KR102886027B1 - 포지티브형 감광성 수지 조성물, 및 유기 el 소자 격벽 - Google Patents

포지티브형 감광성 수지 조성물, 및 유기 el 소자 격벽

Info

Publication number
KR102886027B1
KR102886027B1 KR1020237037008A KR20237037008A KR102886027B1 KR 102886027 B1 KR102886027 B1 KR 102886027B1 KR 1020237037008 A KR1020237037008 A KR 1020237037008A KR 20237037008 A KR20237037008 A KR 20237037008A KR 102886027 B1 KR102886027 B1 KR 102886027B1
Authority
KR
South Korea
Prior art keywords
group
acid
resin composition
photosensitive resin
positive photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237037008A
Other languages
English (en)
Korean (ko)
Other versions
KR20230162069A (ko
Inventor
유키 미야이시
Original Assignee
닛폰 포리텍쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛폰 포리텍쿠 가부시키가이샤 filed Critical 닛폰 포리텍쿠 가부시키가이샤
Publication of KR20230162069A publication Critical patent/KR20230162069A/ko
Application granted granted Critical
Publication of KR102886027B1 publication Critical patent/KR102886027B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR1020237037008A 2021-06-02 2022-05-24 포지티브형 감광성 수지 조성물, 및 유기 el 소자 격벽 Active KR102886027B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021093068 2021-06-02
JPJP-P-2021-093068 2021-06-02
PCT/JP2022/021293 WO2022255171A1 (ja) 2021-06-02 2022-05-24 ポジ型感光性樹脂組成物、及び有機ｅｌ素子隔壁

Publications (2)

Publication Number Publication Date
KR20230162069A KR20230162069A (ko) 2023-11-28
KR102886027B1 true KR102886027B1 (ko) 2025-11-14

Family

ID=84323192

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237037008A Active KR102886027B1 (ko) 2021-06-02 2022-05-24 포지티브형 감광성 수지 조성물, 및 유기 el 소자 격벽

Country Status (5)

Country Link
JP (1) JPWO2022255171A1 (https=)
KR (1) KR102886027B1 (https=)
CN (1) CN117480451A (https=)
TW (1) TWI809906B (https=)
WO (1) WO2022255171A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020246517A1 (ja) * 2019-06-03 2020-12-10 昭和電工株式会社 ポジ型感光性樹脂組成物、及び有機ｅｌ素子隔壁

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122533A (ja) * 1982-01-14 1983-07-21 Somar Corp 感光性材料
JP2841161B2 (ja) * 1994-01-27 1998-12-24 株式会社巴川製紙所 パターン形成用感光性樹脂組成物およびパターン形成方法
JP2001281440A (ja) 2000-04-03 2001-10-10 Nippon Zeon Co Ltd 遮光膜、その製造方法及びその用途
JP2002116536A (ja) 2000-10-06 2002-04-19 Jsr Corp 感放射線性樹脂組成物、その硬化物および素子。
JP5343664B2 (ja) 2009-03-30 2013-11-13 Ｊｓｒ株式会社 感放射線性樹脂組成物、有機ｅｌ表示素子用隔壁及び絶縁膜、並びにその形成方法
JP6684818B2 (ja) 2015-10-21 2020-04-22 昭和電工株式会社 ポジ型感光性樹脂組成物
WO2018088052A1 (ja) * 2016-11-09 2018-05-17 昭和電工株式会社 ポジ型感光性樹脂組成物及びチタンブラック分散液
TWI683182B (zh) * 2017-04-07 2020-01-21 日商昭和電工股份有限公司 感光性樹脂組成物及輻射線微影構造物之製造方法
JP6797160B2 (ja) * 2018-09-10 2020-12-09 昭和電工株式会社 感光性樹脂組成物、有機ｅｌ素子隔壁、及び有機ｅｌ素子
JP6689434B1 (ja) * 2019-02-06 2020-04-28 昭和電工株式会社 感光性樹脂組成物、有機ｅｌ素子隔壁、及び有機ｅｌ素子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020246517A1 (ja) * 2019-06-03 2020-12-10 昭和電工株式会社 ポジ型感光性樹脂組成物、及び有機ｅｌ素子隔壁

Also Published As

Publication number Publication date
KR20230162069A (ko) 2023-11-28
TW202311322A (zh) 2023-03-16
JPWO2022255171A1 (https=) 2022-12-08
CN117480451A (zh) 2024-01-30
WO2022255171A1 (ja) 2022-12-08
TWI809906B (zh) 2023-07-21

Similar Documents

Publication Publication Date Title
KR102832145B1 (ko) 포지티브형 감광성 수지 조성물, 및 유기 el 소자 격벽
JP2025164793A (ja) ポジ型感光性樹脂組成物、これを用いた硬化物、有機ｅｌ素子隔壁、有機ｅｌ素子絶縁膜、及び有機ｅｌ素子、並びに、硬化物の製造方法
TWI789776B (zh) 正型感光性樹脂組成物，及有機ｅｌ元件隔膜
JP7772588B2 (ja) ポジ型感光性樹脂組成物、及び有機ｅｌ素子隔壁
KR102886027B1 (ko) 포지티브형 감광성 수지 조성물, 및 유기 el 소자 격벽
JP2023049935A (ja) ポジ型感光性樹脂組成物、及び有機ｅｌ素子隔壁
KR102834230B1 (ko) 포지티브형 감광성 수지 조성물, 및 유기 el 소자 격벽
JP7828754B2 (ja) ポジ型感光性樹脂組成物、及び有機ｅｌ素子隔壁
KR102954941B1 (ko) 감광성 수지 조성물, 및 유기 el 소자 격벽
TWI821974B (zh) 感光性樹脂組成物及有機ｅｌ元件間隔壁
JP7818943B2 (ja) 感光性樹脂組成物、及び有機ｅｌ素子隔壁
JP7830588B2 (ja) ポジ型感光性樹脂組成物、有機ｅｌ素子隔壁、有機ｅｌ素子絶縁膜、及び有機ｅｌ素子
JP7828755B2 (ja) ポジ型感光性樹脂組成物、及び有機ｅｌ素子隔壁

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000