TWI803537B - 半導體發光裝置、汎用安裝基板以及使用其之半導體發光裝置之製造方法 - Google Patents

半導體發光裝置、汎用安裝基板以及使用其之半導體發光裝置之製造方法 Download PDF

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Publication number
TWI803537B
TWI803537B TW107141399A TW107141399A TWI803537B TW I803537 B TWI803537 B TW I803537B TW 107141399 A TW107141399 A TW 107141399A TW 107141399 A TW107141399 A TW 107141399A TW I803537 B TWI803537 B TW I803537B
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TW
Taiwan
Prior art keywords
range
aforementioned
semiconductor light
mounting
width
Prior art date
Application number
TW107141399A
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English (en)
Chinese (zh)
Other versions
TW201929190A (zh
Inventor
及川俊広
Original Assignee
日商斯坦雷電氣股份有限公司
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Publication of TW201929190A publication Critical patent/TW201929190A/zh
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Publication of TWI803537B publication Critical patent/TWI803537B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Die Bonding (AREA)
  • Led Devices (AREA)
TW107141399A 2017-12-18 2018-11-21 半導體發光裝置、汎用安裝基板以及使用其之半導體發光裝置之製造方法 TWI803537B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017242065A JP7064324B2 (ja) 2017-12-18 2017-12-18 半導体発光装置、および、それを用いた半導体発光装置の製造方法
JP2017-242065 2017-12-18

Publications (2)

Publication Number Publication Date
TW201929190A TW201929190A (zh) 2019-07-16
TWI803537B true TWI803537B (zh) 2023-06-01

Family

ID=66984660

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107141399A TWI803537B (zh) 2017-12-18 2018-11-21 半導體發光裝置、汎用安裝基板以及使用其之半導體發光裝置之製造方法

Country Status (4)

Country Link
JP (1) JP7064324B2 (ko)
KR (1) KR102637463B1 (ko)
CN (1) CN109935672A (ko)
TW (1) TWI803537B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111863758B (zh) * 2020-06-04 2022-08-23 上海美仁半导体有限公司 一种安装基板、半导体器件和家用电器
JP7482072B2 (ja) * 2021-03-22 2024-05-13 株式会社東芝 半導体装置
WO2024034482A1 (ja) * 2022-08-10 2024-02-15 ヌヴォトンテクノロジージャパン株式会社 半導体装置、及び半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264267A (ja) * 2002-03-08 2003-09-19 Rohm Co Ltd 半導体チップを使用した半導体装置
JP2008118071A (ja) * 2006-11-08 2008-05-22 Nichia Chem Ind Ltd 実装用部品、および半導体装置
JP2008117900A (ja) * 2006-11-02 2008-05-22 Nichia Chem Ind Ltd 発光装置
JP2014022576A (ja) * 2012-07-18 2014-02-03 Nichia Chem Ind Ltd 半導体素子実装部材及び半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080042012A (ko) * 2006-11-08 2008-05-14 산요덴키가부시키가이샤 소자 탑재용 기판, 그 제조 방법, 반도체 모듈 및 휴대기기
JP5082710B2 (ja) 2007-09-19 2012-11-28 日亜化学工業株式会社 発光装置
US20120007117A1 (en) * 2010-07-08 2012-01-12 Andrews Peter S Submount for Electronic Die Attach with Controlled Voids and Methods of Attaching an Electronic Die to a Submount Including Engineered Voids
JP2012109352A (ja) 2010-11-16 2012-06-07 Stanley Electric Co Ltd 半導体発光装置及び半導体発光装置の製造方法
JP2013012567A (ja) * 2011-06-29 2013-01-17 Sanken Electric Co Ltd 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264267A (ja) * 2002-03-08 2003-09-19 Rohm Co Ltd 半導体チップを使用した半導体装置
JP2008117900A (ja) * 2006-11-02 2008-05-22 Nichia Chem Ind Ltd 発光装置
JP2008118071A (ja) * 2006-11-08 2008-05-22 Nichia Chem Ind Ltd 実装用部品、および半導体装置
JP2014022576A (ja) * 2012-07-18 2014-02-03 Nichia Chem Ind Ltd 半導体素子実装部材及び半導体装置

Also Published As

Publication number Publication date
CN109935672A (zh) 2019-06-25
JP7064324B2 (ja) 2022-05-10
JP2019110203A (ja) 2019-07-04
TW201929190A (zh) 2019-07-16
KR20190073258A (ko) 2019-06-26
KR102637463B1 (ko) 2024-02-16

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