料(例如，合適有機材料的自組裝單層)之間的電荷轉 移。圖案化半導體通道材料層限定了半導體通道材料的隔離島6的陣列，每個島6為陣列的相應電晶體提供半導體通道。
堆疊6還包含了在圖案化半導體通道材料層上原位形成的(例如，有機聚合物)柵極介電層(其可包括或可不包括子層的堆疊)；以及第二圖案化導體層(其可包括或不包括子層堆疊)，其至少限定了柵極導體10的陣列。每個柵極導體與相應的一行電晶體相關聯，且經由穿過柵極電介質的相應層間連接來連接到在第一導體層級處的相應柵極定址導體。每個電晶體與柵極與源極導體的獨特組合相關聯，由此每個像素可獨立於所有其它像素而定址。
堆疊6進一步包含了在第二圖案化導體層上原位形成的絕緣體/介電層(其可包括或可不包括子層的堆疊)。在此階段，堆疊被圖案化以限定通孔，每個通孔向下延伸到第一導體層級處的相應漏極導體(上述漏極焊盤)。接著在絕緣體/介電層上原位形成另一圖案化導體層(其可包括或可不包括子層的堆疊)。此圖案化導體層提供像素電極10的陣列，每個像素電極與第一導體層級處的相應漏極導體接觸。
堆疊6可包含額外層，例如用於FFS-LCD裝置的圖案化共同(COM)導體層。
參考圖2，圖1的第一薄片組件接合到第二彈性柔性薄片組件12，且兩個薄片組件之間含有一定厚度的液晶材料。第二彈性柔性薄片組件12包括彈性柔性支撐膜 (例如有機聚合物膜，例如三醋酸纖維素(TAC)膜)，其具有在支撐膜上原位形成的對準層(例如，摩擦的聚醯亞胺層)。在將第一薄片組件與第二薄片組件接合在一起之前，還在第一薄片組件的堆疊6的最上表面上原位形成相同種類的對準層(未示出)。利用像素電極陣列(有源顯示區域)外部的黏合材料14來實現兩個組件的接合，所述黏合材料還起到橫向含有液晶材料的作用。提供間隔物16以更好地確保在所有像素電極上的液晶材料的均勻厚度。
參考圖3，一個或多個(例如矽)驅動器晶片18(其與裝置單元的每個薄片組件相比具有相對高的彎曲剛度)接合到第一組件，用於(i)一個或多個驅動器晶片中的輸出端子20，與在堆疊6的第一導體層級處由圖案化導體層8限定的定址導體(在此實例中為源極和柵極)，兩者之間的電接觸；(ii)一個或多個驅動器晶片18的輸入端子20，與也在堆疊的第一導體層級處由圖案化導體層8限定的另一輸入導體，兩者之間的電接觸，其中所述輸入導體與接合到第一薄片組件的邊緣部分的柔性襯底材料22(柔性連接器)上的相應導體24接觸。在此實例中，一個或多個驅動器晶片包括一組細長的源極和柵極驅動器晶片，它們全部在相同方向(平行於像素電極陣列的一個邊緣)上定向且沿像素電極陣列的一個邊緣定位。根據一個變型，柵極驅動電路替代地由在支撐元件2上原位形成、且位在像素電極陣列的一個邊緣外側的一個位置處的堆疊層(例如前述的相同堆疊6，其限定了像素電極10的陣列，以及藉 以經由像素電極10的陣列外部的導體來對每個像素電極獨立地定址的電路)來限定，而所述邊緣垂直於像素電極陣列中的有一個或多個驅動器晶片18設在其外側的邊緣；且一個或多個驅動器晶片18包括一個或多個源極驅動器晶片，而無任何柵極驅動器晶片。
參考圖4，防潮層(囊封層)26接合到圖3的單元的第二薄片組件的上表面。舉例來說，可通過使用預形成的光學透明黏合劑(Optically Clear Adhesive，OCA)層(未示出)的幹式接合層壓技術實現接合。接著將包括偏振器組件的第三彈性柔性薄片組件28接合到防潮層26。舉例來說，此接合也可通過使用光學透明黏合劑層的幹式接合層壓技術實現，所述黏合劑層形成偏振器組件的整體部分(且由釋放層暫時保護)。偏振器組件28在堆疊6的整個區域上連續延伸且超出堆疊的橫向邊緣，且還在一個或多個驅動器晶片18上延伸。
變型的實例包含：(i)將第三薄片組件(偏振器組件)28接合到圖3的單元的第二薄片組件的上表面，且接著將防潮層接合到第三薄片組件28的上表面；以及(ii)預先製備出並有偏振器和防潮功能的第三薄片組件，並將多功能第三薄片組件接合到圖3的單元的第二薄片組件的上表面。
參考圖5，將另一防潮層(囊封層)30接合到圖4的單元的第一薄片組件的下表面。此接合也可通過例如使用預先形成的OCA層(未示出)的幹式接合層壓技術 實現。接著將包括偏振器組件的第四彈性柔性薄片組件32接合到防潮層30。舉例來說，此接合也可通過使用預先形成的光學透明黏合劑層的幹式接合層壓技術來實現，所述黏合劑層形成偏振器組件32的整體部分(且由釋放層暫時保護)。下部偏振器組件32基本上在第一薄片組件的整個區域上連續延伸。
再次，變型的實例包含：(i)將第四薄片組件(偏振器組件)32接合到圖4的單元的第一薄片組件的下表面，且接著將防潮層接合到第四薄片組件32的下表面；以及(ii)預先製備出並有偏振器和防潮功能的第四薄片組件，且將多功能第四薄片組件接合到圖4的單元的第一薄片組件的下表面。
參考圖6，灌封化合物(例如液態樹脂)34基本上施配在第一薄片組件中的未被上部偏振器組件28覆蓋的區域的整個部分上，且也至少施配在下部偏振器薄片組件32中的橫向延伸超出第一薄片組件的部分上。在毛細管作用下，灌封化合物34填充第一薄片組件與上部偏振器組件28之間的空間，包含一個或多個驅動器晶片18周圍(上方和側面)的空間。此灌封化合物34提供一個或多個驅動器晶片18與上部偏振器組件28之間的直接牢固接合。第二薄片組件在一個或多個驅動器晶片18上的延伸，以及灌封化合物在一個或多個驅動器晶片18周圍空間的填充，提供了在一個或多個驅動器晶片的區域和有源區域兩者中具有基本上相同厚度的材料的所得單元，且為裝置單元提供 在驅動器晶片區域和有源區域上的彎曲剛度特性的更好均勻性。灌封化合物還可為堆疊6或液晶材料或堆疊6和液晶材料兩者提供防止水分進入的保護。
參考圖7，將提供觸摸感測器功能性的預先製備的第五彈性柔性薄片組件36，接合到上部偏振器組件的上表面。舉例來說，此接合也可通過使用預先形成的光學透明黏合劑層(OCA)35的幹式接合層壓技術來實現，所述黏合劑層可形成預先製備的觸摸感測器組件36的一部分，具有釋放層保護。另一柔性連接器(未示出)從觸摸感測器組件36延伸，以提供到外部處理器的電連接。第六彈性柔性薄片組件38(提供透明保護窗口)接合到觸控式螢幕組件36的上表面，且第七彈性柔性薄片組件(包括光學漫射器)接合到下部偏振器組件32的下表面。對於這些接合操作中的每一個，接合可例如通過使用預先形成的光學透明黏合劑(OCA)層(未示出)的幹式接合層壓技術來實現。
窗口組件38的上表面(用戶觀看表面)可例如設置有非透射框架(未示出)，其覆蓋了裝置單元中的除有源(像素電極陣列)區域之外的整個區域，所述框架基本上在整個可見光譜上都不可透射。可通過將框架圖案噴塗到窗口組件38的上表面上，或將限定出框架圖案的預先製備的塑膠薄片接合到窗口組件38的上表面，來產生此框架。
接著在除了有柔性連接器22突出的一側之外的所有(三個)側上，修整圖7中所示的所得整體單元，以 在這三個側上形成齊平邊緣。
根據一個變型，窗口組件38和漫射器組件40被省略，以便於產生具有較小撓曲剛度的整體單元。在此變型中，加強件可選擇性地在一個或多個驅動器晶片的區域中接合到下部偏振器組件32的下表面。加強件可例如是一片纖維加強樹脂層壓材料，例如FR4級玻璃纖維加強環氧層壓材料，其用環氧樹脂黏合劑由編織玻璃纖維布構成。可使用雙面幹式黏合劑實現加強件到下部偏振器組件的下表面的接合。
薄片組件彼此接合的次序可與上述實例的次序不同。舉例來說，次序可遵循上述實例，只是觸摸感測器組件36先接合到窗口組件38，隨後此接合組合被接合到包括上部偏振器組件、堆疊、液晶材料等的中間單元的上表面。
除了上文明確提到的任何修改之外，對於本領域技術人員來說明顯的是，可在本發明的範圍內對所描述的實施例進行各種其它修改。
申請方在此單獨公開本文所描述的每一個體特徵及兩個或多於兩個此類特徵的任意組合。以所屬領域的技術人員的普通知識，能夠整體基於本說明書將此類特徵或組合予以實現，而不考慮此類特徵或特徵的組合是否能解決本文所公開的任何問題；且此類特徵或組合不對申請專利的範圍進行限制。申請方指示本發明的各方面可由任何此類個別特徵或特徵的組合構成。
2:支撐元件
4:平面化層
6:堆疊/島
8:圖案化導體層
10:像素電極/柵極導體
12:第二彈性柔性薄片組件
14:黏合材料
16:間隔物
18:驅動器晶片
20:輸出端子/輸入端子
22:柔性襯底材料
24:導體
26:防潮層
28:第三彈性柔性薄片組件/第三薄片組件/偏振器組件
30:防潮層
32:第四彈性柔性薄片組件
34:灌封化合物
35:光學透明黏合劑層
36:第五彈性柔性薄片組件/觸摸感測器組件/觸控式螢幕組件
38:第六彈性柔性薄片組件/窗口組件
40:漫射器組件

Claims (10)

  1. 一種包括單元的光電子裝置，所述單元包括：接合在一起的多個彈性柔性薄片組件，所述彈性柔性薄片組件包括：(i)第一薄片組件，其包括限定像素電極陣列和電路的至少一個層堆疊，所述電路用於經由所述像素電極陣列外部的定址導體來獨立地定址每個像素電極；以及(ii)第二薄片組件，其接合到所述第一薄片組件的頂表面；其中，所述裝置進一步包括一個或多個驅動器晶片，所述一個或多個驅動器晶片在所述第二薄片組件下方的位置處接合到所述第一薄片組件，且用於所述定址導體與所述一個或多個驅動器晶片的端子之間的電接觸；且其中，所述單元中在所述一個或多個驅動器晶片的區域中的材料厚度與所述單元中在所述陣列的區域中的材料厚度基本上相同。
  2. 如請求項1所述的裝置，其中，所述一個或多個驅動器晶片除了接合到所述第一薄片組件之外還接合到所述第二薄片組件。
  3. 如請求項1或2所述的裝置，其中，所述單元具有穿過所述一個或多個驅動器晶片或緊鄰所述一個或多個驅動器晶片上方或下方的中性軸線。
  4. 如請求項1或2所述的裝置，其中，所述驅動器晶片經由填充所述第一薄片組件與所述第二薄片組件之間的所述一個或多個驅動器晶片周圍的空間的材料而接合到所述第二薄片組件。
  5. 如請求項1或2所述的裝置，其中，所述第一薄片組件包括支撐至少所述層堆疊的彈性柔性支撐膜。
  6. 如請求項1或2所述的裝置，其中，所述第一薄片組件包括接合到所述堆疊的第二彈性柔性支撐膜，以及含於所述第二彈性柔性支撐膜與所述堆疊之間的液晶材料。
  7. 如請求項1或2所述的裝置，其中，所述第二薄片組件包括偏振濾波器組件。
  8. 如請求項1或2所述的裝置，其中，所述多個彈性柔性薄片組件進一步包括在所述第一薄片組件的與所述第二薄片組件相對的側上的第三薄片組件。
  9. 如請求項8所述的裝置，其中，所述第三薄片組件包括偏振濾波器組件。
  10. 一種生產如請求項1或2所述的裝置的方法，所述方法包括：將所述一個或多個驅動器晶片施加到所述第一薄片組件；將所述第二薄片組件接合到所述第一薄片組件以上覆所述一個或多個驅動器晶片；以及用材料填充所述第一薄片組件與所述第二薄片組件之間以及所述一個或多個驅動器晶片周圍的空間。
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