JP7555967B2 - 方法、平坦化システム、および物品の製造方法 - Google Patents

方法、平坦化システム、および物品の製造方法 Download PDF

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Publication number
JP7555967B2
JP7555967B2 JP2021568423A JP2021568423A JP7555967B2 JP 7555967 B2 JP7555967 B2 JP 7555967B2 JP 2021568423 A JP2021568423 A JP 2021568423A JP 2021568423 A JP2021568423 A JP 2021568423A JP 7555967 B2 JP7555967 B2 JP 7555967B2
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JP
Japan
Prior art keywords
superstrate
substrate
chuck
superstraight
separation
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Active
Application number
JP2021568423A
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English (en)
Japanese (ja)
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JP2022544891A5 (enExample
JP2022544891A (ja
Inventor
ウスカン ウストゥルク，
セス ジェイ バーメスバーガー，
真樹 齋藤
アリレザ アギリ，
スティーブン シー シャックレトン，
ビュン－ジン チョイ，
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of JP2022544891A publication Critical patent/JP2022544891A/ja
Publication of JP2022544891A5 publication Critical patent/JP2022544891A5/ja
Priority to JP2024082893A priority Critical patent/JP7713064B2/ja
Application granted granted Critical
Publication of JP7555967B2 publication Critical patent/JP7555967B2/ja
Priority to JP2025115172A priority patent/JP2025143458A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/08—Planarisation of organic insulating materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
JP2021568423A 2019-08-15 2020-07-17 方法、平坦化システム、および物品の製造方法 Active JP7555967B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024082893A JP7713064B2 (ja) 2019-08-15 2024-05-21 方法、平坦化システム、および物品の製造方法
JP2025115172A JP2025143458A (ja) 2019-08-15 2025-07-08 方法、平坦化システム、および物品の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/541,618 2019-08-15
US16/541,618 US11034057B2 (en) 2019-08-15 2019-08-15 Planarization process, apparatus and method of manufacturing an article
PCT/US2020/070292 WO2021030823A1 (en) 2019-08-15 2020-07-17 Planarization process, apparatus and method of manufacturing an article

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024082893A Division JP7713064B2 (ja) 2019-08-15 2024-05-21 方法、平坦化システム、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2022544891A JP2022544891A (ja) 2022-10-24
JP2022544891A5 JP2022544891A5 (enExample) 2023-04-05
JP7555967B2 true JP7555967B2 (ja) 2024-09-25

Family

ID=74567897

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2021568423A Active JP7555967B2 (ja) 2019-08-15 2020-07-17 方法、平坦化システム、および物品の製造方法
JP2024082893A Active JP7713064B2 (ja) 2019-08-15 2024-05-21 方法、平坦化システム、および物品の製造方法
JP2025115172A Pending JP2025143458A (ja) 2019-08-15 2025-07-08 方法、平坦化システム、および物品の製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024082893A Active JP7713064B2 (ja) 2019-08-15 2024-05-21 方法、平坦化システム、および物品の製造方法
JP2025115172A Pending JP2025143458A (ja) 2019-08-15 2025-07-08 方法、平坦化システム、および物品の製造方法

Country Status (7)

Country Link
US (1) US11034057B2 (enExample)
EP (1) EP4014248A4 (enExample)
JP (3) JP7555967B2 (enExample)
KR (2) KR102875033B1 (enExample)
CN (1) CN114097065A (enExample)
TW (1) TWI781424B (enExample)
WO (1) WO2021030823A1 (enExample)

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US11656546B2 (en) 2020-02-27 2023-05-23 Canon Kabushiki Kaisha Exposure apparatus for uniform light intensity and methods of using the same
US11443940B2 (en) * 2020-06-24 2022-09-13 Canon Kabushiki Kaisha Apparatus for uniform light intensity and methods of using the same
JP7712111B2 (ja) * 2021-05-25 2025-07-23 株式会社ディスコ 剥離方法、ウエーハの製造方法及び剥離装置
US12282251B2 (en) 2021-09-24 2025-04-22 Canon Kabushiki Kaisha Method of shaping a surface, shaping system, and method of manufacturing an article

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JP2020047649A (ja) 2018-09-14 2020-03-26 キヤノン株式会社 型を用いて基板上の組成物を成形する成形装置、成形方法、及び、物品製造方法
JP2020089876A (ja) 2018-12-05 2020-06-11 キヤノン株式会社 スーパーストレートおよびその使用方法

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Publication number Priority date Publication date Assignee Title
JP2000164905A (ja) 1998-09-22 2000-06-16 Canon Inc 光電変換装置の製造方法とその製造装置
JP2000348392A (ja) 1999-06-03 2000-12-15 Ricoh Co Ltd 光ディスク用スタンパの剥離方法及びその装置
JP2001230393A (ja) 1999-12-08 2001-08-24 Canon Inc 複合部材の分離方法及び薄膜の製造方法並びに複合部材の分離装置
JP2012231056A (ja) 2011-04-27 2012-11-22 Dainippon Printing Co Ltd インプリント方法およびそれを実施するためのインプリント装置
JP2014004826A (ja) 2012-05-31 2014-01-16 Fujikura Ltd パターン形成方法及び離型装置
JP2020047649A (ja) 2018-09-14 2020-03-26 キヤノン株式会社 型を用いて基板上の組成物を成形する成形装置、成形方法、及び、物品製造方法
JP2020089876A (ja) 2018-12-05 2020-06-11 キヤノン株式会社 スーパーストレートおよびその使用方法

Also Published As

Publication number Publication date
JP2024109753A (ja) 2024-08-14
CN114097065A (zh) 2022-02-25
WO2021030823A1 (en) 2021-02-18
KR20220031078A (ko) 2022-03-11
EP4014248A4 (en) 2023-08-30
US20210050218A1 (en) 2021-02-18
TWI781424B (zh) 2022-10-21
EP4014248A1 (en) 2022-06-22
JP2025143458A (ja) 2025-10-01
US11034057B2 (en) 2021-06-15
TW202121536A (zh) 2021-06-01
JP7713064B2 (ja) 2025-07-24
JP2022544891A (ja) 2022-10-24
KR20240095464A (ko) 2024-06-25
KR102875033B1 (ko) 2025-10-22

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