TWI807143B - 從基板固持器的密封件除去液體的方法 - Google Patents

從基板固持器的密封件除去液體的方法 Download PDF

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Publication number
TWI807143B
TWI807143B TW108144861A TW108144861A TWI807143B TW I807143 B TWI807143 B TW I807143B TW 108144861 A TW108144861 A TW 108144861A TW 108144861 A TW108144861 A TW 108144861A TW I807143 B TWI807143 B TW I807143B
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TW
Taiwan
Prior art keywords
substrate
seal
substrate holder
gap
plated
Prior art date
Application number
TW108144861A
Other languages
English (en)
Chinese (zh)
Other versions
TW202028543A (zh
Inventor
関正也
髙栁秀樹
鈴木潔
佐竹正行
藤方淳平
Original Assignee
日商荏原製作所股份有限公司
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Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202028543A publication Critical patent/TW202028543A/zh
Application granted granted Critical
Publication of TWI807143B publication Critical patent/TWI807143B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
TW108144861A 2018-12-21 2019-12-09 從基板固持器的密封件除去液體的方法 TWI807143B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-239893 2018-12-21
JP2018239893A JP7059172B2 (ja) 2018-12-21 2018-12-21 基板ホルダのシールから液体を除去するための方法

Publications (2)

Publication Number Publication Date
TW202028543A TW202028543A (zh) 2020-08-01
TWI807143B true TWI807143B (zh) 2023-07-01

Family

ID=71099187

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108144861A TWI807143B (zh) 2018-12-21 2019-12-09 從基板固持器的密封件除去液體的方法

Country Status (5)

Country Link
US (1) US11230789B2 (https=)
JP (1) JP7059172B2 (https=)
KR (1) KR20200078361A (https=)
CN (1) CN111349960B (https=)
TW (1) TWI807143B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250160227A (ko) * 2021-01-08 2025-11-11 가부시키가이샤 에바라 세이사꾸쇼 기판 홀더, 도금 장치, 도금 방법 및 기억 매체
JP6936928B1 (ja) * 2021-02-22 2021-09-22 株式会社荏原製作所 めっき装置
KR102447205B1 (ko) * 2021-05-31 2022-09-26 가부시키가이샤 에바라 세이사꾸쇼 프리웨트 모듈 및 프리웨트 방법
US12516437B2 (en) 2021-10-18 2026-01-06 Ebara Corporation Method of plating and apparatus for plating
TWI803026B (zh) * 2021-10-25 2023-05-21 日商荏原製作所股份有限公司 鍍覆方法及鍍覆裝置
CN114908403A (zh) * 2022-04-13 2022-08-16 上海戴丰科技有限公司 一种晶圆装卸挂具设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277995A (ja) * 2002-03-26 2003-10-02 Ebara Corp 基板ホルダ及びめっき装置
TW201812096A (zh) * 2013-03-26 2018-04-01 日商荏原製作所股份有限公司 鍍覆裝置
TW201817924A (zh) * 2016-11-14 2018-05-16 日商荏原製作所股份有限公司 滲漏檢查方法、滲漏檢查裝置、電解鍍覆方法、及電解鍍覆裝置
TW201821651A (zh) * 2016-12-14 2018-06-16 日商荏原製作所股份有限公司 電解鍍覆裝置

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Publication number Priority date Publication date Assignee Title
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
JP2001303295A (ja) * 2000-04-18 2001-10-31 Nec Corp メッキ装置
JP2002332597A (ja) * 2001-05-11 2002-11-22 Tokyo Electron Ltd 液処理装置及び液処理方法
JP2004083932A (ja) * 2002-08-22 2004-03-18 Ebara Corp 電解処理装置
JP4445932B2 (ja) * 2006-02-09 2010-04-07 日本ピラー工業株式会社 軸流型非接触シール
JP6116317B2 (ja) * 2013-03-28 2017-04-19 株式会社荏原製作所 めっき装置およびめっき方法
JP6018961B2 (ja) * 2013-03-26 2016-11-02 株式会社荏原製作所 めっき装置およびめっき方法
US10250097B2 (en) * 2015-04-17 2019-04-02 Harmonic Drive Systems Inc. Static pressure seal-equipped motor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277995A (ja) * 2002-03-26 2003-10-02 Ebara Corp 基板ホルダ及びめっき装置
TW201812096A (zh) * 2013-03-26 2018-04-01 日商荏原製作所股份有限公司 鍍覆裝置
TW201817924A (zh) * 2016-11-14 2018-05-16 日商荏原製作所股份有限公司 滲漏檢查方法、滲漏檢查裝置、電解鍍覆方法、及電解鍍覆裝置
TW201821651A (zh) * 2016-12-14 2018-06-16 日商荏原製作所股份有限公司 電解鍍覆裝置

Also Published As

Publication number Publication date
US20200199769A1 (en) 2020-06-25
JP2020100875A (ja) 2020-07-02
US11230789B2 (en) 2022-01-25
CN111349960A (zh) 2020-06-30
TW202028543A (zh) 2020-08-01
CN111349960B (zh) 2024-12-06
KR20200078361A (ko) 2020-07-01
JP7059172B2 (ja) 2022-04-25

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