TWI787896B - 含有鎳電鍍皮膜之鍍敷結構體及引線框架 - Google Patents

含有鎳電鍍皮膜之鍍敷結構體及引線框架 Download PDF

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Publication number
TWI787896B
TWI787896B TW110124466A TW110124466A TWI787896B TW I787896 B TWI787896 B TW I787896B TW 110124466 A TW110124466 A TW 110124466A TW 110124466 A TW110124466 A TW 110124466A TW I787896 B TWI787896 B TW I787896B
Authority
TW
Taiwan
Prior art keywords
film
plating
plating film
phosphorus
nickel
Prior art date
Application number
TW110124466A
Other languages
English (en)
Chinese (zh)
Other versions
TW202225489A (zh
Inventor
野村薫
鈴木岳彦
松岡貴文
Original Assignee
日商松田產業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商松田產業股份有限公司 filed Critical 日商松田產業股份有限公司
Publication of TW202225489A publication Critical patent/TW202225489A/zh
Application granted granted Critical
Publication of TWI787896B publication Critical patent/TWI787896B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW110124466A 2020-12-28 2021-07-02 含有鎳電鍍皮膜之鍍敷結構體及引線框架 TWI787896B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2020-218234 2020-12-28
JP2020218234A JP7061247B1 (ja) 2020-12-28 2020-12-28 ニッケル電解めっき皮膜及びめっき構造体

Publications (2)

Publication Number Publication Date
TW202225489A TW202225489A (zh) 2022-07-01
TWI787896B true TWI787896B (zh) 2022-12-21

Family

ID=81448161

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110124466A TWI787896B (zh) 2020-12-28 2021-07-02 含有鎳電鍍皮膜之鍍敷結構體及引線框架
TW110148835A TWI790062B (zh) 2020-12-28 2021-12-27 具備Ni電鍍皮膜之鍍敷結構體及含有該鍍敷結構體之引線框

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW110148835A TWI790062B (zh) 2020-12-28 2021-12-27 具備Ni電鍍皮膜之鍍敷結構體及含有該鍍敷結構體之引線框

Country Status (4)

Country Link
JP (2) JP7061247B1 (fr)
CN (1) CN116324002A (fr)
TW (2) TWI787896B (fr)
WO (1) WO2022145290A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116449063B (zh) * 2023-05-03 2024-07-16 苏州迪克微电子有限公司 一种具有镍金钯镀膜层的钯合金探针结构及其电镀方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3026485B2 (ja) * 1997-02-28 2000-03-27 日本電解株式会社 リードフレーム材とその製法
TW200530433A (en) * 2004-01-21 2005-09-16 Enthone Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
CN100405881C (zh) * 2003-03-18 2008-07-23 日本特殊陶业株式会社 接线板
CN101361181A (zh) * 2005-11-30 2009-02-04 德克萨斯仪器股份有限公司 用于半导体器件的改良湿度可靠性和增强可焊性的引线框架
CN110767644A (zh) * 2018-07-27 2020-02-07 Tdk株式会社 电子元器件封装件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57145351A (en) * 1981-03-04 1982-09-08 Hitachi Cable Ltd Lead frame for semiconductor
KR100322975B1 (ko) * 1997-02-03 2002-02-02 소네하라 다카시 리드 프레임재
US6037653A (en) * 1997-03-25 2000-03-14 Samsung Aerospace Industries, Ltd. Semiconductor lead frame having multi-layered plating layer including copper-nickel plating layer
JPH10284667A (ja) * 1997-04-04 1998-10-23 Furukawa Electric Co Ltd:The 耐食性、耐酸化性に優れる電気電子機器用部品材料、及びその製造方法
JP2000077593A (ja) * 1998-08-27 2000-03-14 Hitachi Cable Ltd 半導体用リードフレーム
CN100392850C (zh) * 2006-05-29 2008-06-04 朱冬生 一种引线框架以及具有所述引线框架的半导体器件
CN103667775B (zh) * 2013-11-27 2016-04-13 余姚市士森铜材厂 一种铜合金半导体引线框架

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3026485B2 (ja) * 1997-02-28 2000-03-27 日本電解株式会社 リードフレーム材とその製法
CN100405881C (zh) * 2003-03-18 2008-07-23 日本特殊陶业株式会社 接线板
TW200530433A (en) * 2004-01-21 2005-09-16 Enthone Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
CN101361181A (zh) * 2005-11-30 2009-02-04 德克萨斯仪器股份有限公司 用于半导体器件的改良湿度可靠性和增强可焊性的引线框架
CN110767644A (zh) * 2018-07-27 2020-02-07 Tdk株式会社 电子元器件封装件

Also Published As

Publication number Publication date
TW202225489A (zh) 2022-07-01
JP7061247B1 (ja) 2022-04-28
JPWO2022145290A1 (fr) 2022-07-07
JP2022103538A (ja) 2022-07-08
JP7096955B1 (ja) 2022-07-06
TWI790062B (zh) 2023-01-11
WO2022145290A1 (fr) 2022-07-07
CN116324002A (zh) 2023-06-23
TW202233899A (zh) 2022-09-01

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