TWI802220B - 成型模、樹脂成型裝置及樹脂成型品之製造方法 - Google Patents

成型模、樹脂成型裝置及樹脂成型品之製造方法 Download PDF

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Publication number
TWI802220B
TWI802220B TW111101350A TW111101350A TWI802220B TW I802220 B TWI802220 B TW I802220B TW 111101350 A TW111101350 A TW 111101350A TW 111101350 A TW111101350 A TW 111101350A TW I802220 B TWI802220 B TW I802220B
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TW
Taiwan
Prior art keywords
molding
resin
substrate
mold
molded
Prior art date
Application number
TW111101350A
Other languages
English (en)
Chinese (zh)
Other versions
TW202241686A (zh
Inventor
宮景孝之
吉田周平
市橋秀男
Original Assignee
日商Ｔｏｗａ股份有限公司
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Publication date
Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW202241686A publication Critical patent/TW202241686A/zh
Application granted granted Critical
Publication of TWI802220B publication Critical patent/TWI802220B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14122—Positioning or centering articles in the mould using fixed mould wall projections for centering the insert

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW111101350A 2021-04-21 2022-01-12 成型模、樹脂成型裝置及樹脂成型品之製造方法 TWI802220B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021071908A JP7447050B2 (ja) 2021-04-21 2021-04-21 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP2021-071908 2021-04-21

Publications (2)

Publication Number Publication Date
TW202241686A TW202241686A (zh) 2022-11-01
TWI802220B true TWI802220B (zh) 2023-05-11

Family

ID=83723434

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111101350A TWI802220B (zh) 2021-04-21 2022-01-12 成型模、樹脂成型裝置及樹脂成型品之製造方法

Country Status (5)

Country Link
JP (1) JP7447050B2 (ja)
KR (1) KR20230145466A (ja)
CN (1) CN117177853A (ja)
TW (1) TWI802220B (ja)
WO (1) WO2022224487A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105269744A (zh) * 2014-06-09 2016-01-27 东和株式会社 树脂封装装置及树脂封装方法
TWI604576B (zh) * 2013-03-08 2017-11-01 山田尖端科技股份有限公司 樹脂成型裝置與樹脂成型方法
TW202017091A (zh) * 2018-10-16 2020-05-01 日商Ｔｏｗａ股份有限公司 搬運裝置、樹脂成形裝置、搬運方法及樹脂成形品的製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3244519B2 (ja) 1991-08-26 2002-01-07 昭和電工株式会社 アクリル官能性メチルフルオロアルキルシルセスキオキサン化合物
JP3278309B2 (ja) * 1994-11-21 2002-04-30 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法並びに樹脂モールド用リリースフィルム
JP2000043096A (ja) 1998-07-28 2000-02-15 Sony Corp 樹脂封止装置
JP6244229B2 (ja) 2014-03-07 2017-12-06 株式会社日立製作所 荷電粒子ビーム照射システム、シンクロトロンおよびそのビーム出射方法
JP2019034445A (ja) * 2017-08-10 2019-03-07 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7102238B2 (ja) 2018-06-08 2022-07-19 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法
JP6981935B2 (ja) 2018-08-23 2021-12-17 アピックヤマダ株式会社 モールド金型及びそれを備えた樹脂モールド装置
JP7160770B2 (ja) 2019-07-22 2022-10-25 アピックヤマダ株式会社 樹脂モールド装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI604576B (zh) * 2013-03-08 2017-11-01 山田尖端科技股份有限公司 樹脂成型裝置與樹脂成型方法
CN105269744A (zh) * 2014-06-09 2016-01-27 东和株式会社 树脂封装装置及树脂封装方法
TW202017091A (zh) * 2018-10-16 2020-05-01 日商Ｔｏｗａ股份有限公司 搬運裝置、樹脂成形裝置、搬運方法及樹脂成形品的製造方法

Also Published As

Publication number Publication date
KR20230145466A (ko) 2023-10-17
JP2022166592A (ja) 2022-11-02
JP7447050B2 (ja) 2024-03-11
CN117177853A (zh) 2023-12-05
TW202241686A (zh) 2022-11-01
WO2022224487A1 (ja) 2022-10-27

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