CN111349960B - 用于将液体从基板保持件的密封件除去的方法 - Google Patents

用于将液体从基板保持件的密封件除去的方法 Download PDF

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Publication number
CN111349960B
CN111349960B CN201911293312.5A CN201911293312A CN111349960B CN 111349960 B CN111349960 B CN 111349960B CN 201911293312 A CN201911293312 A CN 201911293312A CN 111349960 B CN111349960 B CN 111349960B
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China
Prior art keywords
substrate
seal
substrate holder
plating
gap
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CN201911293312.5A
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English (en)
Chinese (zh)
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CN111349960A (zh
Inventor
关正也
高柳秀树
铃木洁
佐竹正行
藤方淳平
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Ebara Corp
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Ebara Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
CN201911293312.5A 2018-12-21 2019-12-16 用于将液体从基板保持件的密封件除去的方法 Active CN111349960B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-239893 2018-12-21
JP2018239893A JP7059172B2 (ja) 2018-12-21 2018-12-21 基板ホルダのシールから液体を除去するための方法

Publications (2)

Publication Number Publication Date
CN111349960A CN111349960A (zh) 2020-06-30
CN111349960B true CN111349960B (zh) 2024-12-06

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CN201911293312.5A Active CN111349960B (zh) 2018-12-21 2019-12-16 用于将液体从基板保持件的密封件除去的方法

Country Status (5)

Country Link
US (1) US11230789B2 (https=)
JP (1) JP7059172B2 (https=)
KR (1) KR20200078361A (https=)
CN (1) CN111349960B (https=)
TW (1) TWI807143B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250160227A (ko) * 2021-01-08 2025-11-11 가부시키가이샤 에바라 세이사꾸쇼 기판 홀더, 도금 장치, 도금 방법 및 기억 매체
JP6936928B1 (ja) * 2021-02-22 2021-09-22 株式会社荏原製作所 めっき装置
KR102447205B1 (ko) * 2021-05-31 2022-09-26 가부시키가이샤 에바라 세이사꾸쇼 프리웨트 모듈 및 프리웨트 방법
US12516437B2 (en) 2021-10-18 2026-01-06 Ebara Corporation Method of plating and apparatus for plating
TWI803026B (zh) * 2021-10-25 2023-05-21 日商荏原製作所股份有限公司 鍍覆方法及鍍覆裝置
CN114908403A (zh) * 2022-04-13 2022-08-16 上海戴丰科技有限公司 一种晶圆装卸挂具设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277995A (ja) * 2002-03-26 2003-10-02 Ebara Corp 基板ホルダ及びめっき装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
JP2001303295A (ja) * 2000-04-18 2001-10-31 Nec Corp メッキ装置
JP2002332597A (ja) * 2001-05-11 2002-11-22 Tokyo Electron Ltd 液処理装置及び液処理方法
JP2004083932A (ja) * 2002-08-22 2004-03-18 Ebara Corp 電解処理装置
JP4445932B2 (ja) * 2006-02-09 2010-04-07 日本ピラー工業株式会社 軸流型非接触シール
JP6116317B2 (ja) * 2013-03-28 2017-04-19 株式会社荏原製作所 めっき装置およびめっき方法
JP6018961B2 (ja) * 2013-03-26 2016-11-02 株式会社荏原製作所 めっき装置およびめっき方法
US9388504B2 (en) * 2013-03-26 2016-07-12 Ebara Corporation Plating apparatus and plating method
US10250097B2 (en) * 2015-04-17 2019-04-02 Harmonic Drive Systems Inc. Static pressure seal-equipped motor
JP6746474B2 (ja) * 2016-11-14 2020-08-26 株式会社荏原製作所 漏れ検査方法、漏れ検査装置、電解めっき方法、および電解めっき装置
JP6709727B2 (ja) * 2016-12-14 2020-06-17 株式会社荏原製作所 電解めっき装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277995A (ja) * 2002-03-26 2003-10-02 Ebara Corp 基板ホルダ及びめっき装置

Also Published As

Publication number Publication date
US20200199769A1 (en) 2020-06-25
TWI807143B (zh) 2023-07-01
JP2020100875A (ja) 2020-07-02
US11230789B2 (en) 2022-01-25
CN111349960A (zh) 2020-06-30
TW202028543A (zh) 2020-08-01
KR20200078361A (ko) 2020-07-01
JP7059172B2 (ja) 2022-04-25

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