TWI781424B - 平坦化製程、設備及物品製造方法 - Google Patents

平坦化製程、設備及物品製造方法 Download PDF

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Publication number
TWI781424B
TWI781424B TW109123908A TW109123908A TWI781424B TW I781424 B TWI781424 B TW I781424B TW 109123908 A TW109123908 A TW 109123908A TW 109123908 A TW109123908 A TW 109123908A TW I781424 B TWI781424 B TW I781424B
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TW
Taiwan
Prior art keywords
substrate
chuck
overlying layer
crack
edge
Prior art date
Application number
TW109123908A
Other languages
English (en)
Chinese (zh)
Other versions
TW202121536A (zh
Inventor
歐斯康 歐斯特
賽西 班柏格
齋藤真樹
艾莉瑞莎 埃西里
史帝文 沙克爾頓
炳鎮 崔
Original Assignee
日商佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商佳能股份有限公司 filed Critical 日商佳能股份有限公司
Publication of TW202121536A publication Critical patent/TW202121536A/zh
Application granted granted Critical
Publication of TWI781424B publication Critical patent/TWI781424B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/08—Planarisation of organic insulating materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
TW109123908A 2019-08-15 2020-07-15 平坦化製程、設備及物品製造方法 TWI781424B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/541,618 2019-08-15
US16/541,618 US11034057B2 (en) 2019-08-15 2019-08-15 Planarization process, apparatus and method of manufacturing an article

Publications (2)

Publication Number Publication Date
TW202121536A TW202121536A (zh) 2021-06-01
TWI781424B true TWI781424B (zh) 2022-10-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW109123908A TWI781424B (zh) 2019-08-15 2020-07-15 平坦化製程、設備及物品製造方法

Country Status (7)

Country Link
US (1) US11034057B2 (enExample)
EP (1) EP4014248A4 (enExample)
JP (3) JP7555967B2 (enExample)
KR (2) KR102875033B1 (enExample)
CN (1) CN114097065A (enExample)
TW (1) TWI781424B (enExample)
WO (1) WO2021030823A1 (enExample)

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US11656546B2 (en) 2020-02-27 2023-05-23 Canon Kabushiki Kaisha Exposure apparatus for uniform light intensity and methods of using the same
US11443940B2 (en) * 2020-06-24 2022-09-13 Canon Kabushiki Kaisha Apparatus for uniform light intensity and methods of using the same
JP7712111B2 (ja) * 2021-05-25 2025-07-23 株式会社ディスコ 剥離方法、ウエーハの製造方法及び剥離装置
US12282251B2 (en) 2021-09-24 2025-04-22 Canon Kabushiki Kaisha Method of shaping a surface, shaping system, and method of manufacturing an article

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US20010003668A1 (en) * 1999-12-08 2001-06-14 Kazutaka Yanagita Composite member separating method, thin film manufacturing method, and composite member separating apparatus
US9529274B2 (en) * 2009-07-02 2016-12-27 Canon Nanotechnologies, Inc. Chucking system with recessed support feature

Also Published As

Publication number Publication date
JP2024109753A (ja) 2024-08-14
JP7555967B2 (ja) 2024-09-25
CN114097065A (zh) 2022-02-25
WO2021030823A1 (en) 2021-02-18
KR20220031078A (ko) 2022-03-11
EP4014248A4 (en) 2023-08-30
US20210050218A1 (en) 2021-02-18
EP4014248A1 (en) 2022-06-22
JP2025143458A (ja) 2025-10-01
US11034057B2 (en) 2021-06-15
TW202121536A (zh) 2021-06-01
JP7713064B2 (ja) 2025-07-24
JP2022544891A (ja) 2022-10-24
KR20240095464A (ko) 2024-06-25
KR102875033B1 (ko) 2025-10-22

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