KR20200078361A - 기판 홀더의 시일로부터 액체를 제거하기 위한 방법 - Google Patents

기판 홀더의 시일로부터 액체를 제거하기 위한 방법 Download PDF

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Publication number
KR20200078361A
KR20200078361A KR1020190168484A KR20190168484A KR20200078361A KR 20200078361 A KR20200078361 A KR 20200078361A KR 1020190168484 A KR1020190168484 A KR 1020190168484A KR 20190168484 A KR20190168484 A KR 20190168484A KR 20200078361 A KR20200078361 A KR 20200078361A
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KR
South Korea
Prior art keywords
substrate
seal
substrate holder
gas
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020190168484A
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English (en)
Korean (ko)
Inventor
마사야 세키
히데키 다카야나기
기요시 스즈키
마사유키 사타케
쥼페이 후지카타
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20200078361A publication Critical patent/KR20200078361A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H01L21/2885—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
KR1020190168484A 2018-12-21 2019-12-17 기판 홀더의 시일로부터 액체를 제거하기 위한 방법 Ceased KR20200078361A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018239893A JP7059172B2 (ja) 2018-12-21 2018-12-21 基板ホルダのシールから液体を除去するための方法
JPJP-P-2018-239893 2018-12-21

Publications (1)

Publication Number Publication Date
KR20200078361A true KR20200078361A (ko) 2020-07-01

Family

ID=71099187

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190168484A Ceased KR20200078361A (ko) 2018-12-21 2019-12-17 기판 홀더의 시일로부터 액체를 제거하기 위한 방법

Country Status (5)

Country Link
US (1) US11230789B2 (https=)
JP (1) JP7059172B2 (https=)
KR (1) KR20200078361A (https=)
CN (1) CN111349960B (https=)
TW (1) TWI807143B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102447205B1 (ko) * 2021-05-31 2022-09-26 가부시키가이샤 에바라 세이사꾸쇼 프리웨트 모듈 및 프리웨트 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250160227A (ko) * 2021-01-08 2025-11-11 가부시키가이샤 에바라 세이사꾸쇼 기판 홀더, 도금 장치, 도금 방법 및 기억 매체
JP6936928B1 (ja) * 2021-02-22 2021-09-22 株式会社荏原製作所 めっき装置
US12516437B2 (en) 2021-10-18 2026-01-06 Ebara Corporation Method of plating and apparatus for plating
TWI803026B (zh) * 2021-10-25 2023-05-21 日商荏原製作所股份有限公司 鍍覆方法及鍍覆裝置
CN114908403A (zh) * 2022-04-13 2022-08-16 上海戴丰科技有限公司 一种晶圆装卸挂具设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277995A (ja) 2002-03-26 2003-10-02 Ebara Corp 基板ホルダ及びめっき装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
JP2001303295A (ja) * 2000-04-18 2001-10-31 Nec Corp メッキ装置
JP2002332597A (ja) * 2001-05-11 2002-11-22 Tokyo Electron Ltd 液処理装置及び液処理方法
JP2004083932A (ja) * 2002-08-22 2004-03-18 Ebara Corp 電解処理装置
JP4445932B2 (ja) * 2006-02-09 2010-04-07 日本ピラー工業株式会社 軸流型非接触シール
JP6116317B2 (ja) * 2013-03-28 2017-04-19 株式会社荏原製作所 めっき装置およびめっき方法
JP6018961B2 (ja) * 2013-03-26 2016-11-02 株式会社荏原製作所 めっき装置およびめっき方法
US9388504B2 (en) * 2013-03-26 2016-07-12 Ebara Corporation Plating apparatus and plating method
US10250097B2 (en) * 2015-04-17 2019-04-02 Harmonic Drive Systems Inc. Static pressure seal-equipped motor
JP6746474B2 (ja) * 2016-11-14 2020-08-26 株式会社荏原製作所 漏れ検査方法、漏れ検査装置、電解めっき方法、および電解めっき装置
JP6709727B2 (ja) * 2016-12-14 2020-06-17 株式会社荏原製作所 電解めっき装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277995A (ja) 2002-03-26 2003-10-02 Ebara Corp 基板ホルダ及びめっき装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102447205B1 (ko) * 2021-05-31 2022-09-26 가부시키가이샤 에바라 세이사꾸쇼 프리웨트 모듈 및 프리웨트 방법

Also Published As

Publication number Publication date
US20200199769A1 (en) 2020-06-25
TWI807143B (zh) 2023-07-01
JP2020100875A (ja) 2020-07-02
US11230789B2 (en) 2022-01-25
CN111349960A (zh) 2020-06-30
TW202028543A (zh) 2020-08-01
CN111349960B (zh) 2024-12-06
JP7059172B2 (ja) 2022-04-25

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