TWI798321B - 焊料粒子、導電材料、焊料粒子之保管方法、導電材料之保管方法、導電材料之製造方法、連接構造體及連接構造體之製造方法 - Google Patents
焊料粒子、導電材料、焊料粒子之保管方法、導電材料之保管方法、導電材料之製造方法、連接構造體及連接構造體之製造方法 Download PDFInfo
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- TWI798321B TWI798321B TW107146366A TW107146366A TWI798321B TW I798321 B TWI798321 B TW I798321B TW 107146366 A TW107146366 A TW 107146366A TW 107146366 A TW107146366 A TW 107146366A TW I798321 B TWI798321 B TW I798321B
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- Prior art keywords
- solder
- conductive material
- mentioned
- electrode
- solder particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/226—Non-corrosive coatings; Primers applied before welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017246176 | 2017-12-22 | ||
JP2017-246176 | 2017-12-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201934704A TW201934704A (zh) | 2019-09-01 |
TWI798321B true TWI798321B (zh) | 2023-04-11 |
Family
ID=66993493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107146366A TWI798321B (zh) | 2017-12-22 | 2018-12-21 | 焊料粒子、導電材料、焊料粒子之保管方法、導電材料之保管方法、導電材料之製造方法、連接構造體及連接構造體之製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7184759B2 (ja) |
KR (1) | KR20200098485A (ja) |
CN (1) | CN111417488A (ja) |
TW (1) | TWI798321B (ja) |
WO (1) | WO2019124512A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2021009774A (ja) * | 2019-06-28 | 2021-01-28 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
JP7277289B2 (ja) * | 2019-07-03 | 2023-05-18 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
JPWO2021131905A1 (ja) * | 2019-12-27 | 2021-07-01 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201622867A (zh) * | 2014-08-29 | 2016-07-01 | Senju Metal Industry Co | 焊接材料、焊接接頭以及焊接材料之製造方法 |
TW201629987A (zh) * | 2014-12-26 | 2016-08-16 | Sekisui Chemical Co Ltd | 導電糊、連接構造體及連接構造體之製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH06155070A (ja) * | 1992-11-20 | 1994-06-03 | Hitachi Ltd | はんだペースト |
JP3996276B2 (ja) | 1998-09-22 | 2007-10-24 | ハリマ化成株式会社 | ソルダペースト及びその製造方法並びにはんだプリコート方法 |
JP3769688B2 (ja) | 2003-02-05 | 2006-04-26 | 独立行政法人科学技術振興機構 | 端子間の接続方法及び半導体装置の実装方法 |
JP5147349B2 (ja) * | 2007-10-03 | 2013-02-20 | 旭化成イーマテリアルズ株式会社 | バンプ形成用ペースト、及びバンプ構造体 |
KR101581984B1 (ko) * | 2008-09-05 | 2015-12-31 | 스미토모 베이클리트 컴퍼니 리미티드 | 도전 접속 재료 및 그것을 이용한 단자간 접속 방법 및 접속 단자의 제조 방법 |
JP5609774B2 (ja) * | 2011-05-27 | 2014-10-22 | 株式会社弘輝 | 5元系合金粒子 |
JP5912741B2 (ja) * | 2012-03-27 | 2016-04-27 | 日東電工株式会社 | 接合シート、電子部品およびその製造方法 |
JP6182877B2 (ja) * | 2013-01-28 | 2017-08-23 | 富士通株式会社 | ハンダペーストおよび導電性接着剤、その製造方法および半導体装置の製造方法 |
KR20160125344A (ko) * | 2014-02-24 | 2016-10-31 | 세키스이가가쿠 고교가부시키가이샤 | 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법 |
KR102393302B1 (ko) * | 2014-03-07 | 2022-05-03 | 세키스이가가쿠 고교가부시키가이샤 | 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법 |
WO2015186704A1 (ja) * | 2014-06-05 | 2015-12-10 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
WO2016043265A1 (ja) * | 2014-09-18 | 2016-03-24 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
WO2016071971A1 (ja) * | 2014-11-05 | 2016-05-12 | 千住金属工業株式会社 | はんだ材料、はんだペースト、フォームはんだ、はんだ継手、およびはんだ材料の管理方法 |
KR102431084B1 (ko) * | 2014-12-04 | 2022-08-11 | 세키스이가가쿠 고교가부시키가이샤 | 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법 |
WO2016140326A1 (ja) * | 2015-03-04 | 2016-09-09 | デクセリアルズ株式会社 | 導電用粒子の製造方法、異方性導電接着剤、部品の搭載方法 |
JP6677869B2 (ja) * | 2015-11-30 | 2020-04-08 | 三菱マテリアル株式会社 | はんだ粉末の製造方法 |
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2018
- 2018-12-20 KR KR1020207011611A patent/KR20200098485A/ko not_active Application Discontinuation
- 2018-12-20 WO PCT/JP2018/047055 patent/WO2019124512A1/ja active Application Filing
- 2018-12-20 CN CN201880077799.0A patent/CN111417488A/zh active Pending
- 2018-12-20 JP JP2019515675A patent/JP7184759B2/ja active Active
- 2018-12-21 TW TW107146366A patent/TWI798321B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201622867A (zh) * | 2014-08-29 | 2016-07-01 | Senju Metal Industry Co | 焊接材料、焊接接頭以及焊接材料之製造方法 |
TW201629987A (zh) * | 2014-12-26 | 2016-08-16 | Sekisui Chemical Co Ltd | 導電糊、連接構造體及連接構造體之製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN111417488A (zh) | 2020-07-14 |
JP7184759B2 (ja) | 2022-12-06 |
TW201934704A (zh) | 2019-09-01 |
WO2019124512A1 (ja) | 2019-06-27 |
KR20200098485A (ko) | 2020-08-20 |
JPWO2019124512A1 (ja) | 2020-11-19 |
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