CN110687708B - 柔性光电子装置 - Google Patents

柔性光电子装置 Download PDF

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CN110687708B
CN110687708B CN201910593869.4A CN201910593869A CN110687708B CN 110687708 B CN110687708 B CN 110687708B CN 201910593869 A CN201910593869 A CN 201910593869A CN 110687708 B CN110687708 B CN 110687708B
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sheet assembly
sheet
driver chips
assembly
bonded
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CN110687708A (zh
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威廉·瑞维斯
沙吉尔·西迪基
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Fleck Innabur Technology Co ltd
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Abstract

一种包括单元的光电子装置，所述单元包括：接合在一起的多个弹性柔性薄片组件，所述弹性柔性薄片组件包括：(i)第一薄片组件，其包括限定像素电极阵列和电路的至少一个层堆叠，所述电路用于经由所述像素电极阵列外部的寻址导体来独立地寻址每个像素电极；以及(ii)第二薄片组件，其接合到所述第一薄片组件的顶表面；其中所述装置进一步包括一个或多个驱动器芯片，所述一个或多个驱动器芯片在所述第二组件下方的位置处接合到所述第一薄片组件，且用于所述寻址导体与所述一个或多个驱动器芯片的端子之间的电接触；且其中所述单元中在所述一个或多个驱动器芯片的区域中的材料厚度与所述单元中在所述阵列的区域中的材料厚度基本上相同。

Description

柔性光电子装置
技术领域
本发明涉及一种柔性光电子装置。
背景技术
一些光电子装置包括在支撑元件上原位形成且限定像素电极阵列和电路的层堆叠，经由所述电路，每个像素电极可经由像素电极阵列外部的寻址导体独立地寻址；且一些装置的一个或多个驱动器芯片的端子直接接合到支撑元件上的寻址导体，而非使用软膜覆晶接合(COF)技术。在COF技术中，驱动器芯片端子接合到刚度比光电子装置的支撑元件小的单独柔性衬底上的布线导体，且布线导体接合到光电子装置的支撑元件上的寻址导体。
发明内容
本申请的发明人已进行关于进一步改善驱动器芯片与寻址导体之保持接触的研究。
特此提供一种包括单元的光电子装置，所述单元包括：接合在一起的多个弹性柔性薄片组件，所述弹性柔性薄片组件包括：(i)第一薄片组件，其包括限定像素电极阵列和电路的至少一个层堆叠，所述电路用于经由所述像素电极阵列外部的寻址导体来独立地寻址每个像素电极；以及(ii)第二薄片组件，其接合到所述第一薄片组件的顶表面；其中所述装置进一步包括一个或多个驱动器芯片，所述一个或多个驱动器芯片在所述第二组件下方的位置处接合到所述第一薄片组件，且用于所述寻址导体与所述一个或多个驱动器芯片的端子之间的电接触；且其中所述单元中在所述一个或多个驱动器芯片的区域中的材料厚度与所述单元中在所述阵列的区域中的材料厚度基本上相同。
根据一个实施例，所述一个或多个驱动器芯片除了接合到所述第一薄片组件之外还接合到所述第二薄片组件。
根据一个实施例，所述单元具有穿过所述一个或多个驱动器芯片或紧邻所述一个或多个驱动器芯片上方或下方的中性轴线。
根据一个实施例，所述驱动器芯片经由填充所述第一薄片组件与所述第二薄片组件之间的所述一个或多个驱动器芯片周围的空间的材料而接合到所述第二薄片组件。
根据一个实施例，所述第一薄片组件包括支撑至少所述层堆叠的弹性柔性支撑膜。
根据一个实施例，所述第一薄片组件包括接合到所述堆叠的第二弹性柔性支撑膜，以及含于所述第二弹性柔性支撑膜与所述堆叠之间的液晶材料。
根据一个实施例，所述第二薄片组件包括偏振滤波器组件。
根据一个实施例，所述多个弹性柔性薄片组件进一步包括在所述第一组件的与所述第二组件相对的侧上的第三薄片组件。
根据一个实施例，所述第三薄片组件包括偏振滤波器组件。
还特此提供了一种生成如上所述的装置的方法，所述方法包括：将所述一个或多个驱动器芯片施加到所述第一薄片组件；将所述第二薄片组件接合到所述第一组件以上覆所述一个或多个驱动器芯片；以及用材料填充所述第一薄片组件与所述第二薄片组件之间以及所述一个或多个驱动器芯片周围的空间。
附图说明
下文仅通过举例的方式参考附图详细描述本发明的实施例，其中：
图8示出了根据本发明的实施例的装置的实例；且图1至7示出了根据本发明的实施例的用于制造图8的装置的技术的实例。
具体实施方式
本发明的实施例是针对液晶显示(LCD)装置的实例而描述的，但所述技术也适用于其它类型的显示装置，例如发光二极管(LED)装置，和其它类型的光电子装置，例如传感器装置。
术语“源极导体”用于表示芯片端子与半导体通道之间的电串联导体，术语“漏极导体”用于表示经由半导体通道与芯片端子电串联的导体。
原位形成图案化层包含原位形成连续层与原位图案化所述连续层的组合。
另外，图8的实例装置包括提供触摸传感器功能性的组件和漫射器组件，但所述技术也适用于无这些组件和/或包含额外组件的LCD装置。
如下文更详细描述的，图8的装置单元包括接合在一起以形成整体结构的一组弹性柔性薄片组件。整体结构的挠曲，涉及了结构中的所有薄片组件之共同挠曲，而在任何两个薄片组件之间，基本上无任何当结构随后松弛时不会自动移回的横向滑动。一个或多个驱动器芯片18位于装置单元的两个薄片组件之间，且在这两个薄片组件之间的一个或多个驱动器芯片18周围的空间填充有材料，使得装置单元中在一个或多个驱动器芯片的区域中的材料厚度与装置单元的有源区域(例如，在显示装置的情况下，像素电极阵列的区域)中的材料厚度基本上相同(即，在装置单元的有源区域与装置单元的驱动器芯片区域之间无大的厚度变化)。这为装置单元之跨越驱动器芯片区域和有源区域的弯曲刚度特性提供了更好均匀性。此外，装置单元被设计成使得装置单元的中性轴线(用于使单元远离平面配置来挠曲)穿过一个或多个驱动器芯片18或紧邻一个或多个驱动器芯片18的上方或下方，以便对于装置单元的给定挠曲程度而言，基本上最小化施加在一个或多个驱动器芯片上的力(且由此基本上将一个或多个驱动器芯片例如施加在一个或多个驱动器芯片18的端子与寻址导体之间的导电接合部上的作用力予以最小化)。
参考图1，第一弹性柔性薄片组件包括支撑元件2，所述支撑元件包括至少一个弹性柔性支撑膜(例如有机聚合物膜，例如三醋酸纤维素(TAC)膜)，其涂布有平面化层(例如，SU-8层)。支撑元件可包含在支撑膜与平面化层4之间的其它层，例如提供光学和/或电学功能的一个或多个层，例如用于屏蔽半导体通道(下文提及)使其免受来自支撑膜方向的光的图案化导体层。
在平面化层4上原位形成导体、半导体和绝缘体/介电层，以产生至少限定以下各者的堆叠6：像素电极10的阵列，以及电路，经由所述电路，每个像素电极可经由像素电极阵列外部的导体独立地寻址。像素电极10在附图中示出在堆叠6的顶部，但对于某些类型的显示装置(例如边缘场切换(FFS)LCD装置，其中图案化共同导体(COM)经由电介质上覆像素电极)，像素电极阵列可在堆叠6的顶部下方。
在堆叠的第一导体层级处，堆叠6包含了在平面化层4上原位形成的图案化导体层8(其可包括或可不包括子层堆叠)，以至少限定：(i)源极导体阵列，每个源极导体与相应的一列晶体管相关联且延伸超出像素电极阵列的边缘，用于连接到驱动器芯片的相应端子(下文更详细地论述)，以及(ii)漏极导体阵列，每个漏极导体与相应的晶体管相关联。每个源极导体包含了用于连接到驱动器芯片之相应端子的延伸超出阵列边缘的寻址线，以及用于每个晶体管的一个或多个源极导体指状物，所述源极导体指状物从寻址线分支出来。源极导体指状物是源极导体中最靠近漏极导体的部分。漏极导体包含一个或多个漏极导体指状物，其平行于源极导体指状物来延伸(例如，与源极导体指状物叉合)，且是漏极导体中最靠近源极导体的部分。每个漏极导体还包含漏极焊盘。
如附图中示意性所示，第一导体层级处的图案化导体层8延伸超出堆叠6的其余部分的横向边缘，其中源极导体终止于相应接触焊盘中以接触一个或多个驱动器芯片18的相应端子。在第一导体层级处的此图案化导体层8还限定了栅极寻址导体阵列，每个栅极寻址导体经由堆叠6内的导电层级之间的导电连接来连接到在堆叠6的另一导体层级(下文论述)处的导体图案的相应栅极导体，且每个栅极寻址导体终止于相应接触焊盘中，用于接触一个或多个驱动器芯片18的相应端子。
在第一导体层级处，堆叠6包含了在图案化导体层8上原位形成的(例如，有机聚合物)半导体通道材料的图案化层(其可包括或可不包括子层的堆叠)。在形成图案化半导体层之前，可在源极-漏极导体图案的表面上形成一个或多个层，这改善了源极-漏极导体图案与半导体通道材料(例如，合适有机材料的自组装单层)之间的电荷转移。图案化半导体通道材料层限定了半导体通道材料的隔离岛6的阵列，每个岛6为阵列的相应晶体管提供半导体通道。
堆叠6还包含了在图案化半导体通道材料层上原位形成的(例如，有机聚合物)栅极介电层(其可包括或可不包括子层的堆叠)；以及第二图案化导体层(其可包括或不包括子层堆叠)，其至少限定了栅极导体10的阵列。每个栅极导体与相应的一行晶体管相关联，且经由穿过栅极电介质的相应层间连接来连接到在第一导体层级处的相应栅极寻址导体。每个晶体管与栅极与源极导体的独特组合相关联，由此每个像素可独立于所有其它像素而寻址。
堆叠6进一步包含了在第二图案化导体层上原位形成的绝缘体/介电层(其可包括或可不包括子层的堆叠)。在此阶段，堆叠被图案化以限定通孔，每个通孔向下延伸到第一导体层级处的相应漏极导体(上述漏极焊盘)。接着在绝缘体/介电层上原位形成另一图案化导体层(其可包括或可不包括子层的堆叠)。此图案化导体层提供像素电极10的阵列，每个像素电极与第一导体层级处的相应漏极导体接触。
堆叠6可包含额外层，例如用于FFS-LCD装置的图案化共同(COM)导体层。
参考图2，图1的第一薄片组件接合到第二弹性柔性薄片组件12，且两个薄片组件之间含有一定厚度的液晶材料。第二弹性柔性薄片组件12包括弹性柔性支撑膜(例如有机聚合物膜，例如三醋酸纤维素(TAC)膜)，其具有在支撑膜上原位形成的对准层(例如，摩擦的聚酰亚胺层)。在将第一薄片组件与第二薄片组件接合在一起之前，还在第一薄片组件的堆叠6的最上表面上原位形成相同种类的对准层(未示出)。利用像素电极阵列(有源显示区域)外部的粘合材料14来实现两个组件的接合，所述粘合材料还起到横向含有液晶材料的作用。提供间隔物16以更好地确保在所有像素电极上的液晶材料的均匀厚度。
参考图3，一个或多个(例如硅)驱动器芯片18(其与装置单元的每个薄片组件相比具有相对高的弯曲刚度)接合到第一组件，用于(i)一个或多个驱动器芯片中的输出端子20，与在堆叠6的第一导体层级处由图案化导体层8限定的寻址导体(在此实例中为源极和栅极)，两者之间的电接触；(ii)一个或多个驱动器芯片18的输入端子20，与也在堆叠的第一导体层级处由图案化导体层8限定的另一输入导体，两者之间的电接触，其中所述输入导体与接合到第一薄片组件的边缘部分的柔性衬底材料22(柔性连接器)上的相应导体24接触。在此实例中，一个或多个驱动器芯片包括一组细长的源极和栅极驱动器芯片，它们全部在相同方向(平行于像素电极阵列的一个边缘)上定向且沿像素电极阵列的一个边缘定位。根据一个变型，栅极驱动电路替代地由在支撑元件2上原位形成、且位在像素电极阵列的一个边缘外侧的一个位置处的堆叠层(例如前述的相同堆叠6，其限定了像素电极10的阵列，以及借以经由像素电极10的阵列外部的导体来对每个像素电极独立地寻址的电路)来限定，而所述边缘垂直于像素电极阵列中的有一个或多个驱动器芯片18设在其外侧的边缘；且一个或多个驱动器芯片18包括一个或多个源极驱动器芯片，而无任何栅极驱动器芯片。
参考图4，防潮层(囊封层)26接合到图3的单元的第二薄片组件的上表面。举例来说，可通过使用预形成的光学透明粘合剂(OCA)层(未示出)的干式接合层压技术实现接合。接着将包括偏振器组件的第三弹性柔性薄片组件28接合到防潮层26。举例来说，此接合也可通过使用光学透明粘合剂层的干式接合层压技术实现，所述粘合剂层形成偏振器组件的整体部分(且由释放层暂时保护)。偏振器组件28在堆叠6的整个区域上连续延伸且超出堆叠的横向边缘，且还在一个或多个驱动器芯片18上延伸。
变型的实例包含：(i)将第三薄片组件(偏振器组件)28接合到图3的单元的第二薄片组件的上表面，且接着将防潮层接合到第三薄片组件28的上表面；以及(ii)预先制备出并有偏振器和防潮功能的第三薄片组件，并将多功能第三薄片组件接合到图3的单元的第二薄片组件的上表面。
参考图5，将另一防潮层(囊封层)30接合到图4的单元的第一薄片组件的下表面。此接合也可通过例如使用预先形成的OCA层(未示出)的干式接合层压技术实现。接着将包括偏振器组件的第四弹性柔性薄片组件32接合到防潮层30。举例来说，此接合也可通过使用预先形成的光学透明粘合剂层的干式接合层压技术来实现，所述粘合剂层形成偏振器组件32的整体部分(且由释放层暂时保护)。下部偏振器组件32基本上在第一薄片组件的整个区域上连续延伸。
再次，变型的实例包含：(i)将第四薄片组件(偏振器组件)32接合到图4的单元的第一薄片组件的下表面，且接着将防潮层接合到第四薄片组件32的下表面；以及(ii)预先制备出并有偏振器和防潮功能的第四薄片组件，且将多功能第四薄片组件接合到图4的单元的第一薄片组件的下表面。
参考图6，灌封化合物(例如液态树脂)34基本上施配在第一薄片组件中的未被上部偏振器组件26覆盖的区域的整个部分上，且也至少施配在下部偏振器薄片组件32中的横向延伸超出第一薄片组件的部分上。在毛细管作用下，灌封化合物34填充第一薄片组件与上部偏振器组件26之间的空间，包含一个或多个驱动器芯片18周围(上方和侧面)的空间。此灌封化合物34提供一个或多个驱动器芯片18与上部偏振器组件26之间的直接牢固接合。第二薄片组件在一个或多个驱动器芯片18上的延伸，以及灌封化合物在一个或多个驱动器芯片18周围空间的填充，提供了在一个或多个驱动器芯片的区域和有源区域两者中具有基本上相同厚度的材料的所得单元，且为装置单元提供在驱动器芯片区域和有源区域上的弯曲刚度特性的更好均匀性。灌封化合物还可为堆叠6和/或液晶材料提供防止水分进入的保护。
参考图7，将提供触摸传感器功能性的预先制备的第五弹性柔性薄片组件36，接合到上部偏振器组件的上表面。举例来说，此接合也可通过使用预先形成的光学透明粘合剂层(OCA)35的干式接合层压技术来实现，所述粘合剂层可形成预先制备的触摸传感器组件36的一部分，具有释放层保护。另一柔性连接器(未示出)从触摸传感器组件36延伸，以提供到外部处理器的电连接。第六弹性柔性薄片组件38(提供透明保护窗口)接合到触摸屏组件36的上表面，且第七弹性柔性薄片组件(包括光学漫射器)接合到下部偏振器组件32的下表面。对于这些接合操作中的每一个，接合可例如通过使用预先形成的光学透明粘合剂(OCA)层(未示出)的干式接合层压技术来实现。
窗口组件38的上表面(用户观看表面)可例如设置有非透射框架(未示出)，其覆盖了装置单元中的除有源(像素电极阵列)区域之外的整个区域，所述框架基本上在整个可见光谱上都不可透射。可通过将框架图案喷涂到窗口组件38的上表面上，或将限定出框架图案的预先制备的塑料薄片接合到窗口组件38的上表面，来产生此框架。
接着在除了有柔性连接器22突出的一侧之外的所有(三个)侧上，修整图7中所示的所得整体单元，以在这三个侧上形成齐平边缘。
根据一个变型，窗口组件38和漫射器组件40被省略，以便于产生具有较小挠曲刚度的整体单元。在此变型中，加强件可选择性地在一个或多个驱动器芯片的区域中接合到下部偏振器组件32的下表面。加强件可例如是一片纤维加强树脂层压材料，例如FR4级玻璃纤维加强环氧层压材料，其用环氧树脂粘合剂由编织玻璃纤维布构成。可使用双面干式粘合剂实现加强件到下部偏振器组件的下表面的接合。
薄片组件彼此接合的次序可与上述实例的次序不同。举例来说，次序可遵循上述实例，只是触摸传感器组件36先接合到窗口组件38，随后此接合组合被接合到包括上部偏振器组件、堆叠、液晶材料等的中间单元的上表面。
除了上文明确提到的任何修改之外，对于本领域技术人员来说明显的是，可在本发明的范围内对所描述的实施例进行各种其它修改。
申请方在此单独公开本文所描述的每一个体特征及两个或多于两个此类特征的任意组合，以所属领域的技术人员的普通知识，能够整体基于本说明书将此类特征或组合予以实现，而不考虑此类特征或特征的组合是否能解决本文所公开的任何问题；且此类特征或组合不对权利要求书的范围进行限制。申请方指示本发明的各方面可由任何此类个别特征或特征的组合构成。

Claims (10)

1.一种包括单元的光电子装置，其特征在于：所述单元包括：接合在一起的多个弹性柔性薄片组件，所述弹性柔性薄片组件包括：(i)第一薄片组件，其包括限定像素电极阵列和电路的至少一个层堆叠，所述电路用于经由所述像素电极阵列外部的寻址导体来独立地寻址每个像素电极；以及(ii)第二薄片组件，其接合到所述第一薄片组件的顶表面；其中所述装置进一步包括一个或多个驱动器芯片，所述一个或多个驱动器芯片在所述第二薄片组件下方的位置处接合到所述第一薄片组件，且用于所述寻址导体与所述一个或多个驱动器芯片的端子之间的电接触；且其中所述单元中在所述一个或多个驱动器芯片的区域中的材料厚度与所述单元中在所述阵列的区域中的材料厚度基本上相同。
2.根据权利要求1所述的装置，其特征在于：所述一个或多个驱动器芯片除了接合到所述第一薄片组件之外还接合到所述第二薄片组件。
3.根据权利要求1或权利要求2所述的装置，其特征在于：所述单元具有穿过所述一个或多个驱动器芯片或紧邻所述一个或多个驱动器芯片上方或下方的中性轴线。
4.根据权利要求1至3中任一权利要求所述的装置，其特征在于：所述驱动器芯片经由填充所述第一薄片组件与所述第二薄片组件之间的所述一个或多个驱动器芯片周围的空间的材料而接合到所述第二薄片组件。
5.根据权利要求1至4中任一权利要求所述的装置，其特征在于：所述第一薄片组件包括支撑至少所述层堆叠的弹性柔性支撑膜。
6.根据权利要求1至5中任一权利要求所述的装置，其特征在于：所述第一薄片组件包括接合到所述堆叠的第二弹性柔性支撑膜，以及含于所述第二弹性柔性支撑膜与所述堆叠之间的液晶材料。
7.根据权利要求1至6中任一权利要求所述的装置，其特征在于：所述第二薄片组件包括偏振滤波器组件。
8.根据权利要求1至7中任一权利要求所述的装置，其特征在于：所述多个弹性柔性薄片组件进一步包括在所述第一薄片组件的与所述第二薄片组件相对的侧上的第三薄片组件。
9.根据权利要求8所述的装置，其特征在于：所述第三薄片组件包括偏振滤波器组件。
10.一种制造根据权利要求1至9之任一权利要求所述的装置的方法，其特征在于：所述方法包括：将所述一个或多个驱动器芯片施加到所述第一薄片组件；将所述第二薄片组件接合到所述第一薄片组件以覆盖所述一个或多个驱动器芯片；以及用材料填充所述第一薄片组件与所述第二薄片组件之间以及所述一个或多个驱动器芯片周围的空间。
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