TWI800658B - 晶片製造方法 - Google Patents

晶片製造方法 Download PDF

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Publication number
TWI800658B
TWI800658B TW108120944A TW108120944A TWI800658B TW I800658 B TWI800658 B TW I800658B TW 108120944 A TW108120944 A TW 108120944A TW 108120944 A TW108120944 A TW 108120944A TW I800658 B TWI800658 B TW I800658B
Authority
TW
Taiwan
Prior art keywords
wafer manufacturing
wafer
manufacturing
Prior art date
Application number
TW108120944A
Other languages
English (en)
Chinese (zh)
Other versions
TW202002057A (zh
Inventor
淀良彰
趙金艶
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202002057A publication Critical patent/TW202002057A/zh
Application granted granted Critical
Publication of TWI800658B publication Critical patent/TWI800658B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW108120944A 2018-06-20 2019-06-17 晶片製造方法 TWI800658B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018117127A JP7102065B2 (ja) 2018-06-20 2018-06-20 チップの製造方法
JP2018-117127 2018-06-20

Publications (2)

Publication Number Publication Date
TW202002057A TW202002057A (zh) 2020-01-01
TWI800658B true TWI800658B (zh) 2023-05-01

Family

ID=69096967

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108120944A TWI800658B (zh) 2018-06-20 2019-06-17 晶片製造方法

Country Status (4)

Country Link
JP (1) JP7102065B2 (enExample)
KR (1) KR102746633B1 (enExample)
CN (1) CN110690172B (enExample)
TW (1) TWI800658B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7648375B2 (ja) * 2020-12-17 2025-03-18 株式会社ディスコ ウエーハの生成装置
JP7645086B2 (ja) * 2021-01-29 2025-03-13 株式会社ディスコ 剥離装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005135964A (ja) * 2003-10-28 2005-05-26 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2014236034A (ja) * 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法
TW201600208A (zh) * 2014-05-09 2016-01-01 Disco Corp 雷射加工裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523775B2 (enExample) * 1972-07-08 1977-01-29
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP2005342760A (ja) 2004-06-03 2005-12-15 Disco Abrasive Syst Ltd レーザー加工装置
JP2007141998A (ja) * 2005-11-16 2007-06-07 Denso Corp 半導体チップの製造装置及び半導体チップの製造方法
TWI283023B (en) * 2005-12-23 2007-06-21 Advanced Semiconductor Eng Wafer level packaging process
JP2008153420A (ja) 2006-12-18 2008-07-03 Seiko Epson Corp 基材の分割方法、液滴吐出ヘッドの製造方法、半導体装置の製造方法、基板の製造方法、及び電気光学装置の製造方法
JP5791866B2 (ja) 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置
JP6154121B2 (ja) 2012-12-06 2017-06-28 リンテック株式会社 割断装置及び割断方法
JP2014199834A (ja) 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2017123400A (ja) 2016-01-07 2017-07-13 株式会社ディスコ チャックテーブル
JP6710463B2 (ja) * 2016-10-11 2020-06-17 株式会社ディスコ ウェーハの加工方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005135964A (ja) * 2003-10-28 2005-05-26 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2014236034A (ja) * 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法
TW201600208A (zh) * 2014-05-09 2016-01-01 Disco Corp 雷射加工裝置

Also Published As

Publication number Publication date
KR20190143364A (ko) 2019-12-30
JP7102065B2 (ja) 2022-07-19
CN110690172B (zh) 2024-05-14
TW202002057A (zh) 2020-01-01
JP2019220581A (ja) 2019-12-26
CN110690172A (zh) 2020-01-14
KR102746633B1 (ko) 2024-12-24

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