TWI799290B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TWI799290B
TWI799290B TW111121877A TW111121877A TWI799290B TW I799290 B TWI799290 B TW I799290B TW 111121877 A TW111121877 A TW 111121877A TW 111121877 A TW111121877 A TW 111121877A TW I799290 B TWI799290 B TW I799290B
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TW
Taiwan
Prior art keywords
substrate
cup
peripheral side
outer peripheral
aforementioned
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TW111121877A
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English (en)
Chinese (zh)
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TW202238675A (zh
Inventor
西畑広
福田昌弘
田中公一朗
甲斐亜希子
Original Assignee
日商東京威力科創股份有限公司
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Publication of TW202238675A publication Critical patent/TW202238675A/zh
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Publication of TWI799290B publication Critical patent/TWI799290B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3092—Recovery of material; Waste processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
TW111121877A 2016-08-24 2017-08-10 基板處理裝置及基板處理方法 TWI799290B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016163243A JP6778548B2 (ja) 2016-08-24 2016-08-24 基板処理装置及び基板処理方法
JP2016-163243 2016-08-24

Publications (2)

Publication Number Publication Date
TW202238675A TW202238675A (zh) 2022-10-01
TWI799290B true TWI799290B (zh) 2023-04-11

Family

ID=61303462

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111121877A TWI799290B (zh) 2016-08-24 2017-08-10 基板處理裝置及基板處理方法
TW106127060A TWI770046B (zh) 2016-08-24 2017-08-10 基板處理裝置及基板處理方法

Family Applications After (1)

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TW106127060A TWI770046B (zh) 2016-08-24 2017-08-10 基板處理裝置及基板處理方法

Country Status (3)

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JP (1) JP6778548B2 (ja)
CN (2) CN207303050U (ja)
TW (2) TWI799290B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6778548B2 (ja) * 2016-08-24 2020-11-04 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR102271566B1 (ko) * 2019-10-28 2021-07-01 세메스 주식회사 기판 처리 장치
CN111458989B (zh) * 2020-04-15 2023-05-09 Tcl华星光电技术有限公司 显影设备
JP2023140684A (ja) * 2022-03-23 2023-10-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004304138A (ja) * 2003-06-13 2004-10-28 Tokyo Electron Ltd 基板処理装置
JP2005079219A (ja) * 2003-08-29 2005-03-24 Tokyo Electron Ltd 基板処理装置
JP2014049679A (ja) * 2012-09-03 2014-03-17 Sokudo Co Ltd カップおよび基板処理装置
JP2014075575A (ja) * 2012-09-13 2014-04-24 Tokyo Electron Ltd 現像処理装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1140472A (ja) * 1997-07-17 1999-02-12 Sony Corp 基板処理装置
JP3445937B2 (ja) * 1998-06-24 2003-09-16 東京エレクトロン株式会社 多段スピン型基板処理システム
JP3573445B2 (ja) * 1998-07-31 2004-10-06 東京エレクトロン株式会社 現像装置及び洗浄装置
JP2006286835A (ja) * 2005-03-31 2006-10-19 Dainippon Screen Mfg Co Ltd 基板処理装置
EP2051285B1 (en) * 2007-10-17 2011-08-24 Ebara Corporation Substrate cleaning apparatus
JP5451515B2 (ja) * 2010-05-06 2014-03-26 東京エレクトロン株式会社 薬液供給システム、これを備える基板処理装置、およびこの基板処理装置を備える塗布現像システム
JP5762925B2 (ja) * 2010-12-28 2015-08-12 東京エレクトロン株式会社 液処理装置および液処理方法
JP5588418B2 (ja) * 2011-10-24 2014-09-10 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5645796B2 (ja) * 2011-11-21 2014-12-24 東京エレクトロン株式会社 液処理装置及び液処理方法
US20140017615A1 (en) * 2012-07-11 2014-01-16 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for resist coating and developing
KR101512560B1 (ko) * 2012-08-31 2015-04-15 가부시키가이샤 스크린 홀딩스 기판처리장치
JP5954195B2 (ja) * 2013-01-24 2016-07-20 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
CN105981139B (zh) * 2014-02-27 2018-12-21 株式会社思可林集团 基板处理装置以及基板处理方法
JP6778548B2 (ja) * 2016-08-24 2020-11-04 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004304138A (ja) * 2003-06-13 2004-10-28 Tokyo Electron Ltd 基板処理装置
JP2005079219A (ja) * 2003-08-29 2005-03-24 Tokyo Electron Ltd 基板処理装置
JP2014049679A (ja) * 2012-09-03 2014-03-17 Sokudo Co Ltd カップおよび基板処理装置
JP2014075575A (ja) * 2012-09-13 2014-04-24 Tokyo Electron Ltd 現像処理装置

Also Published As

Publication number Publication date
TW202238675A (zh) 2022-10-01
CN107785292B (zh) 2024-01-05
TW201820404A (zh) 2018-06-01
CN107785292A (zh) 2018-03-09
JP2018032696A (ja) 2018-03-01
CN207303050U (zh) 2018-05-01
TWI770046B (zh) 2022-07-11
JP6778548B2 (ja) 2020-11-04

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