TWI809906B - 正型感光性樹脂組成物及有機ｅｌ元件隔壁 - Google Patents

正型感光性樹脂組成物及有機ｅｌ元件隔壁 Download PDF

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Publication number
TWI809906B
TWI809906B TW111120204A TW111120204A TWI809906B TW I809906 B TWI809906 B TW I809906B TW 111120204 A TW111120204 A TW 111120204A TW 111120204 A TW111120204 A TW 111120204A TW I809906 B TWI809906 B TW I809906B
Authority
TW
Taiwan
Prior art keywords
group
acid
resin composition
photosensitive resin
mass
Prior art date
Application number
TW111120204A
Other languages
English (en)
Chinese (zh)
Other versions
TW202311322A (zh
Inventor
宮石由起
Original Assignee
日商昭和電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工股份有限公司 filed Critical 日商昭和電工股份有限公司
Publication of TW202311322A publication Critical patent/TW202311322A/zh
Application granted granted Critical
Publication of TWI809906B publication Critical patent/TWI809906B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Microelectronics & Electronic Packaging (AREA)
TW111120204A 2021-06-02 2022-05-31 正型感光性樹脂組成物及有機ｅｌ元件隔壁 TWI809906B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-093068 2021-06-02
JP2021093068 2021-06-02

Publications (2)

Publication Number Publication Date
TW202311322A TW202311322A (zh) 2023-03-16
TWI809906B true TWI809906B (zh) 2023-07-21

Family

ID=84323192

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111120204A TWI809906B (zh) 2021-06-02 2022-05-31 正型感光性樹脂組成物及有機ｅｌ元件隔壁

Country Status (5)

Country Link
JP (1) JPWO2022255171A1 (https=)
KR (1) KR102886027B1 (https=)
CN (1) CN117480451A (https=)
TW (1) TWI809906B (https=)
WO (1) WO2022255171A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202113483A (zh) * 2019-06-03 2021-04-01 日商昭和電工股份有限公司 正型感光性樹脂組成物及有機ｅｌ元件隔板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122533A (ja) * 1982-01-14 1983-07-21 Somar Corp 感光性材料
JP2841161B2 (ja) * 1994-01-27 1998-12-24 株式会社巴川製紙所 パターン形成用感光性樹脂組成物およびパターン形成方法
JP2001281440A (ja) 2000-04-03 2001-10-10 Nippon Zeon Co Ltd 遮光膜、その製造方法及びその用途
JP2002116536A (ja) 2000-10-06 2002-04-19 Jsr Corp 感放射線性樹脂組成物、その硬化物および素子。
JP5343664B2 (ja) 2009-03-30 2013-11-13 Ｊｓｒ株式会社 感放射線性樹脂組成物、有機ｅｌ表示素子用隔壁及び絶縁膜、並びにその形成方法
JP6684818B2 (ja) 2015-10-21 2020-04-22 昭和電工株式会社 ポジ型感光性樹脂組成物
WO2018088052A1 (ja) * 2016-11-09 2018-05-17 昭和電工株式会社 ポジ型感光性樹脂組成物及びチタンブラック分散液
TWI683182B (zh) * 2017-04-07 2020-01-21 日商昭和電工股份有限公司 感光性樹脂組成物及輻射線微影構造物之製造方法
JP6797160B2 (ja) * 2018-09-10 2020-12-09 昭和電工株式会社 感光性樹脂組成物、有機ｅｌ素子隔壁、及び有機ｅｌ素子
JP6689434B1 (ja) * 2019-02-06 2020-04-28 昭和電工株式会社 感光性樹脂組成物、有機ｅｌ素子隔壁、及び有機ｅｌ素子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202113483A (zh) * 2019-06-03 2021-04-01 日商昭和電工股份有限公司 正型感光性樹脂組成物及有機ｅｌ元件隔板

Also Published As

Publication number Publication date
KR20230162069A (ko) 2023-11-28
KR102886027B1 (ko) 2025-11-14
TW202311322A (zh) 2023-03-16
JPWO2022255171A1 (https=) 2022-12-08
CN117480451A (zh) 2024-01-30
WO2022255171A1 (ja) 2022-12-08

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