TWI801183B - 用於清洗和表面處理的原子氧和臭氧裝置 - Google Patents

用於清洗和表面處理的原子氧和臭氧裝置 Download PDF

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Publication number
TWI801183B
TWI801183B TW111111429A TW111111429A TWI801183B TW I801183 B TWI801183 B TW I801183B TW 111111429 A TW111111429 A TW 111111429A TW 111111429 A TW111111429 A TW 111111429A TW I801183 B TWI801183 B TW I801183B
Authority
TW
Taiwan
Prior art keywords
cleaning
surface treatment
atomic oxygen
ozone device
ozone
Prior art date
Application number
TW111111429A
Other languages
English (en)
Other versions
TW202230578A (zh
Inventor
半秋 吳
艾利 達根
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW202230578A publication Critical patent/TW202230578A/zh
Application granted granted Critical
Publication of TWI801183B publication Critical patent/TWI801183B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
  • Robotics (AREA)
  • Cleaning In General (AREA)
TW111111429A 2018-09-24 2019-09-02 用於清洗和表面處理的原子氧和臭氧裝置 TWI801183B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862735594P 2018-09-24 2018-09-24
US62/735,594 2018-09-24

Publications (2)

Publication Number Publication Date
TW202230578A TW202230578A (zh) 2022-08-01
TWI801183B true TWI801183B (zh) 2023-05-01

Family

ID=69883605

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111111429A TWI801183B (zh) 2018-09-24 2019-09-02 用於清洗和表面處理的原子氧和臭氧裝置
TW108131457A TWI762813B (zh) 2018-09-24 2019-09-02 用於清洗和表面處理的原子氧和臭氧裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108131457A TWI762813B (zh) 2018-09-24 2019-09-02 用於清洗和表面處理的原子氧和臭氧裝置

Country Status (6)

Country Link
US (1) US11908679B2 (zh)
JP (2) JP7342112B2 (zh)
KR (2) KR20210047961A (zh)
CN (1) CN112703588A (zh)
TW (2) TWI801183B (zh)
WO (1) WO2020068338A1 (zh)

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* Cited by examiner, † Cited by third party
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KR20210047961A (ko) * 2018-09-24 2021-04-30 어플라이드 머티어리얼스, 인코포레이티드 세정 및 표면 처리를 위한 원자 산소 및 오존 디바이스
WO2022186775A1 (en) * 2021-03-02 2022-09-09 Agency For Science, Technology And Research A preparation chamber for cleaning and repair sapphire surface for the epitaxial growth of compound materials
US11964068B2 (en) 2021-03-12 2024-04-23 Applied Materials, Inc. Atomic oxygen and ozone cleaning device having a temperature control apparatus

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US20130160946A1 (en) * 2005-04-26 2013-06-27 Novellus Systems, Inc. Purging of porogen from uv cure chamber

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US20010012604A1 (en) * 1998-10-12 2001-08-09 Tokyo Electron Limited Single-substrate-heat-treating apparatus for semiconductor process system
US20130160946A1 (en) * 2005-04-26 2013-06-27 Novellus Systems, Inc. Purging of porogen from uv cure chamber
TW201203351A (en) * 2010-03-10 2012-01-16 Applied Materials Inc Apparatus and methods for cyclical oxidation and etching

Also Published As

Publication number Publication date
JP7342112B2 (ja) 2023-09-11
US20200098556A1 (en) 2020-03-26
KR20240033107A (ko) 2024-03-12
JP2023168332A (ja) 2023-11-24
TW202230578A (zh) 2022-08-01
TWI762813B (zh) 2022-05-01
TW202022966A (zh) 2020-06-16
JP2022502851A (ja) 2022-01-11
KR20210047961A (ko) 2021-04-30
US11908679B2 (en) 2024-02-20
CN112703588A (zh) 2021-04-23
WO2020068338A1 (en) 2020-04-02

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